热丝CVD法制备大面积金刚石薄膜基片的变形

采用热丝CVD法制备的大面积金刚石薄膜存在基片变形严重的问题,通过对热丝CVD设备和沉积工艺进行改进,成功解决了直径76mm、厚度0.4mm硅片的变形问题。结果表明:改进后金刚石薄膜基片的翘曲度为0.296%,比改进前的降低了88.9%;改进后金刚石薄膜的质量及晶粒大小均匀,膜厚不均匀度仅为1.53%,具有优异的大面积均匀性。     

CVD金刚石涂层拉丝模温度场数值分析

衬底温度是热丝化学气相沉积(HFCVD)制备金刚石薄膜的重要参数之一,在拉丝模表面沉积CVD金刚石涂层时,均匀的衬底温度场显得尤为重要.对HFCVD系统中制备CVD金刚石涂层时拉丝模衬底温度场进行数值分析,得到了拉丝模温度场的分布和热丝参数对衬底温度场的影响规律,为CVD金刚石涂层拉丝模的制备提供重要指导.     

CVD金刚石薄膜涂层轴承支撑器的制备和应用

轴承支撑器是轴承精密加工中的关键部件。本文采用热丝化学气相沉积(简称CVD)法,以丙酮和氢气为碳源,在WC-Co硬质合金轴承支撑器衬底上沉积金刚石薄膜,制备CVD金刚石薄膜涂层轴承支撑器,并应用于轴承的精密磨削加工。结果表明,合理控制衬底材料的预处理和CVD沉积工艺对金刚石薄膜质量、形貌、粗糙度和薄膜与衬底间的附着力有显著影响。与传统硬质合金轴承支撑器相比,CVD金刚石涂层轴承支撑器的耐用度和使用性能显著提高。     

微波等离子体CVD法在非平面基体上生长金刚石膜

介绍了在微波等离子体CVD装置中,用甲烷和氢气作为原料,在非平面基体(如钨丝、钻头、铣刀等)上生长金刚石薄膜的研究。在金刚石沉积过程中,由于"尖端效应",在基体的尖端很难沉积出金刚石膜。在采用金属丝屏蔽后,克服了"尖端效应",成功地在非平面基体上沉积出了金刚石膜。用扫描电镜(SEM)和激光拉曼光谱(Raman)分析了金刚石膜的形貌和质量。结果表明:非平面基体不同位置金刚石的晶形不同,晶粒比较细小,膜的质量较高。     

CVD金刚石涂层拉丝模的研制与应用

:以市售大孔径 (>2mm)硬质合金拉丝模为衬底 ,经酸腐蚀去钴、研磨和还原处理后 ,以氢气和丙酮为原料 ,用穿孔直拉热丝CVD法制备了金刚石涂层。利用扫描电镜和喇曼谱图对涂层均匀性进行了评估。初步应用试验表明 ,金刚石涂层的附着力能满足实际拉伸要求 ,涂层拉丝模的工作寿命可提高 3～ 5倍。     

Cr过渡层沉积粘附型CVD金刚石膜的机理研究

研究了电沉积层作为过渡层沉积CVD金刚石膜的工艺，在硬质合金的Cr电沉积层上用热丝法沉积出CVD金刚石膜。利用SEM分析了电沉积层的形貌，利用EPMA分析了H等离子处理后电沉积层的断面，利用SEM和Raman分析了金刚石膜的表面形貌、成分，利用XRD分析了过渡层和CVD金刚石膜的结合面．利用压痕法研究了金刚石薄膜与基体的结合力。结果表明，H等离子处理使得硬质合全与Cr镀层成为冶金结合，提高了电沉积层的结合强度；在Cr过渡层与金刚石膜之间形成的Cr3C2和Cr7C3等碳化物有利于金刚石的成核和膜基结合强度的提高。     

抛光金刚石膜残余应力对红外透射性能的影响

以抛光的CVD金刚石厚膜为基体,用X射线衍射测出其光谱,再运用布拉格公式计算出表面的残余应力,测出一定应力状态下对应红外透射率的大小,探讨CVD金刚石厚膜的内应力和红外透射率之间的作用规律。研究结果表明:抛光的CVD金刚石厚膜由于竞争生长模式下的粗大柱状晶和非金刚石成分的掺杂,使得内应力变化较大,随着膜中残余应力的增大CVD金刚石膜红外透射率将减小。     

掺硼金刚石膜的电火花加工研究

由于金刚石膜的加工极其困难，提出了一种通过在制备过程中掺杂使金刚石膜导电的金刚石膜精加工新工艺，利用电火花对掺杂金刚石膜进行电加工。研究了电参数对金刚石膜加工性能的影响，用SEM和Raman分析了金刚石膜电火花加工表面的形貌和成分。研究了掺硼金刚石膜电火花加工的加工机理，建立了电火花加工模型。试验结果表明，电参数对金刚石膜的加工速度、表面粗糙度有较大影响，掺杂金刚石膜的电火花加工是汽化、熔化、氧化、石墨化等多种效应的综合作用结果，通过掺杂可以显著改善金刚石膜的可加工性。     

CVD金刚石薄膜涂层铜线拉丝模的制备与应用

提高金刚石薄膜的表面质量和附着力是实现CVD金刚石涂层在耐磨器件领域中广泛应用的关键因素.本文通过优化沉积工艺参数,采用直拉丝化学气相沉积法在WC- Co硬质合金拉丝模内孔表面沉积金刚石薄膜.检测了该涂层的表面形貌、薄膜质量以及表面粗糙度,并把所制备的CVD金刚石薄膜涂层拉丝模具在拉拔铜线材生产线上进行了应用试验,结果...     

CVD金刚石薄膜涂层刀具精密切削表面质量的研究

CVD金刚石薄膜刀具的表面粗糙度及加工过程中的切削用量是影响加工工件表面质量的关键因素。为改进CVD沉积工艺 ,减小金刚石薄膜表面粗糙度 ,提出了合理控制沉积气压的新工艺方法 ,并通过切削试验研究了不同沉积工艺下制备的CVD薄膜涂层刀具和加工过程中不同切削用量对精密切削表面质量的影响。     

Friction and Wear Performance of Boron Doped,Undoped Microcrystalline and Fine Grained Composite Diamond Films

Chemical vapor deposition(CVD) diamond films have attracted more attentions due to their excellent mechanical properties. Whereas as-fabricated traditional diamond films in the previous studies don’t have enough adhesion or surface smoothness, which seriously impact their friction and wear performance, and thus limit their applications under extremely harsh conditions. A boron doped, undoped microcrystalline and fine grained composite diamond(BD-UM-FGCD) film is fabricated by a three-step method adopting hot filament CVD(HFCVD) method in the present study, presenting outstanding comprehensive performance, including the good adhesion between the substrate and the underlying boron doped diamond(BDD) layer, the extremely high hardness of the middle undoped microcrystalline diamond(UMCD) layer, as well as the low surface roughness and favorable polished convenience of the surface fine grained diamond(FGD) layer. The friction and wear behavior of this composite film sliding against low-carbon steel and silicon nitride balls are studied on a ball-on-plate rotational friction tester. Besides, its wear rate is further evaluated under a severer condition using an inner-hole polishing apparatus, with low-carbon steel wire as the counterpart. The test results show that the BD-UM-FGCD film performs very small friction coefficient and great friction behavior owing to its high surface smoothness, and meanwhile it also has excellent wear resistance because of the relatively high hardness of the surface FGD film and the extremely high hardness of the middle UMCD film. Moreover, under the industrial conditions for producing low-carbon steel wires, this composite film can sufficiently prolong the working lifetime of the drawing dies and improve their application effects. This research develops a novel composite diamond films owning great comprehensive properties, which have great potentials as protecting coatings on working surfaces of the wear-resistant and anti-frictional components.     

改善CVD金刚石薄膜涂层刀具性能的工艺研究

用热丝CVD法,以丙酮和氢气为碳源,在WC-Co硬质合金衬底上沉积金刚石薄膜,在分析了工艺条件(衬底温度、碳源浓度、反应压力)对金刚石薄膜性能的影响的基础上,提出了分步沉积法改善金刚石薄膜涂层刀具性能的新工艺.结果表明,合理控制工艺条件的新工艺对涂层薄膜质量、形貌和粗糙度、薄膜与衬底间的附着力、刀具的耐用度及切削性能有显著影响,对获取实用化的在硬质合金刀具基体上沉积高附着强度、低粗糙度金刚石薄膜的新技术具有重要的意义.     

CVD金刚石薄膜涂层刀具精密切削表面质量的研究

CVD金刚石薄膜刀具的表面粗糙度和加工过程中的切削用量是影响加工工件表面质量的关键因素.为改进CVD沉积工艺,减小金刚石薄膜表面粗糙度,提出了合理控制沉积气压的新工艺方法,并通过切削试验研究了不同沉积工艺下制备的CVD薄膜涂层刀具和加工过程中不同切削用量对精密切削表面质量的影响.     

高性能CVD金刚石薄膜涂层刀具的制备和试验研究

采用电子增强热丝EACVD法,以WC-Co硬质合金刀具为衬底制备金刚石涂层刀具,研究了提高涂层附着力的衬底预处理新方法,探讨了抑制Co催石墨化作用的有效措施,提出了改善金刚石薄膜表面粗糙度CVD后处理新工艺。研究结果表明,采用了Ar-H2微波等离子体刻蚀脱碳预处理方法对于提高金刚石薄膜涂层的附着力有明显效果,添加适量粘结促进剂,可有效地抑制CVD沉积过程中钴向表层扩散引起的催石墨化作用。采用分步沉积新工艺是减小金刚石薄膜表面粗糙度的有效方法。所制备的高附着力和低粗糙度的金刚石薄膜涂层刀具切削性能明显改善,对实现高效高精度切削加工具有十分重要的意义。     

Numerical analysis of Nd:YAG pulsed laser polishing CVD self-standing diamond film

Chemical vapor deposited(CVD) diamond film has broad application foreground in high-tech fields.But polycrystalline CVD self-standing diamond thick film has rough surface and non-uniform thickness that adversely affect its extensive applications.Laser polishing is a useful method to smooth self-standing diamond film.At present,attentions have been focused on experimental research on laser polishing,but the revealing of theoretical model and the forecast of polishing process are vacant.The paper presents a finite element model to simulate and analyze the mechanism of laser polishing diamond based on laser thermal conduction theory.The experimental investigation is also carried out on Nd:YAG pulsed laser smoothing diamond thick film.The simulation results have good accordance with the results of experimental results.The temperature and thermal stress fields are investigated at different incidence angles and parameters of Nd:YAG pulsed laser.The pyramidal-like roughness of diamond thick film leads to the non-homogeneous temperature fields.The temperature at the peak of diamond film is much higher than that in the valley,which leads to the smoothing of diamond thick film.The effect of laser parameters on the surface roughness and thickness of graphite transition layer is also carried out.The results show that high power density laser makes the diamond surface rapid heating,evaporation and sublimation after its graphitization.It is also found that the good polish quality of diamond thick film can be obtained by a combination of large incident angle,moderate laser pulsed energy,large repetition rate and moderate laser pulse width.The results obtained here provide the theoretical basis for laser polishing diamond film with high efficiency and high quality.     

Failure Mechanisms of CVD Diamond Wafers and Thin Films During Polishing

This article investigates the failure mechanisms of CVD diamond wafers and thin films during a fast dynamic friction polishing process. To explore the evolution of temperature and stress fields, a comprehensive finite element analysis was systematically carried out, with the aid of experimental examination. It was found that the discontinuity and sharp change of the stresses across the film-substrate interface causes debonding failure of a CVD diamond thin film specimen. In the case of a CVD diamond wafer, however, the high surface tensile stress and bulk bending is responsible for the cracking. It was concluded that specimen cracking is sensitive to the polishing pressure, and that the polishing window for the CVD thin films is smaller. Polishing time is a critical factor, because a longer time corresponds to a higher thermal stress. This article points out that using the combination of a smaller polishing load and a greater sliding speed is a good option in selecting polishing parameters. To minimize cracking, a stepwise polishing process can be used. With the proper parameters obtained in this study, very smooth, high-quality surfaces of CVD diamond wafers and thin films can be produced in a short polishing duration of minutes.     

氩气浓度对热丝法化学气相沉积纳米金刚石膜的影响

采用热丝化学气相沉积方法,以Ar+CH4+H2混合气体作为气源,通过改变氩气浓度,在单晶硅(100)基片上沉积纳米金刚石膜;采用扫描电子显微镜、原子力显微镜、X射线衍射仪和拉曼光谱仪等分析了纳米金刚石膜的形貌、微结构以及残余应力。结果表明:随着氩气浓度的增大,膜的晶粒尺寸逐渐减小到纳米级;由于晶粒细化导致膜内残余应力由拉应力变为压应力,并且压应力随氩气浓度的增大呈现先增大后减小的趋势;当氩气体积分数为98%时,即在贫氢的气氛中成功获得了平均晶粒尺寸为54 nm、均方根粗糙度约为14.7 nm的纳米金刚石膜。     

基于有限元模拟的铜包铝线拉拔参数优化

为研究拉拔参数对铜包铝线质量的影响,运用有限元方法对金刚石涂层拉拔模具拉拔铜包铝线的过程进行了模拟仿真,研究了拉拔过程中模具的应力分布情况,分析了压缩率对铜包铝线残余应力分布均匀性的影响规律。利用正交实验法研究了拉拔参数(工作锥半角α,定径带长度L,过渡圆弧半径R,压缩率β)对铜包铝线尺寸精度和残余应力分布均匀性的影响,获得了最佳拉拔参数(α=6°,L=4.5 mm,R=3 mm,β=1.82%)和各因素对分析指标的影响规律。并在此基础上对优化方案进行了模拟,结果证明了正交实验对拉拔参数优化的有效性,对金刚石涂层拉拔模具的设计及高质量铜包铝线的拉制有重要的指导意义。     

CVD金刚石厚膜焊接刀具的制造及切削性能

用于制造金属切削刀具的金刚石主要有四种类型：（1）天然单晶金刚石；（2）人工合成单晶金刚石；（3）聚晶金刚石复合片（PCD）；（4）化学气相沉积（CVD）金刚石膜。近年来，随着CVD金刚石工艺的发展，CVD金刚石对具的应用越来越广泛。CVD金刚石对具有两类：CVD金刚石薄膜涂层刀具和CVD金刚石厚膜焊接刀具。由于金刚石厚膜焊接刀具兼有单晶金刚石和金刚石薄膜涂层刀具的优点，从而具有广阔的应用前景。本文主要介绍金刚石厚膜的制备、厚膜刀具的制造及厚膜刀具的切削性能。     

CVD金刚石刀具的研究进展与应用现状

金刚石膜是采用化学气相沉积的方法制备出来的一种全晶质多晶纯金刚石材料,是制造刀具的理想材料。本文对CVD金刚石涂层刀具与厚膜焊接刀具的研究进展与应用现状进行了简要的综述。