5.8-GHz CMOS T/R switches with high and low substrate resistances in a 0.18-/spl mu/m CMOS process

Two single-pole, double-throw transmit/receive switches were designed and fabricated with different substrate resistances using a 0.18-/spl mu/m p/sup $/substrate CMOS process. The switch with low substrate resistances exhibits 0.8-dB insertion loss and 17-dBm P/sub 1dB/ at 5.825 GHz, whereas the switch with high substrate resistances has 1-dB insertion loss and 18-dBm P/sub 1dB/. These results suggest that the optimal insertion loss can be achieved with low substrate resistances and 5.8-GHz T/R switches with excellent insertion loss and reasonable power handling capability can be implemented in a 0.18-/spl mu/m CMOS process.     

Integrated CMOS transmit-receive switch using LC-tuned substrate bias for 2.4-GHz and 5.2-GHz applications

CMOS transmit-receive (T/R) switches have been integrated in a 0.18-/spl mu/m standard CMOS technology for wireless applications at 2.4 and 5.2 GHz. This switch design achieves low loss and high linearity by increasing the substrate impedance of a MOSFET at the frequency of operation using a properly tuned LC tank. The switch design is asymmetric to accommodate the different linearity and isolation requirements in the transmit and receive modes. In the transmit mode, the switch exhibits 1.5-dB insertion loss, 28-dBm power, 1-dB compression point (P/sub 1dB/), and 30-dB isolation, at 2.4 and 5.2 GHz. In the receive mode, the switch achieves 1.6-dB insertion loss, 11.5-dBm P/sub 1dB/, and 15-dB isolation, at 2.4 and 5.2 GHz. The linearity obtained in the transmit mode is the highest reported to date in a standard CMOS process. The switch passes the 4-kV Human Body Model electrostatic discharge test. These results show that the switch design is suitable for narrow-band applications requiring a moderate-high transmitter power level (<1 W).     

A wide-band T/R switch using enhanced compact Waffle MOSFETs

A wide-band complementary metal oxide semiconductor (CMOS)transmit/receive (T/R) switch using enhanced compact waffle metal-oxide-semiconductor field-effect transistors (MOSFETs) is presented. The compact waffle layout configuration saves much active area to give a low on-resistance. Furthermore,the low drain-to-substrate capacitance (CDB) in waffle MOSFETs can help reduce high frequency substrate coupling and substrate loss for CMOS radio frequency (RF)/microwave integrated circuits (ICs). A 2-dB higher maximum stable gain/maximum available gain (MSG/MAG)and a 2-GHz higher f/sub max/ are obtained compared with those of conventional multifinger MOSFETs. The CMOST/R switch implemented in a standard 0.35-/spl mu/m CMOS technology gives a low insertion loss of 1.7dB,high isolation of more than 40dB, larger than 15-dB return loss, 7-dBm P/sub 1 dB/ and 13-dBm input IP3 at 900MHz with a 3-V supply voltage. The switch maintains a wide-band performance up to 2.4GHz with only a slight deterioration.     

A 31.3-dBm Bulk CMOS T/R Switch Using Stacked Transistors With Sub-Design-Rule Channel Length in Floated p-Wells

A 31.3-dBm 900-MHz bulk CMOS T/R switch with transmit (TX) and receive (RX) insertion losses of 0.5 and 1.0 dB and isolation of 29 dB is demonstrated. The switch utilizes a floating-body technique, feed-forward capacitors, and 3-stack 3.3-V MOSFETs with 0.26-mum sub-design-rule (SDR) channel length. Using these, a 28-dBm 2.4-GHz T/R switch with TX and RX insertion losses of 0.8 and 1.2 dB, and isolation of 24 dB is also demonstrated. The power handling capability is limited by an abrupt output power drop before reaching the normal 1-dB compression point. The circuits are implemented in the UMC 130-nm mixed-mode triple-well CMOS process.     

Subharmonically pumped CMOS frequency conversion (up and down) circuits for 2-GHz WCDMA direct-conversion transceiver

Subharmonically pumped frequency down- and upconversion circuits are implemented in 0.18-/spl mu/m mixed-mode CMOS technology for 2-GHz direct-conversion WCDMA transceiver applications. These circuits operate in quadrature double-balanced mode and a required octet-phases (0/spl deg/, 45/spl deg/, 90/spl deg/, 135/spl deg/, 180/spl deg/, 225/spl deg/, 270/spl deg/, and 315/spl deg/) local oscillator (LO) signal comes from an active multiphases LO generator composed of a polyphase filter and active 45/spl deg/ phase shifting circuits. For linearity improvement, predistortion compensation and negative feedback schemes are used in the frequency down- and upconversion circuits, respectively. The downconverter achieves a conversion voltage gain of 20 dB (to 1-M/spl Omega/ load), 4-dBm IIP3 (18-dBm OIP3 to 50-/spl Omega/ load), 41-dBm IIP2 and 8.5-dB DSB NF at 1-MHz IF frequency, consuming 13.4 mA from 1.8-V supply, in the WCDMA Rx band (2110-2170 MHz). The upconverter, operating as two switched gain modes in the WCDMA Tx band (1920-1980 MHz), consumes 19.4 mA from 1.8-V supply and shows 14.5-dB conversion power gain, 15 -dBm OIP3 (0.5-dBm IIP3) and -11 dBm P/sub 1dB/ at maximum gain mode. At minimum gain mode, it realizes -0.3-dB conversion loss, 10.7-dBm OIP3 (11-dBm IIP3) and 0-dBm P/sub 1dB/, respectively. 3GPP WCDMA modulation tests are performed for both up- and downconversion circuits and the results are discussed in this paper.     

A 24-GHz, +14.5-dBm fully integrated power amplifier in 0.18-/spl mu/m CMOS

A 24-GHz +14.5-dBm fully integrated power amplifier with on-chip 50-/spl Omega/ input and output matching is demonstrated in 0.18-/spl mu/m CMOS. The use of substrate-shielded coplanar waveguide structures for matching networks results in low passive loss and small die size. Simple circuit techniques based on stability criteria derived result in an unconditionally stable amplifier. The power amplifier achieves a power gain of 7 dB and a maximum single-ended output power of +14.5-dBm with a 3-dB bandwidth of 3.1 GHz, while drawing 100 mA from a 2.8-V supply. The chip area is 1.26 mm/sup 2/.     

On the feasibility of CMOS multiband phase shifters for multiple-antenna transmitters

We present the design of an integrated multiband phase shifter in RF CMOS technology for phased array transmitters. The phase shifter has an embedded classical distributed amplifier for loss compensation. The phase shifter achieves a more than 180/spl deg/ phase tuning range in a 2.4-GHz band and a measured more than 360/spl deg/ phase tuning range in both 3.5-GHz and 5.8-GHz bands. The return loss is less than -10dB at all conditions. The feasibility for transmitter applications is verified through measurements. The output power at a 1-dB compression point (P/sub 1 dB/) is as high as 0.4dBmat 2.4GHz. The relative phase deviation around P/sub 1 dB/ is less than 3/spl deg/. The design is implemented in 0.18-/spl mu/mRF CMOS technology, and the chip size is 1200/spl mu/m /spl times/ 2300 /spl mu/m including pads.     

Development of multiband phase shifters in 180-nm RF CMOS technology with active loss compensation

We present the design and development of a novel integrated multiband phase shifter that has an embedded distributed amplifier for loss compensation in 0.18-/spl mu/m RF CMOS technology. The phase shifter achieves a measured 180/spl deg/ phase tuning range in a 2.4-GHz band and a measured 360/spl deg/ phase tuning range in both 3.5- and 5.8-GHz bands. The gain in the 2.4-GHz band varies from 0.14 to 6.6 dB during phase tuning. The insertion loss varies from -3.7 dB to 5.4-dB gain and -4.5 dB to 2.1-dB gain in the 3.5- and 5.8-GHz bands, respectively. The gain variation can be calibrated by adaptively tuning the bias condition of the embedded amplifier to yield a flat gain during phase tuning. The return loss is less than -10 dB at all conditions. The chip size is 1200 /spl mu/m/spl times/2300 /spl mu/m including pads.     

Design and analysis for a miniature CMOS SPDT switch using body-floating technique to improve power performance

A low insertion-loss single-pole double-throw switch in a standard 0.18-/spl mu/m complementary metal-oxide semiconductor (CMOS) process was developed for 2.4- and 5.8-GHz wireless local area network applications. In order to increase the P/sub 1dB/, the body-floating circuit topology is implemented. A nonlinear CMOS model to predict the switch power performance is also developed. The series-shunt switch achieves a measured P/sub 1dB/ of 21.3 dBm, an insertion loss of 0.7 dB, and an isolation of 35 dB at 2.4 GHz, while at 5.8 GHz, the switch attains a measured P/sub 1dB/ of 20 dBm, an insertion loss of 1.1 dB, and an isolation of 27 dB. The effective chip size is only 0.03 mm/sup 2/. The measured data agree with the simulation results well, including the power-handling capability. To our knowledge, this study presents low insertion loss, high isolation, and good power performance with the smallest chip size among the previously reported 2.4- and 5.8-GHz CMOS switches.     

SiGe bipolar transceiver circuits operating at 60 GHz

A low-noise amplifier, direct-conversion quadrature mixer, power amplifier, and voltage-controlled oscillators have been implemented in a 0.12-/spl mu/m, 200-GHz f/sub T/290-GHz f/sub MAX/ SiGe bipolar technology for operation at 60 GHz. At 61.5 GHz, the two-stage LNA achieves 4.5-dB NF, 15-dB gain, consuming 6 mA from 1.8 V. This is the first known demonstration of a silicon LNA at V-band. The downconverter consists of a preamplifier, I/Q double-balanced mixers, a frequency tripler, and a quadrature generator, and is again the first known demonstration of silicon active mixers at V-band. At 60 GHz, the downconverter gain is 18.6 dB and the NF is 13.3 dB, and the circuit consumes 55 mA from 2.7 V, while the output buffers consume an additional 52 mA. The balanced class-AB PA provides 10.8-dB gain, +11.2-dBm 1-dB compression point, 4.3% maximum PAE, and 16-dBm saturated output power. Finally, fully differential Colpitts VCOs have been implemented at 22 and 67 GHz. The 67-GHz VCO has a phase noise better than -98 dBc/Hz at 1-MHz offset, and provides a 3.1% tuning range for 8-mA current consumption from a 3-V supply.     

A low-voltage 40-GHz complementary VCO with 15% frequency tuning range in SOI CMOS technology

The design of a low-voltage 40-GHz complementary voltage-controlled oscillator (VCO) with 15% frequency tuning range fabricated in 0.13-/spl mu/m partially depleted silicon-on-insulator (SOI) CMOS technology is reported. Technological advantages of SOI over bulk CMOS are demonstrated, and the accumulation MOS (AMOS) varactor limitations on frequency tuning range are addressed. At 1.5-V supply, the VCO core and each output buffer consumes 11.25 mW and 3 mW of power, respectively. The measured phase noise at 40-GHz is -109.73 dBc/Hz at 4-MHz offset from the carrier, and the output power is -8 dBm. VCO performance using high resistivity substrate (/spl sim/300-/spl Omega//spl middot/cm) has the same frequency tuning range but 2 dB better phase noise compared with using low resistivity substrate (10 /spl Omega//spl middot/cm). The VCO occupies a chip area of only 100 /spl mu/m by 100 /spl mu/m (excluding pads).     

Signal generation, control, and frequency conversion AlGaN/GaN HEMT MMICs

We review the design and experimental results of three new AlGaN/GaN high electron-mobility transistor monolithic microwave integrated circuits: a voltage-controlled oscillator (VCO), a single-pole-double-throw switch (SPDT), and a resistive field-effect transistor mixer. The VCO exhibits frequency range between 8.5-9.5 GHz with maximum output power of 35 dBm (at V/sub ds/=30 V) across a 50-/spl Omega/ load. The L/S band SPDT switch at 0.9, 1.8, and 2.1 GHz was measured to have 0.87-, 0.96-, 1-dB insertion loss and 46-, 42-, and 41-dB isolation, respectively. The switch also shows linear performance for the power levels up to 1 W in the insertion mode. A singly ended X-band resistive mixer has exhibited very low intermodulation, less than -60 dBc for the second and third harmonics of the IF at the RF power level of 10 dBm, and high power handling, P/sub 1 dB/ is estimated to be at least 1 W, with the conversion loss of 17 dB.     

15-GHz fully integrated nMOS switches in a 0.13-/spl mu/m CMOS process

Two fully integrated nMOS switches have been demonstrated at 15 GHz in a 0.13-/spl mu/m CMOS foundry process. One incorporates on-chip LC impedance transformation networks (ITNs) while the second one does not. The switches with and without ITNs achieve the same 1.8-dB insertion loss at 15 GHz, but 21.5 and 15 dBm input P/sub 1dB/, respectively. The degradation of insertion loss due to use of ITNs is compensated by reducing the mismatch loss caused by the bond pad parasitics. The switch without ITNs is suitable for 3.1-10.6 GHz ultra-wide-band (UWB) applications. The switch with ITNs has /spl sim/5 dB worse isolation than the switch without. The difference is due to the larger transistor size of the switch with ITNs, which introduces lower parasitic impedance path between Tx/Rx ports and antenna port.     

A 5-GHz CMOS transceiver for IEEE 802.11a wireless LAN systems

A 5-GHz transceiver comprising the RF and analog circuits of an IEEE 802.11a-compliant WLAN has been integrated in a 0.25-/spl mu/m CMOS technology. The IC has 22-dBm maximum transmitted power, 8-dB overall receive-chain noise figure and -112-dBc/Hz synthesizer phase noise at 1-MHz frequency offset.     

A fully integrated SOC for 802.11b in 0.18-/spl mu/m CMOS

A fully integrated system-on-a-chip (SOC) intended for use in 802.11b applications is built in 0.18-/spl mu/m CMOS. All of the radio building blocks including the power amplifier (PA), the phase-locked loop (PLL) filter, and the antenna switch, as well as the complete baseband physical layer and the medium access control (MAC) sections, have been integrated into a single chip. The radio tuned to 2.4 GHz dissipates 165 mW in the receive mode and 360 mW in the transmit mode from a 1.8-V supply. The receiver achieves a typical noise figure of 6 dB and -88-dBm sensitivity at 11 Mb/s rate. The transmitter delivers a nominal output power of 13 dBm at the antenna. The transmitter 1-dB compression point is 18 dBm and has over 20 dB of gain range.     

6-k/spl Omega/ 43-Gb/s differential transimpedance-limiting amplifier with auto-zero feedback and high dynamic range

A high-gain, 43-Gb/s InP HBT transimpedance-limiting amplifier (TIALA) with 100-/spl mu/A/sub pp/ sensitivity and 6 mA/sub pp/ input overload current is presented. The circuit also operates as a limiting amplifier with 40-dB differential gain, better than 15-dB input return loss, and a record-breaking sensitivity of 8 mV/sub pp/ at 43 Gb/s. It features a differential TIA stage with inductive noise suppression in the feedback network and consumes less than 450mW from a single 3.3-V supply. The TIALA has 6-k/spl Omega/ (76dB/spl Omega/) differential transimpedance gain and 35-GHz bandwidth and comprises the transimpedance and limiting gain functions, an auto-zero dc feedback circuit, signal level monitor, and slicing level adjust functions. Other important features include 45-dB isolation and 800-mV/sub pp/ differential output.     

A high f/sub OSC//f/sub T/ ratio VCO in SiGe BiCMOS technology

A 37-GHz voltage controlled oscillator (VCO) fabricated in IBM's 47-GHz SiGe BiCMOS technology is presented. The VCO achieves a phase noise of -81dBc/Hz at 1-MHz offset from the carrier while delivering an output power of -30dBm to 50 /spl Omega/ buffers. Drawing 15-mA of dc current from a 3-V power supply the VCO occupies 350/spl mu/m/spl times/280/spl mu/m of silicon area. Capacitive emitter degeneration and compact layout are used to achieve high f/sub OSC//f/sub T/ ratio.     

Low-power InP-HEMT switch ICs integrating miniaturized 2/spl times/2 switches for 10-Gb/s systems

This paper presents a wideband cold-FET switch with virtually zero power dissipation. The use of InP HEMTs with a low R/sub on//spl middot/C/sub off/ product enables us to configure a DC-to-over-10-GHz single-pole double-throw (SPDT) switch without using a shunt FET. The series-FET configuration offers a logic-level-independent interface and makes possible positive control voltage operation in spite of using depletion-mode FETs. A miniaturized 2/spl times/2 switch using two SPDT switches yields an insertion loss of less than 1.16 dB and isolation of more than 21.2 dB below 10 GHz, which allows us to increase the scale of the switch in a single chip easily. The add-drop operation combining two 2/spl times/2 switches in a single chip and a 4/spl times/4 switch IC integrating four 2/spl times/2 switches are presented. The packaged ICs achieve error-free operation up to 12.5 Gb/s with either positive or negative logic-level input. Extremely fast switching of /spl sim/140 ps is also successfully demonstrated.     

A fully integrated 24-dBm CMOS power amplifier for 802.11a WLAN applications

A fully integrated 24-dBm complementary metal oxide semiconductor (CMOS) power amplifier (PA) for 5-GHz WLAN applications is implemented using 0.18-/spl mu/m CMOS foundry process. It consists of differential three-stage amplifiers and fully integrated input/output matching circuits. The amplifier shows a P/sub 1/ of 21.8 dBm, power added efficiency of 13%, and gain of 21 dB, respectively. The saturated output power is above 24.1 dBm. This shows the highest output power among the reported 5-GHz CMOS PAs as well as completely satisfying IEEE 802.11a transmitter back off requirement.     

1-Gb/s 80-dB/spl Omega/ fully differential CMOS transimpedance amplifier in multichip on oxide technology for optical interconnects

A 1-Gb/s differential transimpedance amplifier (TIA) is realized in a 0.25-/spl mu/m standard CMOS technology, incorporating the regulated cascode input configuration. The TIA chip is then integrated with a p-i-n photodiode on an oxidized phosphorous-silicon (OPS) substrate by employing the multichip-on-oxide (MCO) technology. The MCO TIA demonstrates 80-dB/spl Omega/ transimpedance gain, 670-MHz bandwidth for 1-pF photodiode capacitance, 0.54-/spl mu/A average input noise current, -17-dBm sensitivity for 10/sup -12/ bit-error rate (BER), and 27-mW power dissipation from a single 2.5-V supply. It also shows negligible switching noise effect from an embedded VCO on the OPS substrate. Furthermore, a four-channel MCO TIA array is implemented for optical interconnects, resulting in less than -40-dB crosstalk between adjacent channels.