氮化铝对ABS复合材料导热性能的影响

利用熔融共混法制备了AlN/ABS复合材料。研究了AlN的添加量对复合材料导热性能及电性能的影响。结果表明,随AlN含量的增加,复合材料的热导率逐渐增加。而经表面处理过的AlN填充的复合材料的热导率明显提高。当AlN体积分数为15%时,复合材料的的热导率为0.56W/(m.K)。复合材料的热导率的计算模型可描述为:lnk=Φ1lnk1 Φ2lnk2 Φ3lnk3。AlN的加入几乎没有改变复合材料的电绝缘性能。     

电子封装用高导热AlN陶瓷基板研究进展

高导热AlN陶瓷是新型功率电子器件重要的基板材料,在5G通讯、微波TR组件、IGBT模块等高端电子器件领域具有广泛的应用。综述了国内外电子封装用高导热AlN陶瓷基板及其制备技术的研究进展。探讨了晶格氧、非晶层、AlN晶粒尺寸、晶界相及气孔等微结构因素对AlN陶瓷热导率的影响。提出选用高纯超细AlN粉体原料,合理选取烧结助剂的类型与添加量,优化排胶、高温烧结与热处理工艺是改善AlN陶瓷结构,实现AlN陶瓷热导率提升的有效途径。     

无压烧结高导热AlN陶瓷的研究进展

AlN以其优异的高热导率、与Si相匹配的热膨胀系数及其它优良的物理化学性能受到了国内外学术界的广泛关注,被誉为新一代高密度封装的首选基板材料.本文详细综述了AlN陶瓷的导热机理和无压烧结工艺等方面的研究进展,并介绍了烧结助剂的选取原则和AlN陶瓷热导率与温度的关系,以及展望了AlN基板的发展趋势和前景.     

高导热高绝缘FEP/AlN复合材料的研究

采用聚全氟乙丙烯(FEP)为基体,偶联处理的氮化铝(AlN)为填料,通过共混、模压等方法制备了高导热、高绝缘的FEP/AlN复合材料.结合材料导热计算模型,分析了AlN用量对材料热导率、体积电阻率、力学以及流变性能的影响.结果表明:随AlN填充量的增加,复合材料的热导率呈近线性增加,当AlN的质量分数为30%时,材料的热导率可达2.22 W/(m·K),体积电阻率可达1.5×1015 Ω·cm,并具有较好的力学性能和流变性能.     

AlN基板材料研究进展

氮化铝(AlN)以其优异的高热导率、低介电常数、与Si相匹配的热膨胀系数及其它优良的物理化学性能受到了国内外学术界和生产厂家的广泛关注，被誉为新一代高密度封装的理想基板材料。详细综述了AlN基板在导热机理、基片制备、金属化和烧结工艺方面的研究进展，展望了AlN基板的发展趋势和前景。     

无助剂AlN陶瓷的高压烧结制备及热导率

以碳热还原法生产的AlN粉体为原料,用国产六面顶压机,在5.0GPa,1 300～1 800℃,在无烧结助剂的情况下,高压烧结制备了AlN陶瓷.用X射线衍射、扫描电镜对高压烧结AlN陶瓷微观结构进行了表征.结果表明:经1 300℃烧结50 min制备的AlN陶瓷的相对密度达94.8%.经1 400℃烧结50min制备的AlN陶瓷的断裂模式为穿晶断裂.经1 800℃烧结50min制备的AlN陶瓷由单相多晶等轴晶粒组成,该样品的热导率达115.0W/(m·K).高压烧结制备的AlN陶瓷的晶格常数比AlN粉体的略有减小.高压烧结温度的提高和烧结时间的延长有助于提高AlN陶瓷的热导率.     

氮化铝陶瓷的研制及应用

氮化铝 (AlN)因具有高热导率、低介电常数、与硅相匹配的热膨胀系数及其他优良的物理特性 ,在新材料领域越来越引起人们的关注。此文主要介绍并分析了AlN粉体合成、烧结、性能结构、AlN陶瓷的应用与前景     

热处理对A1N陶瓷晶界相的影响

以Y_2O_3为烧结助剂的无压烧结AlN陶瓷,在碳还原气氛下热处理能有效地排除AlN陶瓷中的晶界相,改变晶界第二相的组成与分布,从而提高AlN陶瓷的热导率,但热处理后致密度的降低限制了热处理对热导率的改善效果。探讨了热处理对晶界第二相的影响机理,认为晶界相的还原氮化反应和高温挥发作用是热处理过程影响晶界相的主要机理。     

AlN-BN复合陶瓷的结构与性能

以碳热还原法合成的AlN粉末和市售BN粉末为原料, 利用无压烧结工艺制备AlN－BN复合陶瓷, 研究了AlN－BN复合陶瓷结构和性能的关系.结果表明: 随着BN含量的增加, 在复合陶瓷中逐渐形成卡片房式结构, 阻碍材料的收缩和致密, 复合材料的致密度下降, 热导率和硬度也随之下降, 综合考虑热导率和硬度因素, 认为利用常压烧结工艺制备可加工AlN－BN复合陶瓷时, BN质量分数在10%～15%之间是合适的, 可以制备出热导率在100～140 W·m-1·K-1, 硬度HRA在55～75之间的AlN－BN复合陶瓷.     

AIN—BN复合陶瓷的结构与性能

以碳热还原法合成的AlN粉末和市售BN粉末为原料, 利用无压烧结工艺制备AlN－BN复合陶瓷, 研究了AlN－BN复合陶瓷结构和性能的关系.结果表明: 随着BN含量的增加, 在复合陶瓷中逐渐形成卡片房式结构, 阻碍材料的收缩和致密, 复合材料的致密度下降, 热导率和硬度也随之下降, 综合考虑热导率和硬度因素, 认为利用常压烧结工艺制备可加工AlN－BN复合陶瓷时, BN质量分数在10%～15%之间是合适的, 可以制备出热导率在100～140 W·m-1·K-1, 硬度HRA在55～75之间的AlN－BN复合陶瓷.     

Enhanced Thermal Conductivity of Epoxy Composites with MWCNTs/AlN Hybrid Filler

To further improve the thermal conductivity of epoxy resin, the multi-walled carbon nanotube/aluminum nitride (MWCNTs/AlN) hybrid filler was employed to prepare thermal conductivity MWCNTs/AlN/epoxy composite by casting process, and the silane coupling reagent of γ-glycidoxy propyl trimethoxy silane(KH-560) was also used to functionalize the surface of MWCNTs and/or AlN. Results revealed that, the thermal conductivity of epoxy resin was improved remarkably with the addition of MWCNTs/AlN hybrid filler, a higher thermal conductivity of 1.04 W/mK could be achieved with 29 wt% MWCNTs/AlN hybrid filler (4 wt% MWCNTs +25 wt% AlN), about 5 times higher than that of native epoxy resin. And the epoxy composite with 29 wt% MWCNTs/AlN hybrid filler possessed better thermal conductivity and mechanical properties than those of single 5 wt% MWCNTs or 40 wt% AlN. The thermal decomposition temperature of MWCNTs/AlN/epoxy composite was increased with the addition of MWCNTs/AlN hybrid filler. For given filler loading, surface treatment of MWCNTs and/or AlN by KH-560 exhibited a positive effect on the thermal conductivity of epoxy composite.     

On the Use of Silver Plated Nano Aluminum Nitride and Silver Plated Chopped Carbon Fiber to Prepare Electrically Conductive Adhesives with High Thermal Conductivity

To satisfy the high electrical and thermal conductivity required for the development of microelectronic products, silver plated aluminum nitride (Ag/AlN) and silver plated chopped carbon fiber (Ag/CF) were added into an acrylate resin to prepare electrically conductive adhesives (ECAs) with high thermal conductivity. The Ag/AlN was prepared by subjecting AlN to an electroless silver plating using a Pb-free activation method. The Ag/AlN has good electrical and thermal conductivity compared to the AlN without treatment. When the weight fraction of Ag/AlN is 45 ωt%, the electrical conductivity of ECAs based on acrylate resin filled with Ag/AlN is 1.5 S/cm, and the thermal conductivity reaches 2.1 W/(m · K). With the addition of 3 ωt% Ag/CF as supplement filler, the electrical conductivity has a sharp increase to 17.8 S/cm because of the formation of conductive networks in the ECAs. However, the shear strength has an apparent loss, falling from 4.2 to 1.1 MPa.     

氮化铝/氧化石墨烯对环氧树脂胶黏剂导热性能的影响

使用硅烷偶联剂KH-560对氮化铝进行了表面改性,并以其为导热填料,环氧树脂为基体,制备了氮化铝/环氧树脂导热胶黏剂。采用FTIR、SEM、TG、热常数分析仪对导热胶黏剂进行了表征。结果表明:改性后硅烷偶联剂分子成功接枝在氮化铝表面。改性后,氮化铝与环氧树脂的界面粘结力增强,热稳定性和导热性均得到明显改善。当氮化铝质量为导热胶黏剂质量的70%时,改性氮化铝/环氧树脂热胶黏剂的导热系数为2.24W/(m·K),而未改性氮化铝/环氧树脂的导热系数仅为1.73W/(m·K)。为进一步提高其导热性能,制备了改性氮化铝/氧化石墨烯/环氧树脂导热胶黏剂,当改性氮化铝和氧化石墨烯的质量分数分别为50%和3%时,导热胶黏剂导热系数为3.05 W/(m·K)。     

Balancing thermal conductivity and strength of hot-pressed AlN ceramics via pre-sintering and annealing process

The heat dissipation requirements of the new generation of semiconductors are placing higher demands on the overall performance of aluminum nitride (AlN) ceramics. This has led to an increasing emphasis on AlN ceramics that combine thermal conductivity and strength. AlN ceramics are often strengthened by hot-press sintering, but their thermal conductivity is typically modest. In this study, pre-sintering and annealing processes are introduced to optimize the thermal conductivity of hot-pressed AlN ceramics to avoid the detrimental effects of oxygen impurities in the AlN lattice. The effect of the oxide layer on the surface of commercial AlN particles is investigated, including density, phase composition, microstructure, and fracture behavior. The effect of annealing on the improvement of thermal conductivity and flexural strength is also verified. Electron paramagnetic resonance (EPR) analysis is performed to examine the concentration of intercrystalline defects under various conditions. Finally, AlN ceramics with a thermal conductivity of 204 W m⁻¹ K⁻¹ and a flexural strength of 376 MPa are obtained.     

高导热AlN陶瓷烧结助剂的研究现状

在分析了陶瓷的导热机理的基础上，着重评述介绍了几种复合烧结助剂在制备高导热AIN陶瓷过程中的作用机理，对比了AIN陶瓷样品的热导率值。分析了晶界相的形成和AIN晶格的净化，从而减少了氧缺陷，提高了陶瓷材料的致密度和热导率。     

Improved thermal conductivity of ceramic-epoxy composites by constructing vertically aligned nanoflower-like AlN network

Ceramic-polymer composites with good thermal conductivity, low dielectric constant and low dielectric loss have significant applicability in microelectronics and wireless communication systems. However, traditional thermal conductivity ceramic-polymer composites – realized simply through the random dispersion of spherical or near-spherical ceramic powder fillers – cannot have both high thermal conductivity and good electrical insulation, which greatly hinders their practical application. In this study, we first used metallic Al powder corroded by ultrasonic cavitation as the aluminium source, and then prepared spherical aluminium nitride (AlN) powders with many nano petals grown on the surface using the melamine-assisted nitriding method; subsequently, the ice-template method was utilized to construct a three-dimensional (3D) AlN framework with vertical columnar holes, and finally, nanoflower-like AlN-epoxy (EP) composites were prepared by vacuum infiltration. The unique nano petal structures on the surface of AlN powder and the welding between AlN nano-petals during vacuum sintering increased the contact area between nanoflower-like AlN powders and lowered their contact thermal resistance. Moreover, the construction of vertical AlN channels was conducive to the formtion of thermally conductive pathways in AlN-epoxy composites. As a result, we obtained ceramic-polymer composites with improved thermal conductivity, among which the composites with 20 vol% nanoflower-like AlN powder had the highest thermal conductivity – 2.26 W/m·K – compared to a pure matrix, which is equivalent to an enhancement of 830%.     

Effect of oxidation on flexural strength and thermal properties of AlN ceramics with residual stress and impedance spectroscopy analysis of defects and impurities

The effect of oxidation in air on the phase composition, microstructure, flexural strength and thermal property of AlN ceramics was investigated. Oxidation was found to produce a continuous oxide layer on the surface of AlN samples. The flexural strength and thermal conductivity of AlN ceramics significantly improved after oxidation at 1000 °C and 1100 °C. Residual stress in the AlN ceramic matrix was enhanced by oxidation. The enhanced residual compressive stresses inhibited crack propagation and reduced interfacial thermal resistance, thereby improving the flexural strength and thermal conductivity of AlN ceramics. Electrochemical impedance spectroscopy was further used to analyze the defects in AlN ceramics. The increase in fitting grain resistance revealed a decrease in aluminum vacancy concentration in oxidized AlN sample, which resulted in high thermal conductivity. Therefore, oxidation at a certain temperature is pretty effective to obtain excellent performance for AlN ceramics.     

The Preparation and Cure Kinetics Researches of Thermal Conductivity Epoxy/AlN Composites

The aluminum nitride (AlN) was employed to prepare epoxy/AlN composites by blending-casting moulding method, two different coupling agents were used to functionalize the surface of AlN. The thermal conductivity and mechanical properties of the composites were investigated. And the cure kinetics of the EP/AlN composites was studied by means of isothermal DSC. Results revealed that the thermal conductivity of EP improved remarkably with the addition of AlN, a higher thermal conductivity of 1.05 W/mK can be achieved with 42 vol% AlN, about 5 times higher than that of native epoxy resin. And the flexural and impact strength of the EP/AlN composites were optimal with 3.3 vol% AlN. The curing process of the EP/AlN composites contained autocatalytic mechanism, the whole process was according with the Kamal model. The presence of AlN did not change the cure reaction mechanism, and had little effecting on the activation energy, but decreased the rate constants k_l and k₂.     

High thermal conductivity epoxy molding compound filled with a combustion synthesized AlN powder

A combustion synthesized AlN powder was studied for its feasibility as a filler for epoxy molding compound (EMC) and effects of various experimental parameters on the thermal conductivity and moisture resistance of the EMC were investigated. The AlN powder was coated with silane both to increase the moisture resistance of the EMC and to enhance the bonding between the filler AlN and the matrix resin. The thermal conductivity could be significantly increased by using AlN powders with large particle sizes and this was considered to be due to a reduction in interface area between the AlN particles and the matrix resin. A thermal conductivity of 14 W/mK was obtained when the EMC was fabricated by a process involving no use of a solvent and a AlN powder with a particle size of 35.3 μm and a filler content of 67 vol % were used. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4734–4740, 2006     

Powder injection molding of complex-shaped aluminium nitride ceramic with high thermal conductivity

Aluminum nitride (AlN) is a promising material for heat sinks and microelectronic applications because of the advantages of high theoretical thermal conductivity, high mechanical strength, good electrical insulation, low dielectric constant and low thermal expansion coefficient. However, the difficulties in shaping complex-shaped parts with a high thermal conductivity have retarded the wide applications of AlN ceramic. Herein, we design a new binder system containing resin components and adopt the powder injection molding technology to fabricate complex-shaped AlN parts. After the debinding process, the special binder system would produce residual carbon, which could react with Al₂O₃ and result in decreasing oxygen impurity and forming the yttrium-rich aluminates. The yttrium-rich aluminates can accelerate the densification of AlN ceramic and fasten the oxygen on the triangular grain boundary, leaving the clean grain boundary beneficial for high thermal conductivity. The as-prepared AlN parts with complex shape possess a high thermal conductivity of 248 W m⁻¹ K⁻¹.