铜、铁、铜叠片热轧复合的数值模拟

利用ABAQUS有限元软件对Cu、Fe、Cu叠片进行了轧制复合热力耦合模拟。获得了轧制复合过程的应力一应变场和温度场变化,对热轧过程有了更清晰的认识;数值模拟与试验结果吻合良好,复合板各层厚度变化误差在5%左右,可对预测产品厚度,同时对工艺的制定提供理论指导。     

Cu/Mo/Cu平面层状复合材料的研究进展

总结了Cu/Mo/Cu平面层状复合材料的特点和应用,通过平面层状结构设计,可以实现其在平面(x,y)方向更低的热膨胀系数和更高的热导率,其中热导率最高可达370W·m-1·K-1;介绍了其研究现状和制备方法,并通过对制备工艺的对比分析,指出热压复合和轧制复合是Cu/Mo/Cu层状复合材料生产工艺的发展趋势及方向.     

Cu/Mo/Cu电子封装材料中Mo的分层问题

在Cu／Mo／Cu（CMC）电子封装材料的生产中发现，通过轧制复合后的CMC在加工完成品后，经常出现Mo层的分层现象。为解决这一生产问题，将Mo坯分别在冷轧态、950℃退火态、1050℃退火态、1150℃退火态进行热轧复合，通过金相观察Mo坯的组织形貌，发现1150℃完全再结晶的Mo坯复合后成品率较其它状态要好一些，但还是不能完全解决问题。随后利用冷轧态的Mo坯，热轧复合温度由850℃提高到950℃，能够达到90％的成品率，可以满足生产要求。     

Interfacial reactions in molten Sn/Cu and molten In/Cu couples

The interfacial reactions of molten Sn and molten In with solid Cu substrate were determined by studying their reaction couples. The annealing temperature was 300 °C. The phases formed at the interface were examined by optical microscopy, scanning electron microscopy, and electron probe microscopy analysis (EPMA). The thickness of the reaction layers was measured using an image analyzer. For Cu/Sn couples, two phases, ε and η, were found. Only the Cu₁₁In₉ phase was observed at the interface of the Cu/In couples. In comparison with the results of couples of solid Sn and solid In with solid Cu substrate, their phase formation sequences were similar; however, the interfacial morphology and the reaction rates were different. For the liquid/solid couples, the reaction rate was much faster and the interface was nonplanar. A mathematic model was also proposed to describe the dissolution of the Cu substrate and the growth of the intermetallic compounds. Fast dissolution of the substrate was observed in the beginning of the reaction and was followed by a relatively slow growth of the intermetallic compounds at the interface.     

高界面结合强度铜/钼/铜叠层复合材料的制备研究

采用非平衡态的高能铜离子注入技术,对钼芯材表面进行改性并一次覆铜形成过渡铜层,将原本不固溶的的钼/铜界面转化为铜/铜界面,制得高界面结合强度的铜/钼/铜叠层复合材料;采用近终形的热等静压复合技术进行二次覆铜,结合小变形量冷轧工艺进行复合板材精整,降低各层协同变形量,保证了叠层复合材料的板形、芯层质量、表面粗糙度及平行度。本方法所制备的铜/钼/铜叠层复合材料具有界面结合强度高、板形良好、芯层质量好且平行度好的优点,可作为一种电子封装材料或热沉材料应用于电子、信息技术领域。     

退火温度对Cu/Mo/Cu轧制复合板微观组织和力学性能的影响

对Cu/Mo/Cu板材进行了单道次复合轧制,研究了退火温度对Cu/Mo/Cu复合板微观组织和力学性能的影响。结果表明:退火温度对铜板的微观组织影响较大。随着退火温度的升高,复合界面处的细小晶粒分布趋于均匀;当温度高于400℃时,铜晶粒发生再结晶长大,组织粗化。随着退火温度的升高,复合板的结合强度逐渐升高;400℃时达到最大值76 MPa;温度继续升高时,结合强度迅速下降。复合机制主要为裂口结合机制。     

表面处理方式对铜/钼/铜复合材料界面结合效果的影响

借助金相显微镜、扫描电镜观察了钼、铜界面的微观组织，研究了采用不同表面处理方式对铜／钼／铜复合材料界面结合效果的影响，并对其界面的结合机制进行了深人的讨论。结果表明，经过喷砂化学处理的材料复合后界面结合最牢固，界面剪切强度最高，达到78．9MPa，形成很强的铜和钼的机械啮合，其主要的结合机制是机械啮合机制和硬化块破裂机制；在同等复合参数条件下，3种处理方法中化学处理法的界面强度最低。     

SiCp/Cu复合材料的研究进展

SiC_p/Cu颗粒增强铜基复合材料是目前金属陶瓷复合材料的研究热点。本文简述了SiC_p/Cu颗粒增强复合材料的制备方法及优缺点,分析了影响SiC_p/Cu颗粒增强复合材料性能的主要因素,包括SiC_p颗粒含量、SiC_p颗粒尺寸及烧结工艺等方面,提出了SiC_p/Cu颗粒增强复合材料存在的问题,总结了制备方法及工艺的选择原则,并对其发展方向进行了展望。     

Characteristics and properties of Cu/nano-SiC and Cu/nano-SiC/graphite hybrid composite coatings produced by pulse electrodeposition technique

In this study, Cu/SiC and Cu/SiC/graphite nano-composite coatings were prepared by using pulse current electrodeposition technique. The effects of pulse parameters and graphite particles concentration of the bath on co-deposition of these particles were investigated. Morphology, composition, structure, microhardness, tribological behaviour and corrosion properties of Cu/SiC/graphite coatings were studied and compared to those of the substrate and Cu/SiC films. The results revealed that the optimum current density, pulse frequency and duty cycle for obtaining the highest graphite content within the coatings were 12?A?dm^?2, 15?Hz and 5%, respectively. According to X-ray diffraction results, all the coatings had face-centred cubic structure, but with different preferred orientations. While Cu/SiC coatings had higher hardness and corrosion resistance than the Cu/SiC/graphite hybrid composites, the lowest wear rate was obtained at Cu/6.8vol.-% SiC/6.7vol.-% graphite hybrid composite film.     

Interfacial IMC Layer and Tensile Properties of Ni-Reinforced Cu/Sn–0.7Cu–0.05Ni/Cu Solder Joint: Effect of Aging Temperature

Thermal aging behavior on the intermetallic compounds (IMCs) layer and mechanical properties of Cu/Sn–0.7Cu/Cu and Cu/Sn–0.7Cu–0.05Ni/Cu joints has been investigated from aging temperature of 60–180 °C for 100 h. Layer thickness increases as aging temperature rose for both the joints. Mechanical properties deteriorates with increase in aging temperature. After aging at 180 °C, any signs of ductile fracture surface with a large amount of dimples are absent. Instead, an intergranular fracture surface is obtained for both the joints, indicating that the process transformes from ductile to brittle behavior. However, brittle Cu₃Sn layer is observed between Cu₆Sn₅ layer and Cu substrate for Cu/Sn–0.7Cu/Cu joint after aging at 60 °C, while (Cu, Ni)₃Sn IMC layer is detected until aged at 140 °C for Cu/Sn–0.7Cu–0.05Ni/Cu. Compared with Cu/Sn–0.7Cu/Cu joint, the interfacial morphology directly changes from scallop-shaped into layer-shaped structure with lower Gibbs free energy, and the layer thickness is obviously suppressed after addition of Ni particle. Excellent mechanical properties, including UTS, elongation, and hardness, are obtained for Cu/Sn–0.7Cu–0.05Ni/Cu because of the slight increase in layer thickness and dense layer-shaped interfacial morphology. Thermal aging reliability is enhanced for the Cu/Sn–0.7Cu–0.05Ni/Cu solder joint after doping with 0.05 wt% Ni particle.