溶胶-凝胶法制备Mg掺杂ZnO薄膜的微结构与光学性质

采用溶胶-凝胶技术在Si(111)和石英玻璃衬底上制备了Mg掺杂ZnO薄膜.用X射线衍射仪(XRD)、原子力显微镜(AFM)、扫描电镜(SEM)和紫外-可见(UV-Vis)分光光度计测试薄膜的微结构、表面形貌和光学性质.结果表明:所得Mg掺杂ZnO薄膜仍为六角纤锌矿型结构,呈c轴方向择优生长,随着退火温度升高,薄膜的晶格常数c由0.5288 nm减小到0.5278 nm,粗糙度从3.8 nm增大到6.5 nm,光学带隙由3.26 eV增大到3.31 eV.     

退火温度对La3Ga5SiO14薄膜结构及表面形貌的影响

采用脉冲激光沉积技术在Si(100)衬底上制备了La3Ga5SiO14薄膜,并研究了不同的退火温度对薄膜结构和表面形貌的影响.衬底温度为室温时生长的薄膜经过800 ℃以上的高温退火后,由最初的无定形态转变为无规则取向的多晶结构.衬底温度为400 ℃时生长的薄膜经过800 ℃退火处理后呈现无序的多晶形态.当退火温度进一步升高至1000 ℃时,XRD图谱显示薄膜由最初的(220)和(300)两个结晶方向转变为以(200)和(400)为主要取向的多晶结构.表面形貌分析表明:衬底温度为400 ℃时,随着退火温度的升高,薄膜颗粒尺寸逐渐增大,表面无裂纹,而衬底温度为室温时生长的薄膜退火后则出现大量的裂缝、孔洞等缺陷.     

Ge覆盖层诱导晶化多晶Si薄膜的晶化特性研究

采用电子束蒸发技术在衬底温度为180℃条件下生长具有Ge覆盖层的非晶Si薄膜,并于500℃、600℃、700℃真空退火5h.采用Raman散射、X射线衍射(XRD)、全自动数字式显微镜等对所制备薄膜的晶化特性进行研究.结果表明,Ge覆盖层具有诱导非晶Si薄膜晶化的作用,且随着退火温度的升高a-Si薄膜晶化越显著.具有Ge覆盖层非晶薄膜经500℃退火5h沿Si(400)方向开始晶化,对应晶粒尺寸约为4.9 nm.将退火温度升高到700℃时,非晶硅薄膜几乎全部晶化,晶化多晶Si薄膜在Si(400)方向表现出很强的择优取向特性,晶粒尺寸高达23.3μm.与相同条件下制备的无Ge覆盖层的非晶Si薄膜相比,晶化温度降低了300℃.     

基片温度对电子束蒸发沉积碳化硼薄膜性能的影响

在不同基片温度下,采用电子束蒸发法在Si(100)衬底上制备了碳化硼薄膜,研究了基片温度对薄膜性能的影响。采用X射线光电子能谱仪(XPS)分析了薄膜成分,薄膜的表面形貌用原子力显微镜(AFM)进行表征,采用台阶仪和椭偏测厚仪测量了薄膜厚度和折射率。结果表明基片温度对薄膜成分影响不大;随着基片温度的升高,薄膜表面粗糙度逐渐增大,均方根粗糙度由0.394 nm增至0.504 nm;而沉积速率先增大后减小,在300℃时达到最大值7.47 nm/min;其折射率由2.06渐增至2.41,表明薄膜致密性逐渐提高。     

6H-SiC衬底上多晶Si薄膜热壁CVD间隔生长与结构表征

在热壁LPCVD系统中利用间隔生长法在6H-SiC衬底上淀积Si薄膜,采用XRD、SEM、激光共聚焦显微镜和拉曼光谱对Si薄膜的表面形貌和结构进行表征.结果表明:相比于连续生长法,用间隔法制备Si薄膜的速率有所降低,但表面粗糙度有所减小,同时晶粒尺寸也增大.XRD测试结果表明:间隔法可以控制薄膜生长的择优取向.Raman光谱测试结果表明:采用间隔法且断源时间控制在30 s时,生长温度900℃,H2∶ SiH4 =400∶20 sccm时生长Si薄膜的Raman半峰宽最小.     

Al2O3衬底上生长ZnO薄膜的结构和光学特性

用脉冲激光沉积法在Al2O3(0001)衬底上沉积了ZnO薄膜.衬底温度分别为300℃、400℃、500℃、600℃和700℃.利用X射线衍射(XRD)和光致发光谱(PL)对薄膜的结构和光学性能进行研究.X射线衍射的结果表明在不同温度下生长的ZnO薄膜均具有高度c轴择优取向,衬底温度400℃时,膜的应力较小质量较高.ZnO薄膜有很强的紫外发光峰,紫外发光峰的强度与衬底温度密切相关,并发现当衬底温度从300℃增到400℃时,紫外发射峰出现6nm的蓝移.     

碳化温度对异质外延3C-SiC薄膜结晶质量及表面形貌的影响

本文以Si(100)为衬底,利用水平式常压冷壁化学气相沉积(APCVD)系统在不同温度(1100～1250℃)下制备的“缓冲层”上生长了3C-SiC薄膜.结果表明,薄膜为外延生长的单一3C-SiC多型,薄膜表面呈现“镶嵌”结构特征,Si/3C-SiC界面平整无孔洞.碳化温度对薄膜的结晶质量和表面粗糙度有显著的影响,当碳化温度低于或高于1200℃时,薄膜的结晶质量有所降低,且随着碳化温度的升高,薄膜表面粗糙度呈现增大的趋势.当在1200℃下制备的“缓冲层”上生长薄膜时,可以获得最优质量的3C-SiC外延膜,其(200)晶面摇摆曲线半峰宽约为0.34°,表面粗糙度约为5.2nm.     

Cu3N薄膜的制备及其霍尔效应研究

采用反应射频磁控溅射的方法在纯氮气气氛下、氮气流量为12sccm、衬底温度为100℃的条件下,在玻璃基底上成功制备了氮化铜(Cu3N)薄膜.XRD显示薄膜择优[100]晶向生长.用扫描电子显微镜(SEM)和原子力显微镜(AFM)观察了样品的表面形貌,发现样品表面平整、结构紧密.用四探针法检测了薄膜的霍尔特性,发现随温度的降低薄膜的霍尔系数、霍尔电阻率均增加.霍尔迁移率在高温范围也呈降低的趋势,但是变化的范围比较小,在低温范围又有所增加.随温度的降低薄膜的载流子浓度降低.我们还通过变温的霍尔系数估算了氮化铜薄膜的禁带宽度约为1.35eV.     

ECR-PECVD制备n型微晶硅薄膜的研究

用电子回旋共振等离子体增强化学气相沉积(ECR-PECVD)的方法制备了磷掺杂微晶硅薄膜材料.通过Hall,Raman光谱和XRD的测试分析,研究了衬底温度和磷烷流量对掺杂薄膜组织结构和电学性能的影响.根据AFM照片分析了薄膜的表面形貌,进而推测了薄膜的内部组成.实验发现:衬底温度在250 ℃时,磷烷的加入会大大降低薄膜的晶化率.衬底温度提高到350 ℃后这种影响明显下降.薄膜的载流子浓度和电导率受薄膜晶化率影响明显,衬底温度的升高对薄膜电学性能提高有较大帮助.     

Si和6H-SiC衬底上β-FeSi2薄膜的制备

以6H-SiC (0001) Si面和Si(100)为衬底,采用磁控溅射Fe-Si合金靶和Si靶两靶共溅射的方法,并经过后续的快速退火成功制备了β-FeSi2薄膜.通过X射线衍射(XRD)、拉曼(RAMAN)和电子扫描电镜(SEM)研究了不同衬底对薄膜生长过程的影响.结果表明:与Si衬底不同,6H-SiC为衬底所生长的FeSix薄膜与衬底之间很难产生相互扩散,导致薄膜中的Si原子主要来源于靶材.同时分析不同退火温度对6H-SiC衬底和Si衬底上的FeSix薄膜的影响,并相比较.结果表明:不同衬底Si(100)和6H-SiC (0001) Si面所生长的薄膜经900℃退火时皆完全转化为多晶β-FeSi2相,其择优取向皆为(220)/(202),且随温度从500℃到900℃的不断上升,(220)/(202)衍射峰的强度增强,半高宽变小,得到900℃下的半高宽为0.33°.     

Properties of InAs co‐doped ZnO thin films prepared by pulsed laser deposition

InAs co‐doped ZnO films were grown on sapphire substrates by pulsed laser deposition. The grown films have been characterized using X‐ray diffraction (XRD), Hall effect measurements, Atomic force microscope (AFM) and Field emission scanning electron microscope (FESEM) in order to investigate the structural, electrical, morphological and elemental properties of the films respectively. XRD analysis showed that all the films were highly orientated along the c‐axis. It was observed from Hall effect measurements that InAs co‐doped ZnO films were of n‐type conductivity. In addition, the presence of In and As has been confirmed by Energy dispersive X‐ray analysis. AFM images revealed that the surface roughness of the films was decreased upon the co‐doping. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

大气开放式MOCVD氧化镁薄膜的生长及表征

以2,4-乙酰丙酮化镁为前驱体,衬底温度为480℃,采用MOCVD工艺,分别在玻璃、氧化铝陶瓷、单晶Si(111)和Si(100)衬底上生长了取向生长的氧化镁薄膜。X射线衍射结果表明,无论是采用玻璃、氧化铝、单晶Si(111)和Si(100)衬底,氧化镁薄膜都是沿着(100)晶面取向生长。通过扫描电镜观察得到,在单晶Si(100)衬底上生长的氧化镁薄膜表面平整致密。模拟卢瑟福背散射结果显示,沉积时间超过70min时,界面处发生硅向氧化镁层少量扩散现象。     

Thickness and substrate orientation dependence of ferromagnetism in Mn doped ZnO thin films

The effect of film thickness and substrate orientation on ferromagnetism in Mn doped ZnO thin films have been studied. The Mn doped ZnO films of different thickness (15, 35 and 105 nm) have been grown on both Si (100) and Si (111) substrates. The structural, electrical, optical, elemental and magnetic properties of the films have been investigated by X‐ray diffraction (XRD), Hall Effect measurements, photoluminescence (PL), energy dispersive spectroscopy (EDS) and vibrating sample magnetometer (VSM), respectively. It is found that all the properties are strongly influenced by the film thickness and substrate orientation. The XRD analysis confirmed that the formation of high quality monophasic hexagonal wurtzite structure for all the grown films. The room temperature VSM measurements showed that the films of lower thickness have better ferromagnetism than that of the thicker films grown on both the substrates. Among the lower thickness films, the film grown on Si (111) substrate has higher saturation magnetization (291×10^‐5 emu cm^‐3) due to high density of the defects. The observed ferromagnetism has been well justified by XRD, Hall measurements and PL. The presence of Mn atoms in the film has been confirmed by EDS. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

InAs nanowire growth on oxide-masked 〈111〉 silicon

Here we investigate the growth of InAs nanowires on 〈111〉 Si substrates masked by SiO_x using metal–organic chemical vapor deposition. We study 〈111〉 (axial) and 〈1?10〉 (radial) growth of InAs NWs by varying growth duration, temperature, group-III molar flows, V/III ratio, mask material, mask opening size, and inter-wire distance. We find that growth takes place without an In droplet and the process evolves through three successive phases: nucleation of an InAs cluster, followed by two distinct nanowire growth phases. These two growth phases have different axial and radial growth rates, which originate in a transition from having In supply dominated by the open Si area in the first phase towards an In supply from the vapor/oxide mask in the second growth phase. The linear relation found between nanowire length and diameter vs. time in the last growth phase indicates that 〈111〉 growth is not surface diffusion limited as is usually the case for catalyzed growth. A high yield of vertical nanowires is obtained if group-III flow is above and V/III ratio below threshold values, in addition to having an arsenic-terminated Si surface. Furthermore, we observe that 〈111〉 and 〈1?10〉 growth is surface kinetically limited below 520 °C and 540 °C, respectively, with activation energies of 20 and 6.5 kcal/mol. This difference in activation energies limits the selectivity of the 〈111〉 to 〈1?10〉 growth to 25:1 under optimized conditions, which must be considered when fabricating axially modulated structures. However, we find that by placing wires in large arrays it is possible to completely stop the 〈1?10〉 growth rate in favor of the 〈111〉 growth rate.     

Properties of Hg1‐xCdxTe epitaxial films grown on (211)CdTe and (211)CdZnTe

Hg_1‐xCd_xTe (MCT) epitaxial films have been grown employing single crystalline substrates of CdTe and Cd_0.96Zn_0.04Te with (211)Cd and (211)Te crystalline orientations. The Isothermal Vapor Phase Epitaxy (ISOVPE) technique without Hg overpressure has been used for the epitaxial growth. Substrates and films were characterized by optical microscopy, chemical etching and x ray diffraction (Laue technique). The electrical properties were determined by Hall effect measurements. The characterization results allowed to evaluate the crystalline quality of MCT films. (© 2004 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

磁控溅射ZrN薄膜的生长机理及光学性能

利用直流反应磁控溅射法在Si衬底上沉积了高结晶质量的氮化锆(ZrN)薄膜。采用X射线衍射仪(XRD)、场发射扫描电子显微镜(FE-SEM)、原子力显微镜(AFM)和光谱椭偏仪(SE)研究了沉积时间对ZrN薄膜结构、表面形貌和光学性能的影响。结果表明:所沉积薄膜均为NaCl结构的立方相ZrN,具有(111)面单一取向;沉积时间的增加提高了薄膜的结晶质量;ZrN薄膜的表面形貌、晶粒尺寸以及表面粗糙度随沉积时间发生变化,沉积45 min的薄膜表面出现致密的三角锥晶粒,且表面粗糙度最大,薄膜呈柱状生长。随后利用Extend Structure Zone Model解释了ZrN薄膜的生长机制,最后研究了ZrN薄膜的光反射特性,发现反射光谱与晶粒形状和表面粗糙度密切相关,表面具有三角锥状晶粒的薄膜,其反射谱在300~800 nm波长范围内存在振荡现象,相比于具有不规则晶粒形貌的薄膜其反射率明显下降。本文中研究的生长条件与晶体结构、微观形貌和光学性能之间的关系,可为器件中应用的ZrN薄膜最佳制备条件的优化提供重要的参考价值。     

高掺锌/镁铌酸锂薄膜的光电性质

室温下采用射频磁控溅射(RFMS)技术在玻璃与硅基板上分别沉积了纯铌酸锂LN薄膜、高掺锌(6%,摩尔分数,下同)LN∶ZnO薄膜和高掺镁(5%)LN∶MgO薄膜,并在575 ℃条件下退火进一步提高薄膜的结晶度。通过原子力显微镜(AFM)、X射线衍射(XRD)、紫外可见吸收(UV-Vis)和椭偏仪等测试研究了三种铌酸锂薄膜的形貌、结构和光学性质。XRD分析表明掺杂铌酸锂薄膜和纯铌酸锂薄膜具有相同的生长取向,AFM、XRD、UV-Vis测试结果表明,掺杂将增大铌酸锂薄膜的晶粒尺寸,光学带隙的红移现象与晶粒尺寸相关,且掺Mg的影响大于掺Zn。此外利用霍尔效应测试仪研究了LN、LN∶ZnO和LN∶MgO薄膜的电学性质,测试结果表明三种薄膜均为n型半导体,其中LN∶MgO薄膜电导率的变化趋势不同于LN∶ZnO和LN薄膜,且发现温度在18~50 ℃范围内,随着温度的升高,LN∶MgO薄膜的电导率变化微小,而LN∶ZnO和LN薄膜的电导率逐渐增大。     

衬底温度对直流反应磁控溅射法制备的N掺杂p型ZnO薄膜性能的影响

利用直流反应磁控溅射法(纯金属锌作为靶材,Ar-N2-O2混合气体作为溅射气体)在石英玻璃衬底上制备了N掺杂p型ZnO薄膜.通过XRD、Hall和紫外可见透射谱分别研究了衬底温度对ZnO薄膜结构性能、电学性能和光学性能的影响.XRD结果显示所有制备的薄膜都具有垂直于衬底的c轴择优取向,并且随着衬底温度的增加,薄膜的晶体质量得到了提高.Hall测试表明衬底温度对p型ZnO薄膜的电阻率具有较大影响,400℃下生长的p型ZnO薄膜由于具有较高的迁移率(1.32 cm2/Vs)和载流子浓度(5.58×1017cm-3),因此表现出了最小的电阻率(8.44Ω·cm).     

Preparation and Characterization of MBE-grown Si/CaF2 Heterostructures

Growth and fabrication of silicon-on-insulator structures, based on heteroepitaxial growth of insulating films on Si, is an area of research that has rapidly developed in recent years. Thin CaF₂ films and Si/CaF₂ multilayers were prepared on {111}-oriented Si substrates by molecular beam epitaxy (MBE) and were investigated by RHEED and RBS. For epitaxial growth the Si substrates were cleaned using the ultraviolet/ozone surface cleaning method which is an effective tool to remove contaminants from the surface by low-temperature in-vacuo preheating. The growth of CaF₂ on such Si{111} substrates provides epitaxial layers with a high structural perfection. When this layer system, however, is used as a substrate for epitaxial Si growth the Si layers show always twin formation. Si layers without twins could be obtained only after deposition of thin amorphous Si buffer layers at room temperature, immediately followed by Si growth at 700 °C.     

衬底温度对共蒸发制备GaSb多晶薄膜性质的影响

采用共蒸发的方法在玻璃衬底上制备出GaSb多晶薄膜材料.研究了薄膜生长速率与衬底温度、Ga源温度和Sb源温度的关系.通过XRD、UV-Vis、Hall效应和AFM等测试方法,研究了衬底温度对于GaSb薄膜的结构特性、光电性质以及表面形貌的影响.GaSb多晶薄膜具有(111)择优取向,薄膜的吸收系数达到105 cm-1,晶粒尺寸随衬底温度升高逐渐增大;衬底温度为540℃时,薄膜的迁移率达到127 cm2/V·s,空穴浓度为3×1017 cm-3.GaSb薄膜的表面粗糙度随温度增加而增加.