High‐efficiency solar cells on phosphorus gettered multicrystalline silicon substrates

Measurements of the dislocation density are compared with locally resolved measurements of carrier lifetime for p‐type multicrystalline silicon. A correlation between dislocation density and carrier recombination was found: high carrier lifetimes (>100 µs) were only measured in areas with low dislocation density (<10⁵ cm⁻²), in areas of high dislocation density (>10⁶ cm⁻²) relatively low lifetimes (<20 µs) were observed. In order to remove mobile impurities from the silicon, a phosphorus diffusion gettering process was applied. An increase of the carrier lifetime by about a factor of three was observed in lowly dislocated regions whereas in highly dislocated areas no gettering efficiency was observed. To test the effectiveness of the gettering in a solar cell manufacturing process, five different multicrystalline silicon materials from four manufacturers were phosphorus gettered. Base resistivity varied between 0·5 and 5 Ω cm for the boron‐ and gallium‐doped p‐type wafers which were used in this study. The high‐efficiency solar cell structure, which has led to the highest conversion efficiencies of multicrystalline silicon solar cells to date, was used to fabricate numerous solar cells with aperture areas of 1 and 4 cm². Efficiencies in the 20% range were achieved for all materials with an average value of 18%. Best efficiencies for 1 cm² (20·3%) and 4 cm² (19·8%) cells were achieved on 0·6 and 1·5 Ω cm, respectively. This proves that multicrystalline silicon of very different material specification can yield very high efficiencies if an appropriate cell process is applied. Copyright © 2006 John Wiley & Sons, Ltd.     

Impact of phosphorus gettering parameters and initial iron level on silicon solar cell properties

We have studied experimentally the effect of different initial iron contamination levels on the electrical device properties of p‐type Czochralski‐silicon solar cells. By systematically varying phosphorus diffusion gettering (PDG) parameters, we demonstrate a strong correlation between the open‐circuit voltage (V_oc) and the gettering efficiency. Similar correlation is also obtained for the short‐circuit current (J_sc), but phosphorus dependency somewhat complicates the interpretation: the higher the phosphorus content not only the better the gettering efficiency but also the stronger the emitter recombination. With initial bulk iron concentration as high as 2 × 10¹⁴ cm⁻³, conversion efficiencies comparable with non‐contaminated cells were obtained, which demonstrates the enormous potential of PDG. The results also clearly reveal the importance of well‐designed PDG: to achieve best results, the gettering parameters used for high purity silicon should be chosen differently as compared with for a material with high impurity content. Finally we discuss the possibility of achieving efficient gettering without deteriorating the emitter performance by combining a selective emitter with a PDG treatment. Copyright © 2012 John Wiley & Sons, Ltd.     

Large area tunnel oxide passivated rear contact n‐type Si solar cells with 21.2% efficiency

This paper reports on the implementation of carrier‐selective tunnel oxide passivated rear contact for high‐efficiency screen‐printed large area n‐type front junction crystalline Si solar cells. It is shown that the tunnel oxide grown in nitric acid at room temperature (25°C) and capped with n⁺ polysilicon layer provides excellent rear contact passivation with implied open‐circuit voltage iV_oc of 714 mV and saturation current density J_0b′ of 10.3 fA/cm² for the back surface field region. The durability of this passivation scheme is also investigated for a back‐end high temperature process. In combination with an ion‐implanted Al₂O₃‐passivated boron emitter and screen‐printed front metal grids, this passivated rear contact enabled 21.2% efficient front junction Si solar cells on 239 cm² commercial grade n‐type Czochralski wafers. Copyright © 2016 John Wiley & Sons, Ltd.     

Highly‐efficient Cd‐free CuInS2 thin‐film solar cells and mini‐modules with Zn(S,O) buffer layers prepared by an alternative chemical bath process

Recent progress in fabricating Cd‐ and Se‐free wide‐gap chalcopyrite thin‐film solar devices with Zn(S,O) buffer layers prepared by an alternative chemical bath process (CBD) using thiourea as complexing agent is discussed. Zn(S,O) has a larger band gap (E_g = 3·6–3·8 eV) than the conventional buffer material CdS (E_g = 2·4 eV) currently used in chalcopyrite‐based thin films solar cells. Thus, Zn(S,O) is a potential alternative buffer material, which already results in Cd‐free solar cell devices with increased spectral response in the blue wavelength region if low‐gap chalcopyrites are used. Suitable conditions for reproducible deposition of good‐quality Zn(S,O) thin films on wide‐gap CuInS₂ (‘CIS’) absorbers have been identified for an alternative, low‐temperature chemical route. The thickness of the different Zn(S,O) buffers and the coverage of the CIS absorber by those layers as well as their surface composition were controlled by scanning electron microscopy, X‐ray photoelectron spectroscopy, and X‐ray excited Auger electron spectroscopy. The minimum thickness required for a complete coverage of the rough CIS absorber by a Zn(S,O) layer deposited by this CBD process was estimated to ∼15 nm. The high transparency of this Zn(S,O) buffer layer in the short‐wavelength region leads to an increase of ∼1 mA/cm² in the short‐circuit current density of corresponding CIS‐based solar cells. Active area efficiencies exceeding 11·0% (total area: 10·4%) have been achieved for the first time, with an open circuit voltage of 700·4 mV, a fill factor of 65·8% and a short‐circuit current density of 24·5 mA/cm² (total area: 22·5 mA/cm²). These results are comparable to the performance of CdS buffered reference cells. First integrated series interconnected mini‐modules on 5 × 5 cm² substrates have been prepared and already reach an efficiency (active area: 17·2 cm²) of above 8%. Copyright © 2006 John Wiley & Sons, Ltd.     

Obtaining a higher Voc in HIT cells

We have achieved a very high conversion efficiency of 21·5% in HIT cells with a size of 100·3 cm². One of the most striking features of the HIT cell is its high open‐circuit voltage V_oc, in excess of 710 mV. This is due to the excellent surface passivation at the a‐Si/c‐Si heterointerface realized by Sanyo's successful technologies for fabricating high‐quality a‐Si films and solar cells with low plasma damage processes. We have studied ways to treat the surface to produce a good interface throughout our fabrication processes. We have also investigated the deposition conditions of a‐Si layers for optimizing the barrier height for the minority carriers in the heterojunction. Our approach for obtaining HIT cells with a high V_oc is reviewed here. Copyright © 2005 John Wiley & Sons, Ltd.     

Performance improvement of c-Si solar cell by a combination of SiNx/SiOx passivation and double P-diffusion gettering treatment

SiN_x/SiO_x passivation and double side P-diffusion gettering treatment have been used for the fabrication of c-Si solar cells. The solar cells fabricated have high open circuit voltage and short circuit current after the double P-diffusion treatment. In addition to better surface passivation effect, SiN_x/SiO_x layer has lower reflectivity in long wavelength range than conventional SiN_x film. As a consequence, such solar cells exhibit higher conversion efficiency and better internal quantum efficiency, compared with conventional c-Si solar cells.     

Simulation and fabrication of heterojunction silicon solar cells from numerical computer and hot‐wire CVD

In this paper, we will present a Pc1D numerical simulation for heterojunction (HJ) silicon solar cells, and discuss their possibilities and limitations. By means of modeling and numerical computer simulation, the influence of emitter‐layer/intrinsic‐layer/crystalline‐Si heterostructures with different thickness and crystallinity on the solar cell performance is investigated and compared with hot wire chemical vapor deposition (HWCVD) experimental results. A new technique for characterization of n‐type microcrystalline silicon (n‐µc‐Si)/intrinsic amorphous silicon (i‐a‐Si)/crystalline silicon (c‐Si) heterojunction solar cells from Pc1D is developed. Results of numerical modeling as well as experimental data obtained using HWCVD on µc‐Si (n)/a‐Si (i)/c‐Si (p) heterojunction are presented. This work improves the understanding of HJ solar cells to derive arguments for design optimization. Some simulated parameters of solar cells were obtained: the best results for J_sc = 39·4 mA/cm², V_oc = 0·64 V, FF = 83%, and η = 21% have been achieved. After optimizing the deposition parameters of the n‐layer and the H₂ pretreatment of solar cell, the single‐side HJ solar cells with J_sc = 34·6 mA/cm², V_oc = 0·615 V, FF = 71%, and an efficiency of 15·2% have been achieved. The double‐side HJ solar cell with J_sc = 34·8 mA/cm², V_oc = 0·645 V, FF = 73%, and an efficiency of 16·4% has been fabricated. Copyright © 2009 John Wiley & Sons, Ltd.     

A masked process for the industrial production of buried contact solar cells on multi‐crystalline silicon

This paper reports on the development of a masked process for the production of buried contact solar cells on multi‐crystalline silicon. The process results in high efficiencies, and only includes steps that would be feasible in an industrial environment. We report here on different mask candidates and on the importance of hydrogenation with the new process. Using the developed process, we produced 111 large area (12 × 12 cm²) cells and achieved an average cell efficiency of 16·2%. The best cell had an efficiency of 16·9%, a V_oc of 616 mV, a J_sc of 35·0 mA/cm² and a fill factor of 78·3%. Copyright © 2008 John Wiley & Sons, Ltd.     

20.0% Efficiency Si Nano/Microstructures Based Solar Cells with Excellent Broadband Spectral Response

Spectral response of solar cells determines the output performance of the devices. In this work, a 20.0% efficient silicon (Si) nano/microstructures (N/M‐Strus) based solar cell with a standard solar wafer size of 156 × 156 mm² (pseudo‐square) has been successfully fabricated, by employing the simultaneous stack SiO₂/SiN_x passivation for the front N/M‐Strus based n⁺‐emitter and the rear surface. The key to success lies in the excellent broadband spectral responses combining the improved short‐wavelength response of the stack SiO₂/SiN_x passivated Si N/M‐Strus based n⁺‐emitter with the extraordinary long‐wavelength response of the stack SiO₂/SiN_x passivated rear reflector. Benefiting from the broadband spectral response, the highest open‐circuit voltage (V_oc) and short‐circuit current density (J_sc) reach up to 0.653 V and 39.0 mA cm^?2, respectively. This high‐performance screen‐printed Si N/M‐Strus based solar cell has shown a very promising way to the commercial mass production of the Si based high‐efficient solar cells.     

Effect of carbon containing SiNx antireflection coating on the screen‐printed contact and low illumination performance of silicon solar cell

Screen‐printed metal contact formation through a carbon containing antireflection coating was investigated for silicon solar cells by fabricating conventional carbon‐free SiN_x and carbon‐rich SiC_xN_y film. An appreciable difference was found in the average shunt resistance (R_sh), which was about an order of magnitude higher for SiC_xN_y‐coated solar cells relative to the counterpart SiN_x‐coated solar cells. Series resistance (R_s) and fill factor (FF) were comparable for both antireflection coatings but the starting efficiency of SiC_xN_y‐coated cell was ~0·2% lower because of slightly inferior surface passivation. However, SiC_xN_y‐coated solar cells showed less degradation under lower illumination (<1000 W/m²) compared with the SiN_x‐coated cells due to reduced FF degradation under low illumination. Theoretical calculations in this paper support that this is a direct result of high R_sh. Detailed photovoltaic system and cost modeling is performed to quantify the enhanced energy production and the reduced levelized cost of electricity due to higher shunt resistance of the SiC_xN_y‐coated cells. It is shown that R_sh value below 30 Ω (7000 Ω cm² for 239 cm² cell) can lead to appreciable loss in energy production in regions of low solar insolation. Copyright © 2011 John Wiley & Sons, Ltd.     

Front and rear silicon‐nitride‐passivated multicrystalline silicon solar cells with an efficiency of 18.1%

A solar cell process designed to utilise low‐temperature plasma‐enhanced chemical vapour deposited (PECVD) silicon nitride (SiN_x) films as front and rear surface passivation was applied to fabricate multicrystalline silicon (mc‐Si) solar cells. Despite the simple photolithography‐free processing sequence, an independently confirmed efficiency of 18.1% (cell area 2 × 2 cm²) was achieved. This excellent efficiency can be predominantly attributed to the superior quality of the rear surface passivation scheme consisting of an SiN_x film in combination with a local aluminium back‐surface field (LBSF). Thus, it is demonstrated that low‐temperature PECVD SiN_x films are well suited to achieve excellent rear surface passivation on mc‐Si. Copyright © 2002 John Wiley & Sons, Ltd.     

Laser ablation of SiO2 for locally contacted Si solar cells with ultra‐short pulses

We apply ultra‐short pulse laser ablation to create local contact openings in thermally grown passivating SiO₂ layers. This technique can be used for locally contacting oxide passivated Si solar cells. We use an industrially feasible laser with a pulse duration of τ_pulse ∼ 10 ps. The specific contact resistance that we reach with evaporated aluminium on a 100 Ω/sq and P‐diffused emitter is in the range of 0·3–1 mΩ cm². Ultra‐short pulse laser ablation is sufficiently damage free to abandon wet chemical etching after ablation. We measure an emitter saturation current density of J_0e = (6·2 ± 1·6) × 10⁻¹³ A/cm² on the laser‐treated areas after a selective emitter diffusion with R_sheet ∼ 20 Ω/sq into the ablated area; a value that is as low as that of reference samples that have the SiO₂ layer removed by HF‐etching. Thus, laser ablation of dielectrics with pulse durations of about 10 ps is well suited to fabricate high‐efficiency Si solar cells. Copyright © 2007 John Wiley & Sons, Ltd.     

High voltage photovoltaic mini‐modules

This work describes the design, simulation, fabrication process, and characterization of high voltage photovoltaic mini‐modules using silicon on insulator (SOI) wafers. The mini‐modules are made of a number of small area photovoltaic cells (<1 mm²) monolithically connected in series. Isolation between cells is performed by means of anisotropic etching of the active layer of the SOI wafer. Measurements using standard sunlight (AM1·5 100 mW/cm²) confirm the viability of this technology to fabricate small area arrays showing open circuit voltages, V _oc, between 620 mV and 660 mV and photocurrent densities up to 22·3 mA/cm² for single cells of 0·225 mm² area and 10 µm active film thickness. Series connection scales up V _oc and the maximum power, P _m, from 625 mV and 21·2 µW, respectively, in a single cell to 103 V and 3·2 mW when 169 cells are connected in series in a 0·42 cm² module total area. Copyright © 2008 John Wiley & Sons, Ltd.     

Understanding of the annealing temperature impact on ion implanted bifacial n‐type solar cells to reach 20.3% efficiency

Ion implantation has the advantage of being a unidirectional doping technique. Unlike gaseous diffusion, this characteristic highlights strong possibilities to simplify solar cell process flows. The use of ion implantation doping for n‐type PERT bifacial solar cells is a promising process, but mainly if it goes with a unique co‐annealing step to activate both dopants and to grow a SiO₂ passivation layer. To develop this process and our SONIA cells, we studied the impact of the annealing temperature and that of the passivation layers on the electrical quality of the implanted B‐emitter and P‐BSF. A high annealing temperature (above 1000 °C) was necessary to fully activate the boron atoms and to anneal the implantation damages. Low J_0BSF (BSF contribution to the saturation current density) of 180 fA/cm² was reached at this high temperature with the best SiO₂ passivation layer. An average efficiency of 19.7% was reached using this simplified process flow (“co‐anneal process”) on large area (239 cm²) Cz solar cells. The efficiency was limited by a low FF, probably due to contaminations by metallization pastes. Improved performances were achieved in the case of a “separated anneals” process where the P‐BSF is activated at a lower temperature range. An average efficiency of 20.2% was obtained in this case, with a 20.3% certified cell. Copyright © 2014 John Wiley & Sons, Ltd.     

19%‐efficient and 43 µm‐thick crystalline Si solar cell from layer transfer using porous silicon

We present a both‐sides‐contacted thin‐film crystalline silicon (c‐Si) solar cell with a confirmed AM1.5 efficiency of 19.1% using the porous silicon layer transfer process. The aperture area of the cell is 3.98 cm². This is the highest efficiency ever reported for transferred Si cells. The efficiency improvement over the prior state of the art (16.9%) is achieved by implementing recent developments for Si wafer cells such as surface passivation with aluminum oxide and laser ablation for contacting. The cell has a short‐circuit current density of 37.8 mA cm⁻², an open‐circuit voltage of 650 mV, and a fill factor of 77.6%. Copyright © 2011 John Wiley & Sons, Ltd.     

High efficiency large area n‐type front junction silicon solar cells with boron emitter formed by screen printing technology

In this paper, we report on commercially viable screen printing (SP) technology to form boron emitters. A screen‐printed boron emitter and ion‐implanted phosphorus back surface field were formed simultaneously by a co‐annealing process. Front and back surfaces were passivated by chemically grown oxide capped with plasma‐enhanced chemical vapor deposition silicon nitride stack. Front and back contacts were formed by traditional SP and firing processes with silver/aluminum grid on front and local silver back contacts on the rear. This resulted in 19.6% efficient large area (239 cm²) n‐type solar cells with an open‐circuit voltage V_oc of 645 mV, short‐circuit current density J_sc of 38.6 mA/cm², and fill factor of 78.6%. This demonstrates the potential of this novel technology for production of low‐cost high‐efficiency n‐type silicon solar cells. Copyright © 2014 John Wiley & Sons, Ltd.     

Development of Nano‐TiO2 dye sensitised solar cells on high mobility transparent conducting oxide thin films

The optical transmission of dye‐sensitised solar cells (DSCs) can be tuned by altering the dye and/or particle size of the mesoporous TiO₂ layers, to allow their application as the top device in tandem solar cells. To benefit from this semi‐transparency, parasitic optical losses by the transparent electrodes must be minimised. This work investigates the influence of using two different transparent conductors, namely, the high mobility material titanium doped indium oxide (ITiO) and fluorine doped tin oxide (FTO) as electrodes for semi‐transparent DSCs. The overall NIR transparency through the DSCs increased significantly as each FTO electrode was replaced by an ITiO electrode. This increase was from 20–45% in the 1300–700 nm wavelength range for fully FTO‐based cells, to about 60% for fully ITiO‐based cells, across the same spectrum. DSCs prepared on these electrodes exhibited short circuit currents ranging from 14·0–14·9 mA/cm². The conversion efficiency of the cell with ITiO as both the front and rear electrodes was 5·8%, which though significant, was lower than the 8·2% attained by the cell using FTO electrodes, as a result of a lower fill factor. Improvements in the ITiO thermal stability and in the processing of the TiO₂ interfacial layer are expected to improve the cell efficiency of such single DSC devices. The high current density and optical transparency of ITiO‐based DSCs make them an interesting option for tandem solar cells. Copyright © 2008 John Wiley & Sons, Ltd.     

Multi‐crystalline Si solar cells with very fast deposited (180 nm/min) passivating hot‐wire CVD silicon nitride as antireflection coating

Hot‐wire chemical vapor deposition (HWCVD) is a promising technique for very fast deposition of high quality thin films. We developed processing conditions for device‐ quality silicon nitride (a‐SiN_x:H) anti‐reflection coating (ARC) at high deposition rates of 3 nm/s. The HWCVD SiN_x layers were deposited on multicrystalline silicon (mc‐Si) solar cells provided by IMEC and ECN Solar Energy. Reference cells were provided with optimized parallel plate PECVD SiN_x and microwave PECVD SiN_x respectively. The application of HWCVD SiN_x on IMEC mc‐Si solar cells led to effective passivation, evidenced by a V_oc of 606 mV and consistent IQE curves. For further optimization, series were made with HW SiN_x (with different x) on mc‐Si solar cells from ECN Solar Energy. The best cell efficiencies were obtained for samples with a N/Si ratio of 1·2 and a high mass density of >2·9 g/cm³. The best solar cells reached an efficiency of 15·7%, which is similar to the best reference cell, made from neighboring wafers, with microwave PECVD SiN_x. The IQE measurements and high V_oc values for these cells with HW SiN_x demonstrate good bulk passivation. PC1D simulations confirm the excellent bulk‐ and surface‐passivation for HW SiN_x coatings. Interesting is the significantly higher blue response for the cells with HWCVD SiN_x when compared to the PECVD SiN_x reference cells. This difference in blue response is caused by lower light absorption of the HWCVD layers (compared to microwave CVD; ECN) and better surface passivation (compared to parallel plate PECVD; IMEC). The application of HW SiN_x as a passivating antireflection layer on mc‐Si solar cells leads to efficiencies comparable to those with optimized PECVD SiN_x coatings, although HWCVD is performed at a much higher deposition rate. Copyright © 2007 John Wiley & Sons, Ltd.     

Fine line printed silicon solar cells exceeding 20% efficiency

Silicon solar cells with passivated rear side and laser‐fired contacts were produced on float zone material. The front side contacts are built up in two steps, seed and plate. The seed layer is printed using an aerosol jet printer and a silver ink. After firing this seed layer through the silicon nitride layer, the conductive layer is grown by light induced plating. The contact formation is studied on different emitter sheet resistances, 55 Ω/sq, 70 Ω/sq, and on 110 Ω/sq. These emitters are passivated with a PECVD silicon nitride layer which also acts as an anti‐reflection coating. Even on the 110 Ω/sq emitters it was possible to reach a fill factor of 80·1%. The electrical properties i.e., the contact resistance of the front side contacts are studied by transfer length model (TLM) measurements. On a cell area of 4 cm² and emitter sheet resistance of 110 Ω/sq, a record efficiency of 20·3% was achieved. Excellent open‐circuit voltage (V_oc) and short‐circuit current (j_sc) values of 661 mV and 38·4 mA/cm² were obtained due to the low recombination in the 110 Ω/sq emitter and at the passivated rear surface. These results show impressively that it is possible to contact emitter profiles with a very high efficiency potential using optimized printing technologies. Copyright © 2008 John Wiley & Sons, Ltd.     

Efficiency (>15%) for thin‐film epitaxial silicon solar cells on 70 cm2 area offspec silicon substrate using porous silicon segmented mirrors

We report on the beneficial use of embedded segmented porous silicon broad‐band optical reflectors for thin‐film epitaxial silicon solar cells. These reflectors are formed by gradual increase of the spatial period between the layer segments, allowing for an enhanced absorption of low energy photons in the epitaxial layer. By combining these reflectors with well‐established solar cell processing by photolithography, a conversion efficiency of 15·2% was reached on 73 cm² area, highly doped offspec multicrystalline silicon substrates. The corresponding photogenerated current densities (J_sc) were well above 31 mA/cm² for an active layer of only 20 µm. Copyright © 2010 John Wiley & Sons, Ltd.