非晶硅薄膜激光晶化及其结构分析

以射频(频率为13.6MHz)磁控溅射系统制备的非晶硅薄膜为前驱物,采用激光晶化技术实现从非晶硅薄膜到纳米晶硅薄膜的相变过程。采用拉曼光谱仪和高分辨透射电镜对激光晶化薄膜的组织结构进行了研究。结果表明:薄膜由非晶硅结构转变为微晶硅结构,微晶硅晶粒尺寸在纳米级。激光晶化存在一个最佳工艺参数,功率太高或太低都不利于晶化。     

激光脉冲频率对不同衬底上非晶硅薄膜晶化的影响

应用不同频率的YAG激光分别对单晶硅及多晶硅衬底上的非晶硅薄膜进行了退火处理。晶化后的非晶硅薄膜的物相结构和表面形貌用XRD和AFM进行分析。XRD测试结果表明:随着激光频率的增加,两种衬底上的非晶硅薄膜晶化晶粒尺寸均出现了先增加后降低的现象。所有非晶硅样品的衍射峰位与衬底一致,说明非晶硅薄膜的晶粒生长是外延生长。从多晶硅衬底样品的XRD可以看出,随着激光频率的增加,激光首先融化衬底表面,然后衬底表层与非晶硅薄膜一起晶化。非晶硅薄膜最佳晶化激光频率分别为:多晶硅衬底20Hz,单晶硅衬底10Hz。     

非晶硅薄膜的YAG激光晶化工艺研究

应用YAG激光器在不同工艺条件(激光脉冲频率及脉宽)下对非晶硅薄膜进行了微晶化处理。采用XRD和AFM对所制薄膜的物相结构和表面形貌进行了分析,并探索了激光脉冲占空比对非晶硅薄膜晶化的影响。结果表明,非晶硅薄膜在不同激光脉冲占空比情况下的结晶变化趋势均为多晶硅衬底表层先非晶化,后与非晶硅薄膜一起结晶,而利于其结晶的最佳占空比为1/25。已晶化硅薄膜的晶粒尺寸随占空比的增加先变大后变小。     

连续氩氪离子激光晶化非晶硅薄膜的研究

为了研究连续激光晶化非晶硅薄膜中激光功率密度对晶化效果的影响,利用磁控溅射法制备非晶硅薄膜,采用连续氩氪混合离子激光器对薄膜进行退火晶化,用显微喇曼光谱测试技术和场发射扫描电子显微镜研究了薄膜在5ms固定时间下不同激光功率密度对晶化效果的影响,并对比了普通玻璃片和石英玻璃两种衬底上薄膜晶化过程的差异。结果表明,在一定激光功率密度范围内(0kW/cm2~27.1kW/cm2),当激光功率密度大于15.1kW/cm2时,普通玻璃衬底沉积的非晶硅薄膜开始实现晶化;随着激光功率密度的增大,晶化效果先逐渐变好,之后变差;激光功率密度增大到24.9kW/cm2时,薄膜表面呈现大面积散落的苹果状多晶硅颗粒,晶粒截面尺寸高达478nm ;激光功率密度存在一个中间值,使得晶化效果达到最佳;石英衬底上沉积的非晶硅薄膜则呈现与前者不同的结晶生长过程,当激光功率密度为19.7kW/cm2时,薄膜表面呈现大晶粒尺寸的球形多晶硅颗粒,并且晶粒尺寸随着激光功率密度的增大而增大,在 27.1kW/cm2处晶粒尺寸达到最大5.38m。研究结果对用连续激光晶化法制备多晶硅薄膜的研究具有积极意义。     

非晶TiO2薄膜激光晶化

以中频孪生非平衡磁控溅射沉积设备制备的非晶氧化钛薄膜为前驱体,采用激光晶化技术实现了从非晶氧化钛到纳米氧化钛的相变过程。研究结果表明,在所选取的激光功率范围内,晶化氧化钛薄膜主要是由纳米尺度的锐钛矿和金红石所组成。随着激光功率的增大,晶化薄膜中金红石相的含量逐渐增多,晶粒尺寸逐渐增大,硬度、弹性模量及耐磨性逐渐提高。     

平顶绿光晶化制备多晶硅薄膜

利用倍频Nd∶YAG激光器使玻璃基底上沉积的非晶硅薄膜成功实现了晶化.YAG激光器的倍频绿光经蝇眼透镜阵列整形后得到一光强均匀分布的平顶光束,并用此光束对非晶硅薄膜进行扫描晶化处理.分别测量了激光晶化前后薄膜的拉曼谱和表面形貌.测量结果表明,非晶硅实现了到多晶硅的相变,且晶化处理后表面起伏度明显增大.根据拉曼谱的数据计算了不同激光能量密度下薄膜的粒度大小和结晶度.结果表明,在一定能量密度(400～850 mJcm2)范围内,结晶膜的晶粒粒度和结晶度随激光能量密度升高而增大.然而能量密度大于1000 mJ/cm2后,检测不到明显的多晶硅特征峰.激光能量密度在850 mJ/cm2左右可得到最佳晶化效果.     

非晶硅薄膜的准分子激光晶化研究

利用Kr准分子激光器晶化非晶硅薄膜, 研究了不同的激光能量密度和脉冲次数对非晶硅薄膜晶化效果的影响.利用X 射线衍射(XRD)和扫描电子显微镜(SEM)对晶化前后的样品的物相结构和表面形貌进行了表征和分析.实验结果表明, 在激光频率为1 Hz 的条件下, 能量密度约为180 mJ/cm2时,准分子激光退火处理实现了薄膜由非晶结构向多晶结构的转变;当大于晶化阈值180 mJ/cm2小于能量密度230 mJ/cm2时, 随着激光能量密度增大, 薄膜晶化效果越来越好;激光能量密度为230 mJ/cm2时, 晶化效果最好、晶粒尺寸最大, 约60 nm, 并且此时薄膜沿Si(111)面择优生长;脉冲次数50 次以后对晶化的影响不大.     

本征非晶硅薄膜的准分子激光晶化

为了减低非晶硅薄膜太阳能电池的光致衰减效应和提高其光电转换效率,用等离子体化学气相沉积系统制备了本征非晶硅薄膜,用波长为248nm的KrF准分子激光器激光晶化了非晶硅表层,用共焦显微喇曼测试技术研究了非晶硅薄膜在不同的激光能量密度和不同的频率下的晶化状态,并用扫描电子显微镜测试晶化前后薄膜的形貌。结果表明,随着激光能量密度的增大,薄膜晶化效果越来越好,能量密度达到268.54mJ/cm2时晶化效果最好,此时结晶比约为76.34%;最佳的激光能量密度范围是204.99mJ/cm2~268.54mJ/cm2,这时薄膜表面晶化良好;在1Hz~10Hz范围内,激光频率越大晶化效果越好;晶化后薄膜明显出现微晶和多晶颗粒,从而达到了良好的晶化效果。     

脉冲Nd:YAG激光器选区晶化制备多晶硅薄膜

采用三倍频后的Nd:YAG固体脉冲激光系统(波长为355 nm)选区诱导晶化非晶硅薄膜,以制备多晶硅薄膜。分别测试了激光晶化前后薄膜的表面形貌和拉曼光谱。在文中分析了400 nm厚薄膜在激光扫描前后的表面形貌变化。拉曼光谱显示薄膜的晶化程度随着激光能量的增加而提高。最优的激光晶化能量密度与薄膜的厚度相关。对于300 nm和400 nm厚的非晶硅薄膜,有效晶化非晶硅的能量密度分别在440-634 mJ/cm²,777-993 mJ/cm²之间。在激光能量密度分别为634 mJ/cm²,975 mJ/cm²和1571 mJ/cm²时,300 nm、400 nm和500 nm厚薄膜达到最好的晶化效果。     

多晶硅薄膜的新型激光晶化制备方法

采用两步激光晶化方法制备了多晶硅薄膜 ,其晶粒尺寸为 1.1μm,比用传统单步晶化制备的薄膜晶粒尺寸大 ,表明该方法对扩大晶粒尺寸很有效。拉曼光谱分析表明 0 .30 J/ cm2晶化的薄膜结晶程度已很高     

用于TFT有源层的Ar~+激光结晶a-Si:H的性质(英文)

This paper demonstrates the technological approach to the high performance a-Si:H thin film transistor (TFT) fabricated by the Ar+ laser-crystallization technique on the fused quartz substrates. The a-Si:H films for the active layer of TFT were prepared in a capacitively coupled glow-discharge deposition system. The films were crystallized by CW Ar+ laser scanning at low speeds (3-5 cm/s). The laser power ranges from 2.5W to 5.0W. The TEM cross-section micrograph illustrates that a liquid phase laser crystallization region (LP-LCR) has defect-free of structure with a grain size of the order of handreds of micron. In the Raman spectrum of LP-LCR, 475 cm-1 peak of a-Si:H disappears and 520 cm-1 peak of c-Si becomes stronger and sharper. The value of conductivity in the layer of LP-LCR is five orders of magnitude larger than the one in asepositedd a-Si:H film. We also discussed some problems to be overcome in application of a-Si : H TFTs in LCD.     

快速光热退火法制备多晶硅薄膜的研究

为了制备应用于太阳电池的优质多晶硅薄膜,研究了非晶硅薄膜的快速光热退火技术。先利用 PECVD 设备沉积非晶硅薄膜,然后放入快速光热退火炉中进行退火。退火前后的薄膜利用 X 射线衍射仪(XRD)和扫描电子显微镜(SEM)测试其晶体结构及表面形貌,用电导率设备测试其暗电导率。研究表明退火温度、退火时间对非晶硅薄膜的晶化都有很大的影响,光热退火前先用常规高温炉预热有助于增大多晶硅薄膜的晶粒尺寸和暗电导率。     

Ge诱导晶化多晶Si薄膜的制备及结构表征

采用测控溅射,通过Ge诱导晶化法在Si衬底上制备多晶Si薄膜.采用Raman光谱、X射线衍射(XRD)、原子力显微镜(AFM)及场发射扫描电镜(FESEM)等对所制备的薄膜进行表征.结果表明,当生长温度为800℃时,Ge有诱导非晶Si(a-Si)薄膜晶化的作用,所制备的多晶Si薄膜在(200)方向具有择优取向,且在此方...     

Low temperature crystallization of amorphous silicon using an excimer laser

Low temperature processing is a prerequisite for compatible technologies involving combined a-Si and poly-silicon devices or for fabricating these devices on glass substrates. This paper describes excimer-laser-induced crystallization of thin amorphous silicon films deposited by plasma CVD (a-Si:H) and LPCVD (a-Si). The intense, pulsed UV produced by the laser is highly absorbed by the thin amorphous material, but the average temperature is compatible with low temperature processing. The process produces crystallites whose structure and electrical characteristics vary according to starting material and laser scan parameters. The crystallized films have been principally characterized using x-ray diffraction, TEM, and transport measurements. The results indicate that crystallites nucleate in the surface region and are randomly oriented. The degree of crystallization near the surface increases as the doping level and/or deposited laser energy density is increased. The crystallite size increases with a power law dependence on deposited energy, while the conductivity increases exponentially above threshold for unintentionally doped PECVD films. The magnitude of the Hall mobility of the highly crystallized samples is increased by two orders of magnitude over that of the amorphous starting material.     

快速热退火制备多晶硅薄膜的研究

采用等离子体增强化学气相沉积法(PECVD)沉积非晶硅薄膜,然后在快速热退火炉中进行退火。研究了升温速率、降温速率对晶化的影响。结果表明:退火中,升温速率越大,越不利于晶核的形成;降温速率较小时(100℃/60s),形成的晶粒尺寸较小,晶化情况较好,晶化率估算达64.56%。     

Crystallization and ablation in annealing of amorphous-Si thin film on glass and crystalline-Si substrates irradiated by third harmonics of Nd:YAG laser

In the present research, an approach of converting amorphous-silicon (a-Si) thin films into polycrystalline thin films using the third harmonics of an all-solid-state pulsed Nd³⁺:YAG laser (355 nm) is studied. Two different samples of a-Si thin films on alkali-free glass (a-Si/glass) substrates and a-Si thin film on crystalline-Si substrates (a-Si/c-Si) are laser treated at different laser fluences ranging from 170 to 960 mJ/cm². The amount of heat incident on the surface has been analyzed theoretically by solving the one-dimensional heat-equation model. The ablation threshold, the region of crystallization and the depth of crystallization have been investigated theoretically. The influence of laser irradiation, ablation and crystallinity has been experimentally analyzed through in-situ reflectivity measurements, scanning electron microscopy (SEM) and Raman spectroscopy studies. In the case of a-Si/c-Si, the extent of crystallinity and the influence of structural characteristics on electronic properties are studied using the Hall-effect technique. The ablation threshold and the range of crystallization regime are in good agreement with the theoretical results. Laser fluence between 300 and 500 mJ/cm² is required for crystallization and the ablation threshold is estimated to be above 500 mJ/cm² for a-Si thin film with a thickness up to 400 nm.     

Deposition and crystallization of a-Si thin films by rapid thermal processing

The deposition and crystallization of a-Si thin films grown by rapid thermal processing have been studied, using transmission electron microscopy. The a-Si films were deposited in a rapid thermal processor at reduced pressures in the temperature range of 530–580°C, at different deposition pressures and silane flow rates and subsequently were annealed in-situ by high temperature rapid thermal annealing (RTA) or by a two-step annealing process involving low temperature furnace annealing (FA) followed by high temperature RTA. The activation energy of a-Si deposition was found to be approximately 1.7 eV, in reasonable agreement with the conventional LPCVD technique. It has been found that the deposition temperature and deposition rate have a strong effect on the grain size, which is attributed to the nucleation processes in the bulk of the films. The combination of low deposition temperature, high deposition rate and a two-step annealing process permits the low temperature growth of poly-Si films of 100 nm thickness, with large grains of 520 nm size, containing a low density of microtwins and characterized by very low surface roughness of 2.2 nm.     

A high-performance polycrystalline silicon thin film transistorwith a silicon nitride gate insulator

We have fabricated a high performance polycrystalline silicon (poly-Si) thin film transistor (TFT) with a silicon-nitride (SiN_x ) gate insulator using three stacked layers: very thin laser of hydrogenated amorphous silicon (a-Si:H), SiN_x and laser annealed poly-Si. After patterning thin a-Si:H/SiN_x layers, gate, and source/drain regions were ion-doped and then Ni layer was deposited. This structure was annealed at 250°C to form a NiSi silicide phase. The low resistive Ni silicides were introduced as gate/source/drain electrodes in order to reduce the process steps. The poly-Si with a grain size of 250 nm and low resistance n⁺ poly-Si for ohmic contact were introduced to achieve a high performance TFT. The fabricated poly-Si TFT exhibited a field effect mobility of 262 cm²/Vs and a threshold voltage of 1 V