How China is closing the semiconductor technology gap

China has been obtaining and advancing technology in a manner and at a pace that has surprised most people. The high-tech semiconductor industry exemplifies this growth. In less than 10 years China went from being five generations behind in integrated circuit (IC) semiconductor processing, to being current with the state-of-the-art. With the help of Chinese engineers, often educated by U.S. companies including Motorola and Intel, Chinese companies will soon be producing the leading IC technologies for the world. With the already existing infrastructure to incorporate semiconductors into advanced systems, and a large internal (and external) market, China's future truly looks bright.     

世界集成电路市场发展趋势

自50年代发明集成电路（IC）后,世界集成电路产业结构经过了三次变革。80年代以来,IC设计业、制造业、封装业和制版业的市场发展迅速。在PC市场增长逐渐趋缓之后,通信类芯片成为IC市场新的增长点,将带动IC产业的持续发展。     

模拟集成电路发展概况

模拟集成电路(IC)是现实世界和数字化系统之间的桥梁，是现代信息化系统的关键技术之一。从总市场、分类市场、设计和工艺技术、产品水平以及技术发展趋势等方面，介绍了模拟集成电路的发展状况，并提出了发展中国模拟集成电路技术的基本观点。     

Bottlenecks and strategies of green mold compounds

The mold compound protects integrated circuit (IC) devices from the environmental attacks (e.g., moisture, contaminants) for its lifetime. Driven by market pressure, environmental regulations, the electronics industry is migrating to provide environmental friendly ("green") products and systems. Two major changes associated with this migration are elimination of lead and toxic halogens from the products. Thus, the halogen-free mold compound will be a part of the "green" IC package. The migration to lead-free electronics impacts the current nongreen IC packaging technology, cost and reliability of manufacturers. This article presents the technology challenges and development trend that manufacturers and end users are facing right now with the introduction of green mold compounds.     

LSI processing technology for planar GaAs integrated circuits

A planar GaAs integrated circuit (IC) fabrication technology capable of LSI complexity has been developed. The circuit and fabrication approaches were chosen to satisfy LSI requirements for high yield, high density, and low power. This technology utilizes Schottky-diode FET logic (SDFL) incorporating both high-speed switching diodes and 1-µ m GaAs MESFET's. Circuits are fabricated directly on semi-insulating GaAs using multiple localized implantations. Rapid progress in the development of this technology has already led to the successful demonstration of high-speed (tau_{d} sim 100ps) low-power (∼500 µW/gate) GaAs MSI (∼60-100 gates) circuits. Extension of the current MSI technology to the LSI/VLSI domain will depend critically on device yield which will be dictated by the GaAs material properties and by the fabrication processes used. The purpose of this paper is to describe a GaAs IC process technology which combines advanced planar device and multilevel interconnect structures with several LSI compatible processes including multiple localized ion implantations, reduction photolithography, plasma etching, reactive ion etching, and ion milling.     

Progress of quantum electronics and the future of wireless technologies

Research in quantum electronics over several decades has fueled the creation and rapid growth of today's wireless communications market. Sales of electronic components into this market exceeded $25 billion in 2006. Nearly all cellular handsets sold today include integrated circuits (ICs) based on energy gap engineered transistors—high-electron mobility transistors (HEMTs) and heterojunction base transistors (HBTs). The success of these technologies notwithstanding, future wireless communications systems will require even more demanding IC performance, especially in the areas of linearity and low noise. We propose that a new concept in transistor design, wave-function engineering, offers un-tapped opportunities to realize these needed performance improvements.     

我国台湾地区集成电路工业发展特点分析

集成电路(IC)工业和电脑工业是台湾两个最大的高技术工业。电脑工业的发展大大促进了IC工业的成长,特别是近两年以来,发展尤为迅速,岛内IC(消耗)总市场增长率高达20～37％,比国际高出十多个百分点。1992年IC市场预计可突破千亿元大关,达1128亿新台币(NT),超过韩国、香港、新加坡和马来西亚,位居群龙之首,从而引起国际同行的广泛重视。本研究拟从全球对比角度,分析台湾IC工业规划、技术水平、工业增长和劳动生产率等发展状况,并在此基础上从政府、企业科研、生产和国际合作等几个方面讨论台湾IC工业发展特色及其存在的问题。本文取材来源为ERSO/ITRI,ICE,Dataquest和电子科技情报所等报告。     

Kann die Mikroelektronik nach 2010 noch wachsen?

In spite of its cyclical nature, there is a consensus regarding the growth curve of microelectronic for the next 10 years. Over this time period, the microelectronics market will quadruple to over 800 Billion USDollars, and the technology will be advanced along the international technology roadmap for semiconductors. For the following second decade of this century, forecasts are divided between a straigthforward extrapolation and the rapid replacement of the present silicon electronics by radical innovations in optical, quantummechanical and biological technologies. It will be shown that, between these two extremes, silicon technology has enormous reserves for the second decade to grow into very powerful systems on the chip scale. As a consequence, microchips will continue to be the motors for innovation and growth. For each percent of growth in the microchip market, information technology will grow by a half percent and the world GDP by a quarter percent. In a push-pull mode, for an annual growth of the world economy by 4 percent, the microchip industry will grow by 16 percent.     

集成电路局部缺陷模型及其相关的功能成品率分析

大规模集成电路（VLSI）使亚微米特征尺寸的大面积集成电路制造以及集成数百万个器件在一芯片上成为可能。然而,缺陷的存在致使电路版图的拓扑结构发生变化,产生IC电路连接错误,导致电路丧失功能,从而影响IC的成品率,特别是功能成品率。文章主要对缺陷的轮廓模型、空间分布模型和粒径分布模型作了介绍;对集成电路成品率的损失机理作了详细论述。最后,详细介绍了功能成品率的分析模型。     

军用集成电路失效分析

随着科学技术的发展,集成电路在我国军用武器装备上的应用越来越广泛,其可靠性成为制约我国武器装备质量的一项重要因素,失效分析是集成电路可靠性及质量保证的重要环节,本文从失效分析的流程、方法、技术及发展入手,对军用集成电路的失效模式及失效机理进行了详细的讲解,随着元器件设计与制造技术的不断提高及失效分析技术和工具的逐步完善,失效分析工作将在集成电路质量控制方面发挥更大的作用.     

Pad Deflection-Based Model of Chemical–Mechanical Polishing for Use in CAD IC Layout

The use of chemical–mechanical polishing (CMP) during the integrated circuit (IC) fabrication process has allowed for the aggressive interconnect patterning that is necessary for modern microprocessor technology. However, as IC technology has moved into the deep submicron realm, nonidealities during polishing have begun to play a significant role in device yield and circuit performance. In order to accurately predict circuit performance, designers must consider the effects of CMP prior to fabrication. A physics-based model to predict feature-scale wear of devices during polishing is presented and integrated into a CAD framework to test the model on various IC layouts. The model is benchmarked against experimental data and shown to be qualitatively accurate in predicting surface topography evolution.      

VoIP芯片测试验证及量产解决方案

随着互联网(Internet)及无线网络的普及,基于网际协议的语音传输(VoIP)技术将呈爆发性成长,最终取代传统固话业务,跃居主流通讯方式.在此趋势之下,集成了VoIP技术的芯片将成为一个新的市场增长点.SVE1000是设计服务公司芯原微电子为客户设计的一款VoIP芯片,采用SMIC18 1ogic工艺.内部集成了芯原微电子ZSP(R)核以及CODEC核.本文将详细讨论SVE1000的测试验证以及量产解决方案.     

Material and process limits in silicon VLSI technology

The integrated circuit (IC) industry has followed a steady path of shrinking device geometries for more than 30 years. It is widely believed that this process will continue for at least another ten years. However there are increasingly difficult materials and technology problems to be solved over the next decade if this is to actually occur, and beyond ten years there is great uncertainty about the ability to continue scaling metal-oxide-semiconductor field-effect transistor (MOSFET) structures. This paper describes some of the the most challenging materials and process issues to be faced in the future and where possible solutions are known, describes these potential solutions. The paper is written with the underlying assumption that the basic metal-oxide-semiconductor (MOS) transistor will remain the dominant switching device used in ICs and it further assumes that silicon will remain the dominant substrate material     

集成电路技术领域最新进展及新技术展望

目前,最先进的CMOS工艺逐渐逼近单原子尺度,单纯靠工艺进步来推动发展的时代即将结束,集成电路发展将进入"后摩尔时代"。在"后摩尔时代",集成电路的发展不会随着"摩尔定律"失效而终结,相反,以应用为导向的需求将使集成电路呈现出更加旺盛的发展活力。在边缘计算、人工智能、5G/物联网等应用需求快速兴起的背景下,从集成电路涉及的材料、器件、工艺、设计、封装、新理论及方法学等方面,详细介绍了"后摩尔时代"集成电路最新进展,分析其发展趋势。最后,简要介绍了未来可能对集成电路当前技术路线产生颠覆性影响的二维器件、量子计算等前沿领域的进展,并进行了展望。     

Integrated-circuit digital I?Requirements and features of a logic family; RTL, DTL, and HTL devices logic families

The purpose of this article is to categorize the needs and desired features that a logic or system designer should consider when selecting a family of digital integrated circuits. The various major digital IC families are evaluated and compared with these needs in view. The intended results are that the reader will gain facility in IC technology, terminology, and usage in various areas of application. Part II of this article will cover transistor-transistor logic (TTL) devices. Part III is devoted to emitter-coupled logic (ECL) and metal oxide semiconductor (MOS) devices.     

A gain stabilization technique for tuned RF low-noise amplifiers

A gain stabilization technique for tuned integrated low-noise amplifiers (LNAs) is presented. The proposed method regulates the LC-tuned load impedance of the amplifier at the operation frequency against variations of passive devices in integrated circuit (IC) process. The impedance stabilization technique is based on the excellent relative accuracy of integrated resistors. Although the absolute deviation of the integrated resistors can be as large as /spl plusmn/20%, the relative deviation can be made smaller than /spl plusmn/1% provided that resistors are placed close to each other. By applying the proposed method, the voltage-gain variation of the inductively degenerated common-source LNA, which is the most popular LNA architecture, can be reduced several decibels. As a consequence, the entire radio receiver can more easily meet its specifications in the presence of IC process variations and the product yield is improved. Finally, besides the LNAs, the presented stabilization technique can also be utilized in other tuned amplifiers, filters or oscillators employing damped LC-tuned loads.     

GaAs HBT's for analog circuits

Silicon bipolar integrated circuit (IC) technology has dominated the analog IC world for over two decades. As the push for wider bandwidths with higher precision continues, the emergence of GaAs HBT technology is destined to challenge silicon bipolar's domination at the high end of the analog market. This paper discusses the analog application areas best suited to GaAs HBT technology, points out its unique characteristics for analog circuits, describes the design issues for key analog building block circuits, and provides comparative examples of demonstrated state-of-the-art analog circuits. Finally, a projection of future direction in this application area is provided     

Integrated electronics and change in the electronics industry

Those who use electronics to solve problems for customers must exercise science, engineering, art, and business sense, and work with four generations of electronics based on vacuum tubes, discrete semiconductor devices, integrated circuits, and integrated electronic components, respectively. This paper includes forecasts of the growing applications and economic impact of integrated electronics. The concept of Active Element Groups (AEGs) is used to analyze the growth of the market from 1963 to 1973 and to emphasize the increasing integration of electronics. Despite dramatic trends now emerging in product mix and technology, the electronics industry will not be radically changed in structure. Bigger organizations are likely to get still bigger and stronger; smaller organizations are likely to consolidate; integrated electronics will make electronics pervasive. Integrated electronics makes the inward-looking science, engineering, and art of electronics more usable and allows the outward-looking practitioners who use electronics to solve problems for customers to move up their skills and concentrate on more effective and more sophisticated solutions-to those problems. It does not decrease their ability to serve their customers. It does require that they upgrade and change the emphasis of that ability to serve their customers more effectively.     

车载信息服务分析与研究

车载信息系统利用信息通信技术,提供综合化的信息服务,为驾乘人员提供人性化的服务。随着信息技术和汽车电子的发展,车载信息技术成为信息技术发展的新热点,车载信息服务越来越受到了电信运营商、车厂和车载信息运营商的关注。未来车载系统也将成为智慧城市、智能交通的重要组成部分。     

Optimization of the Cu wire bonding process for IC assembly using Taguchi methods

The yield of IC assembly manufacturing is dependent on wire bonding. Recently, the semiconductor industry demands smaller IC designs and higher performance requirements. As such, bonding wires must be stronger, finer, and more solid. The cost of gold is continuously appreciating, and this has become a key issue in IC assembly and design. Copper wire bonding is an alternative solution to this problem. It is expected to be superior over Au wires in terms of cost, quality, and fine-pitch bonding pad design. To obtain the best wire bonding quality, we employed Taguchi methods in optimizing the Cu wire bonding process. With Cu wire bonding technology, the production yield increased from 98.5% to 99.3% and brought approximately USD 0.7 million in savings.