Middle-frequency magnetron sputtering for GaN growth

A middle-frequency magnetron sputtering system was designed and constructed for GaN growth, in which a pair of back cooled pool-shaped twin magnetrons were used for Ga metal targets. GaN films were prepared using this system under various gas pressure (0.5-3.0 Pa) in a mixture of N₂ and Ar with N₂/Ar ratio of 6:1. X-ray diffraction showed that the GaN films had a strong (0 0 0 2) orientation, and the film deposited at 1.5 Pa had two more weak peaks attributed to and . The full width at half maximum (FWHM) of the (0 0 0 2) peak for the GaN film deposited at 1.5 Pa and 0.5 Pa is ∼721 and ∼986 arcsec, respectively. The deposition rate was in the range of 43.5-87.8 nm/min and was mainly influenced by the deposition pressure. The films deposited at higher pressures are columnar in structure. A root-mean-square roughness of 4.4 nm was obtained from the atomic force microscopy (AFM) surface morphology of the film deposited at 0.5 Pa.     

The properties of N-doped diamond-like carbon films prepared by helicon wave plasma chemical vapor deposition

In this paper, N-doped diamond-like carbon(DLC) films were deposited on silicon substrates by using helicon wave plasma chemical vapor deposition(HWP-CVD) with the Ar/CH_4/N_2 mixed gas. The surface morphology, structural and mechanical properties of the N-doped DLC films were investigated in detail by scanning electron microscopy(SEM), x-ray photoelectron spectroscopy(XPS), Raman spectra, and atomic force microscopy(AFM). It can be observed from SEM images that surface morphology of the films become compact and uniform due to the incorporation of N. The maximum of the deposition rate of the films is 143 nm min~(-1), which is related to the high plasma density. The results of XPS show that the N incorporates in the films and the C-C sp~3 bond content increases firstly up to the maximum(20%) at 10 sccm of N_2 flow rate, and then decreases with further increase in the N_2 flow rate. The maximum Young's modulus of the films is obtained by the doping of N and reaches 80 GPa at 10 sccm of N_2 flow rate, which is measured by AFM in the scanning probe microscope mode. Meanwhile, friction characteristic of the N-doped DLC films reaches a minimum value of 0.010.     

Deposition of titanium nitride on Si(1 0 0) wafers using plasma focus

Titanium nitride thin films were deposited on Si(1 0 0) substrates by using a low energy (2.3 KJ) Mather-type plasma focus device. The composition of the deposited films was characterized by X-ray diffraction (XRD). The crystallite size has strong dependence on the numbers of focus shots. The crystallinity of TiN thin films is found to increase with increasing the number of focus shots. The effect of different number of focus shots on micro structural changes of thin films was characterized by Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM). SEM results showed net-like structure for film deposited for 15 numbers of shots, which are elongated grains of Si₃N₄ in amorphous form embedded into TiN crystals. The average surface roughness was calculated from AFM images of the thin films. These results indicated that the average surface roughness increased for films deposited with increased number of focus shots. The least crystallite size and roughness are observed for film deposited with 25 focus shots.     

Swift heavy ion induced phase transition in CdTe films deposited by spray pyrolysis in presence of electric field

CdTe polycrystalline thin films possessing hexagonal phase regions are obtained by spray deposition in presence of a high electric field. Thin film samples are irradiated with 100 MeV Ag ions using Pelletron accelerator to study the swift heavy ion induced effects. The ion irradiation results in the transformation of the metastable hexagonal regions in the films to stable cubic phase due to the dense electronic excitations induced by beam irradiation. The phase transformation is seen from the X-ray diffraction patterns. The band gap of the CdTe film changes marginally due to ion irradiation induced phase transformation. The value changes from 1.47 eV for the as deposited sample to 1.44 eV for the sample irradiated at the fluence 1×10¹³ ions/cm². The AFM images show a gradual change in the shape of the particles from rod shape to nearly spherical ones after irradiation.     

Synchrotron X-ray induced damage in polymer (PS) thin films

Thin polystyrene (PS) films (M_w = 234,000) are spin coated on silicon substrates with a Chromium (Cr) layer as a sandwiched metallic layer that produces photoelectrons (by synchrotron X-rays). Earlier studies on synchrotron radiation damage in PS films, without metallic layer, have shown a decrease in interfacial roughness and a slight increase in thickness, at temperatures below T_g [A.G. Richter, R. Guico, K. Shull, J. Wang, Macromolecules 39 (2006) 1545]. Similar trend is observed in the presence of a thin layer of Cr film (∼2.5 nm). For the sample with a thick Cr layer the opposite effect was observed for X-ray radiation damage. For the 50 nm thick Cr film system thickness of the polystyrene film decreased by ≈4.4% which amount to a loss of about 0.021 nm³ per incident photon in the fluence range studied (6.8 × 10⁹ photons mm⁻² to 1 × 10¹⁴ photons mm⁻²). Interfacial roughness also increased from about 1.0 nm to 2.1 nm in the process. These effects are explained by invoking the presence of more number of X-ray induced photoelectrons and secondary electrons for 50 nm thick Cr film case compared to 2.5 nm thin film case.     

Depth profiling of Mg by 2010 keV resonance of Mg(p,p′γ)Mg nuclear reaction

Studies on the characteristics of 2010 keV resonance in ²⁴Mg(p,p′γ)²⁴Mg nuclear reaction for depth profiling Mg in thin films are reported. The resonance reaction, based on the detection of characteristic 1368 keV γ-rays, enables interference free measurement of Mg down to 2 × 10²⁰ atoms/cm³ and has a probing depth of about 20 μm. The width of the resonance extracted from excitation curves for thick (>180 nm) thermally grown elemental Mg films, by SPACES is about 350 ± 50 eV. The reaction has been used to depth profile Mg in a Mg/Ti/Mg/Si film which provides interesting information on interfacial mixing involving Ti layer and the underlying Mg layer.     

Effects of γ-irradiation on the optical properties of a-(Sb0.1Ge0.3Se0.6) and Ag5(Sb0.1Ge0.3Se0.6)95 thin film material

The amorphous behaviour of (Sb_0.1Ge_0.3Se_0.6) and Ag₅(Sb_0.1Ge_0.3Se_0.6)₉₅ chalcogenide thin film materials deposited at room temperature onto glass substrates by thermal evaporation process was investigated using X-ray diffraction technique. The surface morphology as well as the elemental chemical composition of the as-deposited films was investigated via scanning electron microscopy. The optical transmission and reflection spectra of as-deposited films and that exposed for different γ-dose were recorded at room temperature in the wavelength range of 600-2500 nm. Systematic studies of the refractive index, extinction coefficient and optical band gap have been presented as a function of the γ-dose. The dispersion of the refractive index for such films is discussed in terms of the single-oscillator Wemple-DiDomenico model, which was presented.     

Growth of silicon nitride films by bombarding amorphous silicon with N ions: MD simulation

In this study, the molecular dynamics simulation method was employed to investigate the growth of silicon nitride films by using N⁺ ions, with energies of 50, 100, 150 and 200 eV, to bombard an amorphous silicon surface at 300 K. After an initial period of N⁺ bombardment, saturation of the number of N atoms deposited on the surface is observed, which is in agreement with experiments. During subsequent steady state deposition, a balance between uptake of N by the surface and sputtering of previously deposited N is established. The Si(N_x) (x = 1-4) and N(Si_y) (y = 1-3) bond configurations in the grown films are analyzed.     

AFM and photoluminescence studies of swift heavy ion induced nanostructured aluminum oxide thin films

E-beam evaporated aluminum oxide films were irradiated with 120 MeV swift Au⁹⁺ ions in order to induced nanostructure formation. Atomic force microscope (AFM) results showed the formation of nanostructures for films irradiated with a fluence of 1 × 10¹³ ions cm⁻². The particle size estimated by section analysis of the irradiated film was in the range 25-30 nm. Glancing angle X-ray diffraction (GAXRD) revealed the amorphous nature of the films. Two strong Photoluminescence (PL) emission bands with peaks at ∼430 nm and ∼645 nm besides a shoulder at ∼540 nm were observed in all irradiated samples. The PL intensity is found to increase with increase of ion fluence.     

Effect of swift heavy ion irradiation on spray deposited CdX (X = S, Te) thin films

Cadmium sulfide and cadmium telluride thin films are irradiated with high energy heavy ion beam to study the irradiation induced effects in these films. The polycrystalline thin film samples deposited by spray pyrolysis are irradiated with 60 MeV Oxygen ions using tandem Pelletron accelerator. The X-ray diffraction patterns exhibit a reduction in peak intensities in both CdS and CdTe films. The grain size decrease with fluence is observed for both CdS and CdTe films, with more decrease for CdTe films. The AFM results support this observation. The films show opposite trend in the variation of electrical resistivity with irradiation fluence. A decrease in resistivity is observed for CdS films due to an increase of carrier concentration arising by the creation of sulfur vacancies during the irradiation. The creation of sulfur vacancies is confirmed by XPS studies. The stoichiometric changes seen from XPS studies support this observation. An enhancement of grain boundary scattering due to the reduction of grain size leads to the increase of electrical resistivity for CdTe films.     

Interface strain study of thin Lu2O3/Si using HRBS

The interface of thin Lu₂O₃ on silicon has been studied using high-resolution RBS (HRBS) for samples annealed at different temperatures. Thin rare earth metal oxides are of interest as candidates for next generation transistor gate dielectrics, due to their high-k values allowing for equivalent oxide thickness (EOT) of less than 1 nm. Among them, Lu₂O₃ has been found to have the highest lattice energy and largest band gap, making it a good candidate for an alternative high-k gate dielectric. HRBS depth profiling results have shown the existence of a thin (∼2 nm) transitional silicate layer beneath the Lu₂O₃ films. The thicknesses of the Lu₂O₃ films were found to be ∼8 nm and the films were determined to be non-crystalline. Angular scans were performed across the [1 1 0] and [1 1 1] axis along planar channels, and clear shifts in the channeling minimum indicate the presence of Si lattice strain at the silicate/Si interface.     

Effects of ion irradiation on the structural transformation of sol-gel derived TEOS/MTES thin films

Ion beam processing of organic/inorganic thin films has been shown to be an effective means in converting polymeric films into their final ceramic-like state. In this study, hybrid sol-gel derived thin films based on TEOS (tetraethylorthosilicate) Si(OC₂H₅)₄ and MTES (methyltriethoxysilane) CH₃Si(OC₂H₅)₃ were prepared and deposited on Si substrates by spin coating. After the films were allowed to air dry, they were heat treated at 300 °C for 10 min. Ion irradiation was performed at room temperature using 125 keV H⁺ and 250 keV N²⁺ ions with fluences ranging from 1 × 10¹⁴ to 5 × 10¹⁶ ions/cm². FT-IR and Raman spectroscopies were used to quantify the chemical structural transformations which occurred including the evolution of the organic components, the cross-linking of silica clusters, and the clustering of carbon.     

Studies on the high electronic energy deposition in polyaniline thin films

We report here the physico-chemical changes brought about by high electronic energy deposition of gold ions in HCl doped polyaniline (PANI) thin films. PANI thin films were synthesized by in situ polymerization technique. The as-synthesized PANI thin films of thickness 160 nm were irradiated using Au⁷⁺ ion of 100 MeV energy at different fluences, namely, 5 × 10¹¹ ions/cm² and 5 × 10¹² ions/cm², respectively. A significant change was seen after irradiation in electrical and photo conductivity, which may be related to increased carrier concentration, and structural modifications in the polymer film. In addition, the high electronic energy deposition showed other effects like cross-linking of polymer chains, bond breaking and creation of defect sites. AFM observations revealed mountainous type features in all (before and after irradiation) PANI samples. The average size (diameter) and density of such mountainous clusters were found to be related with the ion fluence. The AFM profiles also showed change in the surface roughness of the films with respect to irradiation, which is one of the peculiarity of the high electronic energy deposition technique.     

A direct current glow discharge plasma source for inner surface modification of metallic tube

A dc glow discharge plasma source was developed for inner surface modification of metallic tubes with an inner diameter of 10 mm. A tungsten wire of 30 μm thick was stretched inside the tube to form coaxial electrodes. DC glow discharge plasma was generated inside the tube by applying a negative high dc voltage to the tube. It was found that the length of the cylindrical plasma bulk depends linearly on the applied voltage. The electron excitation temperature of Ar plasma was measured as 12830 ± 550 K by optical emission spectroscopy method. As a preliminary application, diamond-like carbon (DLC) films were deposited onto the inner surface of stainless steel tube of 100 mm in length and 10 mm in inner diameter by using CH₄/Ar mixture with 40% CH₄ at 40 Pa pressure. The chemical structure of the DLC film deposited on the substrate was analyzed by Raman spectroscopy. The integrated intensity ratio (I_D:I_G) was obtained as 1.62 from the Raman spectra. The thickness of the DLC film deposited on the substrate was estimated as 1.5 μm by scanning electron microscopy (SEM) observation.     

Ion beam sputtered ultra-thin and nanostructured Ag films for surface plasmon applications

The growth of ultra-thin (10−17 nm) Ag films by ion beam sputtering with controlled morphology suitable for surface plasmon applications is demonstrated. A growth rate of 0.02 nm/s, by employing Ar ion energies as low as 150 eV, is achieved. These conditions result in a surface morphology that consists of oblate particles of size 10-30 nm, depending on the ion energy, with surface roughness of 1-3 nm. The aspect ratio of the grains decreases from 77 to 20 with increase in incident ion energy. The morphology-induced changes are manifested in the shift of the surface plasmon resonance peak from 440 to 480 nm.     

Structural study of the oxidation process and stability of NbOxNy coatings

In the present work, we study the oxidation behaviour of NbON multilayer films. The films were deposited by DC magnetron sputtering with a reactive gas pulsing process. The nitrogen flow was kept constant and the oxygen flow was pulsed. Pulse durations of 10 s produced multilayered coatings with a period of λ = 10 nm. Three different films with increasing duty cycles have been deposited.Rutherford backscattering spectroscopy (RBS) was used to study the chemical composition variations at different annealing temperatures (as-deposited, 400 °C, 500 °C and 600 °C) combined with X-ray diffraction (XRD) to identify the crystalline phases formed. At 400 °C, for all films a very thin layer starts to form at the surface with enhanced O concentration. The composition of the deeper part of the samples remains unchanged. At 500 °C, the oxide scale grows, encompassing about half the film thickness. At 600 °C, the process is finished and a single layer is formed with reduced Nb and increased O concentration. Fourier-transformation infrared spectroscopy (FTIR) results confirmed the increase of this surface oxidation, while XRD revealed that crystallization of Nb₂O₅ occurs at 600 °C.     

Study of density effect of large gas cluster impact by molecular dynamics simulations

Large gas cluster impacts cause unique surface modification effects because a large number of target atoms are moved simultaneously due to high-density particle collisions between cluster and surface atoms. Molecular dynamics (MD) simulations of large gas cluster impacts on solid targets were carried out in order to investigate the effect of high-density irradiation with a cluster ion beam from the viewpoint of crater formation and sputtering. An Ar cluster with the size of 2000 was accelerated with 20 keV (10 eV for each constituent atom) and irradiated on a Si(1 0 0) solid target consisting of 2 000 000 atoms. The radius of the Ar cluster was scaled by ranging from 2.3 nm (corresponding to the solid state of Ar) to 9.2 nm (64× lower density than solid state). When the Ar cluster was as dense as solid state, the incident cluster penetrated the target surface and generated crater-like damage. On the other hand, as the cluster radius increased and the irradiation particle density decreased, the depth of crater caused by cluster impact was reduced. MD results also revealed that crater depth was mainly dominated by the horizontal scaling rather than vertical scaling. A high sputtering yield of more than several tens of Si atoms per impact was observed with clusters of 4-20× lower volume density than solid state.     

HRBS/channeling studies of ultra-thin ITO films on Si

High-resolution Rutherford backscattering spectroscopy (HRBS)/channeling techniques have been utilized for a detailed characterization of ultra-thin indium tin oxide (ITO) films and to probe the nature of the interface between the ITO film and the Si(0 0 1) substrate. Channeling studies provide a direct measure of the lattice strain distribution in the crystalline Si substrate in the case of amorphous over layers. The measurements on DC magnetron sputtered ITO films have been carried out using the recently installed HRBS facility at the Centre for Ion Beam Applications (CIBA). The thickness of the ultra-thin (∼9.8 nm) ITO films was calculated from the HRBS spectra having an energy resolution of about 1.4 keV at the superimposed leading (In + Sn) edge of the ITO film. The films were near stoichiometric and the interface between ITO film and Si was found to include a thin SiO_x transition layer. The backscattering yields from (In + Sn) of ITO were equal in random and channeling directions, thereby revealing the non-crystalline nature of the film. Angular scans of HRBS spectra around the off-normal [1 1 1] axis clearly showed a shift in the channeling minimum indicative of compressive strain of the Si lattice at the SiO_x/Si interface. The observed strain was about 0.8% near the interface and decreased to values below our detection limits at a depth of ∼3 nm from the SiO_x/Si interface.     

Structural characterization of Fe/Ag bilayers by RBS and AFM

Fe/Ag thin films are intensively investigated due to their special magnetic properties. Recently a deposition-order dependent asymmetric interface has been found. When iron is grown on silver, the interface is sharp, while the growth of Ag on Fe results in a long, low-energy tail of the Ag peak in the Rutherford backscattering spectrometry (RBS) spectra. The main purpose of this paper is to show that the low-energy Ag tail is caused by grain boundary diffusion, and that, when elevating the growing temperature of the Ag layer this effect becomes more significant. Two sets of polycrystalline and epitaxial Fe/Ag bilayers were prepared simultaneously onto Si(1 1 1) and MgO(1 0 0), respectively. The iron layers were grown at 250 °C and annealed at 450 °C in both sets, while the Ag layer was grown in the first set at room temperature (RT) and in the second set at 250 °C (HT). The sample composition, the interface sharpness and the quality of the epitaxy were studied by Rutherford backscattering spectrometry (RBS) combined with channeling effect. The surface morphology was determined by atomic force microscopy (AFM). RBS spectra show that in the case of RT samples the epitaxial MgO/Fe/Ag bilayer has sharp, well-defined interface, while for the polycrystalline Si/Fe/Ag sample the silver peak has a low-energy tail. Both the Fe and Ag peaks smeared out in the case of HT samples. AFM-images show that the RT samples have a continuous Ag layer, while the HT samples have fragmented surfaces. The RBS spectra taken on the HT samples were successfully simulated by the RBS-MAST code taking into account their fragmented structures.     

Ion energy dependence of interface parameters of ion beam sputter deposited W/Si interfaces

W thin films and W/Si/W tri-layer samples have been deposited on c-Si substrates in a home-made ion beam sputtering system at 1.5 × 10⁻³ Torr Ar working pressure, 10 mA grid current and at different Ar⁺ ion energies between 600 and 1200 eV. Grazing incidence X-ray reflectivity (GIXR) measurements in specular and diffused (detector scan) geometry have been carried out on the above samples. The measured GIXR spectra were fitted with theoretically simulated spectra and the different interface parameters viz., interface width, interface roughness and interface diffusion have been estimated for both Si-on-W and W-on-Si interfaces in the above samples. The variation of the above interface parameters as a function of ion energy used for W sputtering has been studied.