System design for a wide‐color‐gamut TV‐sized AMOLED display

Abstract— By using current technology, it is possible to design and fabricate performance‐competitive TV‐sized AMOLED displays. In this paper, the system design considerations are described that lead to the selection of the device architecture (including a stacked white OLED‐emitting unit), the backplane technology [an amorphous Si (a‐Si) backplane with compensation for TFT degradation], and module design (for long life and low cost). The resulting AMOLED displays will meet performance and lifetime requirements, and will be manufacturing cost‐competitive for TV applications. A high‐performance 14‐in. AMOLED display was fabricated by using an in‐line OLED deposition machine to demonstrate some of these approaches. The chosen OLED technologies are scalable to larger glass substrate sizes compatible with existing a‐Si backplane fabs.     

Vertically integrated,double stack oxide TFT layers for high‐resolution AMOLED backplane

We developed a novel vertically integrated, double stack oxide thin‐film transistor (TFT) backplane for high‐resolution organic light‐emitting diode (OLED) displays. The first TFT layer is bulk‐accumulation mode, and the second TFT layer is a single gate with back‐channel etched structure. The extracted mobilities and threshold voltages are higher than 10 cm²/Vs and 0 ~ 1 V, respectively. Both TFTs are found to be extremely stable under the bias and temperature stress. The gate driver with width of 530 μm and a pitch of 18.6 μm was developed, exhibiting well shifted signal up to the last stage of 900 stages without output degradation, which could be used for 1360 ppi TFT backplane.     

Development of rollable silicon thin‐film‐transistor backplanes utilizing a roll‐to‐roll continuous lamination process

Abstract— Rollable silicon thin‐film‐transistor (TFT) backplanes utilizing a roll‐to‐roll process have been developed. The roll‐to‐roll TFT‐backplane technology is characterized by a glass‐etching TFT transfer process and a roll‐to‐roll continuous lamination process. The transfer process includes high‐rate, uniform glass‐etching to transfer TFT arrays fabricated on a glass substrate to a flexible plastic film. In the roll‐to‐roll process, thinned TFT‐glass sheets (0.1 mm) and a base‐film roll are continuously laminated using a permanent adhesive. Choosing both an appropriate elastic modulus for the adhesive and an appropriate tension strength to be used in the process is the key to suppressing deformation of the TFT‐backplane rolls caused by thermal stress. TFT backplanes that can be wound, without any major physical damage such as cracking, on a roll whose core diameter is approximately 300 mm have been sucessfully obtained. Incorporating the TFT‐backplane rolls into other roll components, such as color‐filter rolls, will make it possible to produce TFT‐LCDs in a fully roll‐to‐roll manufacturing process.     

Novel a‐Si:H TFT pixel circuit for electrically stable top‐anode light‐emitting AMOLEDs

Abstract— A novel pixel circuit for electrically stable AMOLEDs with an a‐Si:H TFT backplane and top‐anode organic light‐emitting diode is reported. The proposed pixel circuit is composed of five a‐Si:H TFTs, and it does not require any complicated drive ICs. The OLED current compensation for drive TFT threshold voltage variation has been verified using SPICE simulations.     

Effects of localized warpage and stress on chip‐on‐glass packaging: Induced light‐leakage phenomenon in mid‐sized TFT‐LCD

Abstract— Mura defects become visible in a 13.3‐in. TFT‐LCD using chip‐on‐glass (COG) packaging when the thickness of the glass substrate is decreased from 0.5 to 0.3 mm. Mura, the non‐uniform brightness in LCDs, is caused by COG packaging due to the mismatch of the coefficient of thermal expansion (CTE) and Young's modulus between the glass substrate and the IC‐driver Si chips. In this paper, a 3‐D finite‐element‐analysis (FEA) model, coupled with transient thermal analysis is first established to examine the warpage and stress behavior in the upper‐glass‐plate post‐COG‐package processing for identifying the root causes of the light‐leakage phenomenon. Prior to that, the simulated warpage results are validated by surface‐contour measurement. Data and modeling results show that a low bonding temperature together with a low modulus in novel ACF materials can effectively eliminate Mura. Besides, thinner silicon or a shorter length of Si chips as drivers offers enhanced reduction in the localized warpage, and thus can be a practical and low‐cost solution for eliminating mura defects.     

Dual‐plate OLED display (DOD) based on amorphous‐silicon (a‐Si) TFT backplane

Abstract— An improved AMOLED with an a‐Si TFT backplane based on a unique structure is reported. The new structure is refered to as a dual‐plate OLED display (DOD). While a top‐emission OLED array is directly fabricated on a TFT backplane, the DOD consists of an upper OLED substrate and a lower TFT substrate, which are independently fabricated. Because the OLED substrate, which is fabricated through the process flow of bottom emission, is attached to the TFT substrate, the light is emitted in the opposite direction to the TFT backplane. The DOD enables the design of large‐sized TFTs and a complicated pixel circuit. It can also not only achieve higher uniformity in luminance in large‐sized displays due to the low electrical resistance of the common electrode, but also wider viewing angles.     

Recent developments in large‐area photomasks for display applications

One of the most critical areas in the manufacturing process for FPD panels or shadow masks for CRTs is lithography. Most existing lithography technologies require high‐quality large‐area photomasks. The requirements on these photomasks include positioning accuracy (registration) and repeatability (overlay), systematic image quality errors (“mura” or display quality), and resolution (minimum feature size). The general trend toward higher resolution and improved performance, e.g., for TFT desktop monitors, has put a strong focus on the specifications for large‐area‐display photomasks. This article intends to give an overview of the dominant issues for large‐area‐display photomasks, and illustrates differences compared with other applications. The article will also present state‐of‐the‐art methods and trends. In particular, the aspects of positioning accuracy over large areas and systematic image‐quality errors will be described. New qualitative and objective methods have been developed as means to capture systematic image‐quality errors. Results indicating that errors below 25 nm can be found early in the manufacturing process is presented, thus allowing inspection for visual effects before the actual display is completed. Positioning accuracy below 400 nm (3 sigma) over 720 × 560 mm have been achieved. These results will in the future be extended up toward 1 × 1 m for generation 4 in TFT‐LCD production.     

A flexible 2.1‐in. active‐matrix electrophoretic display with high resolution and a thickness of 100 μm

Abstract— A paper‐thin QVGA, flexible 2.1‐in. active‐matrix electrophoretic display (AMEPD) that features 100‐μm thick and a 192‐ppi resolution has been developed. An LTPS‐TFT backplane with integrated peripheral driver circuits was first fabricated on a glass substrate and then transferred to a very thin (30‐μm) plastic film by employing surface‐free technology by laser ablation/annealing (SUFTLA®). A micro‐encapsulated electrophoretic imaging sheet was laminated on the backplane. A supporting substrate was used to support the LTPS‐TFT backplane. Fine images were successfully displayed on the rollable AM‐EPD. The integrated driver circuits dramatically reduce the number of external connection terminals, thus easily boosting the reliability of electrical connections even on such a thin plastic film.     

Liquid‐crystal displays using printed plastic TFT backplanes

Abstract— In this paper, we present results from a new liquid crystal over plastic printed thin‐film‐transistor (TFT) display. The display demonstrator shows that the processing incompatibilities between the plastic TFT backplane and the liquid‐crystal materials can be addressed to make a stable twisted‐nematic structure. New fabrication processes such as the photo‐alignment of liquid crystals have made it possible to create a new generation of displays, which pave the way towards fully integrated plastic liquid‐crystal‐display technologies.     

Novel LTPS technology for large substrate

We developed partial laser anneal silicon (PLAS) thin‐film transistor (TFT) of novel low‐temperature polycrystalline‐silicon (LTPS) technology, which had the mobility of 28.1 cm²/Vs lager than that of mass produced oxide TFT and photo‐stability comparable with that of LTPS TFT in bottom gate structure. This innovative technology enables the conversion from an α‐Si TFT to a high‐mobility TFT most easily and inexpensively. Moreover, there is no limit of substrate size, such as Gen10 and more. Photo‐stability of PLAS will be suitable to organic light‐emitting diode backplane, high‐dynamic range TV, and outdoor IDP.     

A flexible OLED display with an OTFT backplane made by scalable manufacturing process

Abstract— A full‐color top‐emission AMOLED display driven by an organic TFT backplane manufactured using a scalable, lift‐off‐free, and shadow‐mask‐free process has been developed. It was shown that cost‐efficient copper can be used for S/D electrodes. The display has shown no significant degradation over a storage life of more than 10 months and operation over 25 hours during which the display is bent over 10,000 times.     

Development of 55‐in. 8K AMOLED TV based on coplanar oxide thin‐film transistors and inkjet printing process

In this paper, we presented 55‐in. 8K4K AMOLED TV employing coplanar oxide thin‐film transistor (TFT) backplane, top emissive inkjet‐printing organic light‐emitting diode (OLED) device, gate driver on array (GOA), and compensation technologies. It is so far the largest prototype AMOLED TV fabricated by using inkjet printing process with 8K resolution. It shows the stunning display quality, thanks to the high resolution and fast refresh frequency. It proves that the inkjet printing process is not only cost competitive but also can deliver premium display.     

Low‐power and small‐area holding latch with level‐shifting function using LTPS TFTs for mobile applications

Abstract— A holding latch having a level shifting function fabricated by using a low‐temperature polysilicon (LTPS) process with a 5‐μm design rule on a glass backplane for power and cost effectiveness has been proposed. The layout area and the power consumption of the proposed circuit are reduced by 10% and 52%, respectively, compared with those of a typical structure which combines a static D‐latch and a cross‐coupled level shifter for a 2.2‐in. qVGA TFT‐LCD panel.     

PECVD‐based nanocrystalline‐silicon TFT backplanes for large‐sized AMOLED displays

Abstract— A 14.1‐in. AMOLED display using nanocrystalline silicon (nc‐Si) TFTs has been developed. Nanocrystalline silicon was deposited using conventional 13.56‐MHz plasma‐enhanced chemical vapor deposition (PECVD). Detailed thin‐film characterization of nc‐Si films was followed by development of nc‐Si TFTs, which demonstrate a field‐effect mobility of about 0.6–1.0 cm²/V‐sec. The nc‐Si TFTs show no significant shift in threshold voltage when over 700 hours of constant current stress is applied, indicating a stable TFT backplane. The nc‐Si TFTs were successfully integrated into a 14.1‐in. AMOLED display. The display shows no significant current decrease in the driving TFT of the 2T‐1cap circuit because the TFTs are highly stable. In addition to the improved lifetime of AMOLED displays, the development of nc‐Si TFTs using a conventional 13.56‐MHz PECVD system offers considerable cost advantages over other laser and non‐laser polysilicon‐TFT technologies for large‐sized AMOLEDs.     

A 2‐in. a‐Si:H TFT‐LCD with embedded backlight control TFT sensors with various channel widths

Abstract— A 2.0‐in. a‐Si:H TFT‐LCD with embedded TFT sensors for the control of the backlight intensity according to the ambient light intensity has been developed. Two types of a‐Si:H TFT sensors with various channel widths were embedded into a TFT backplane with bottom‐ and top‐gate structures for measuring the ambient light and backlight illumination, respectively. The output signal, measured by a readout IC, increased with backlight intensity until 20,000 lux.     

Highly reliable a‐IGZO TFTs on a plastic substrate for flexible AMOLED displays

We have successfully reduced threshold voltage shifts of amorphous In–Ga–Zn–O thin‐film transistors (a‐IGZO TFTs) on transparent polyimide films against bias‐temperature stress below 100 mV, which is equivalent to those on glass substrates. This high reliability was achieved by dense IGZO thin films and annealing temperature below 300 °C. We have reduced bulk defects of IGZO thin films and interface defects between gate insulator and IGZO thin film by optimizing deposition conditions of IGZO thin films and annealing conditions. Furthermore, a 3.0‐in. flexible active‐matrix organic light‐emitting diode was demonstrated with the highly reliable a‐IGZO TFT backplane on polyimide film. The polyimide film coating process is compatible with mass‐production lines. We believe that flexible organic light‐emitting diode displays can be mass produced using a‐IGZO TFT backplane on polyimide films.     

Highly robust oxide TFT with bulk accumulation and source/drain/active layer splitting

We report stable and high performance amorphous indium‐gallium‐zinc oxide (a‐IGZO) thin‐film transistor (TFT) by using bulk‐accumulation (BA) and split active/source/drain layers. The a‐IGZO TFTs exhibit the mobility over 80 cm²/Vs and extremely stable under bias and mechanical stresses. We demonstrated a 4‐inch semitransparent AMOLED using the oxide TFT backplane with the gate driver integrated.     

Low‐temperature amorphous‐silicon backplane technology development for flexible displays in a manufacturing pilot‐line environment

Abstract— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed.     

Transparent AMOLED display driven by split oxide TFT backplane

We have developed stable and high performance etch‐stopper amorphous indium–gallium–zinc oxide thin‐film transistor (TFT) by using split active oxide semiconductor. The amorphous indium–gallium–zinc oxide TFTs exhibit the mobility as high as over 70 cm²/Vs and the stable operation under positive bias temperature stress. In this work, we demonstrated a 4‐in. transparent active‐matrix organic light‐emitting diode display using oxide TFT backplane with split active layer, where the gate driver is integrated.     

Low-contrast surface inspection of mura defects in liquid crystal displays using optical flow-based motion analysis

This paper proposes a machine vision scheme for mura defect detection in LCD manufacturing. Mura is a Japanese word for blemish, which typically shows brightness imperfections from its surroundings in the surface. It appears as a low-contrast region without clear edges. Traditional automatic visual inspection algorithms detect mura defects from individual still images. They neglect that a mura defect may not be visually sensed in the image from a stationary system. In this study, the LCD panel is assumed to move along a track. While the panel passes through a fixed camera, the light reflection from different angles can effectively enhance the mura defect in the low-contrast images. The mura detection problem is therefore treated as a motion analysis in image sequences using optical flow techniques. Since a LCD panel moves along a single direction, both two-dimensional and one-dimensional optical flow methods are developed. Three discriminative features based on flow magnitude, mean flow magnitude and flow density in the optical flow field are presented to extract the defective regions. Both real panel images and synthetic surface images are used to evaluate the efficacy of the proposed methods. Experimental results have shown that the proposed 1D optical flow method works as well as the 2D optical flow method to detect very low-contrast mura defects of small size, and achieves a high processing rate around 20 frames per second for images of size 200 × 200.