超声波振动冲击对锯切过程中锯片自锐性的影响研究

超声波振动辅助加工是一种很好的加工硬脆材料的方法,而且超声波振动冲击能够对金刚石磨具进行修锐。通过观察氧化铝陶瓷材料超声波振动辅助锯切过程中金刚石锯片表面磨粒和结合剂形貌变化、测试分析锯切力及力比的变化特征,研究超声波振动冲击对锯切过程中金刚石锯片自锐性的影响。在超声振动辅助锯切过程中锯片结合剂可被连续地去除使得其工作表面不断有新的磨粒出露,而且金刚石磨粒保持着合适的出刃高度和容屑空间,磨粒表面还可以被微破碎形成微切削刃,因此,保持金刚石锯片工作面得以保持着稳定的锐利性,这也使得在锯切过程中的锯切力和力比不随锯切行程的累积而明显增大。     

超声振动辅助单晶硅划片的锯切力研究

采用金刚石超薄锯片对单晶硅划片的工艺会在划片时产生较大锯切力,从而导致较大的崩边损伤。而旋转超声辅助加工由于超声振动的作用可以减小加工时所产的切削力,同时获得较好的加工精度,越来越广泛地应用于硬脆材料的加工中。为了验证超声辅助对单晶硅划片中锯切力的作用,在实验中将超声振动添加到锯片上,使其产生径向的振动来完成对单晶硅的划片。并通过对比有超声振动辅助与无超声振动辅助的单晶硅划片的锯切力,对超声振动辅助划片中锯切力的特点进行分析。实验结果表明,超声辅助划片所产生的锯切力比无超声辅助划片所产生的锯切力小,说明超声振动的添加可以降低锯切力。同时在超声划片中产生的崩边要小于非超声加工条件下的崩边情况,说明超声振动降低锯切力可抑制硅片的崩边。     

超精密车削单晶硅刀具振动频谱分析

为了在线监测单晶硅超精密车削的脆塑转变现象及分析单晶硅车削过程中材料的微纳去除方式,采用圆弧刃金刚石刀具对单晶硅（100）晶面进行了超精密车削,研究了单晶硅超精密车削时刀具振动频谱分布与切削参数的关系,并对刀具振动频谱的变化规律及其演变机理进行了分析.结果表明,刀具振动频谱分布与刀具和单晶硅接触方式、单晶硅微纳去除模式密切相关.当单晶硅的去除模式从脆性域过渡到塑性域时,材料由崩碎状脆性去除方式转变为以剪切滑移变形为主的塑性去除方式,刀具振动频谱高频段信号增多,且振动总能量增大;塑性域车削时,切削速度越小、切削深度越大、进给量越大,材料微观剪切变形区内位错滑移数量越多,刀具振动频谱高频段信号越多,刀具振动主总能量越大.切削速度、进给量、切削深度对刀具振动频谱分布的影响依次减小,采用合理的切削参数,可以降低切削系统的总体振动.     

铝基碳化硅复合材料超声振动辅助划痕表面形貌研究

为了揭示SiCp/Al复合材料超声振动加工的去除机理,开展针对SiCp/Al复合材料的超声振动辅助划痕(UVAS)和普通划痕对比实验,从划痕形貌方面进行UVAS和普通划痕对比分析。结果表明,普通划痕凹槽处出现大颗粒的破碎,而UVAS凹槽表面则呈现较多的细小碎屑;超声划痕的材料去除率比普通划痕的大。超声振动的引入对改善加工表面形貌有明显作用,是SiCp/Al精密加工的有效方法。     

二维超声振动辅助化学机械磨削技术及单晶硅实验

为了提高材料去除率和加工通用性,本文提出了工具施加二维超声波振动辅助的化学机械磨削(CMG)复合加工方式,开发具有伸缩和弯曲两种模态的二维超声波振动子及实验装置.以单晶硅片为加工对象,进行单点切削加工轨迹特性分析,并比较不同加工模式以及加工参数对表面粗糙度和材料去除率的影响.实验结果表明,二维超声辅助下的单点切削轨迹存在更多延性加工趋势.在同样普通机床精度条件下,随着时间的增加,二维超声辅助CMG表面粗糙度明显改善,达到纳米级.较无超声情况下二维超声波辅助CMG复合加工材料去除率提高约1倍,可获得最优表面粗糙度5 nm,一维径向超声辅助加工结果次之.     

基于ANSYS的圆锯片基体的振动特性研究

针对圆锯片在锯切石材的过程中出现的振动噪声问题,利用ANSYS进行模态分析,得出锯片基体振动固有频率和振型,计算分析了锯片厚度、夹径比、消音缝对锯片模态的影响;此外还重点对开消音缝圆锯片及未开消音缝锯片进行瞬态响应分析,对开消音缝圆锯片的减振降噪机理进行初步探讨。研究表明圆锯片基体固有频率随厚度、夹径比的增大而增大,可以通过改变几何参数提高锯片刚度,达到减振降噪效果;开消音缝基体比未开消音缝基体的固有频率要低,区别于提高刚度减振措施,开消音缝锯片则是通过阻断振动波的传播路径,使锯片的整体振动响应减小,达到减振降噪效果。     

施振方向对超声辅助铣磨氧化锆陶瓷的影响

为研究不同方向的超声振动冲击对铣磨加工氧化锆陶瓷的影响规律,基于压痕断裂力学模型,理论分析对工件施加平行和垂直于进给方向的振动时磨粒加工过程,开展不同参数下的磨削试验并对其加工后表面进行检测分析。结果表明:平行施振时工件受到的轴向力F_z和材料去除率(MRR)较之于垂直施振大,但垂直施振方式下工件表面粗糙度Ra更小;在所研究的加工参数中,施振方向是影响工件表面粗糙度的最显著因素;另外,不同施振方式下材料主要去除方式有所差异。     

高性能压电陶瓷纤维复合元件

美国海军资助 Advanced Cerametics Inc. ( ACI)进行高性能压电陶瓷纤维复合超声探头、声纳和振动元件的研究。去年 ,宾西法尼亚州立大学制备的整体单晶压电材料性能较传统压电材料性能提高近 10倍。而 ACI利用其陶瓷纤维加工技术制备的超声发生器 ,由于压电元件中垂直放置的纤维只能沿长度方向振动 ,大大提高了成像清晰度。该研究将结合单晶技术和 ACI的陶瓷纤维技术 ,考虑使单晶在高温下沿很细的纤维的长度方向生长 ,从而提高超声元件的性能高性能压电陶瓷纤维复合元件@杜林虎     

磨粒刮擦诱导单晶镍微结构演化与塑性去除行为的纳观分析

基于分子动力学模拟,从原子水平研究了单晶镍刮擦诱导的微结构演变和塑性去除,重点分析了不同晶面的微结构演变特征和塑性去除差异,阐明了在滑动刮擦和滚动刮擦工况下塑性的去除规律,揭示了微结构演化和塑性去除的机制。结果表明,在紧密接触区产生的应力集中不仅是单晶镍位错滑移的源动力,而且是FCC结构向HCP结构转变和材料塑性去除产生磨屑的主因。发生磨粒刮擦时Ni(110)晶面出现最大的水平切向力,磨粒刮擦时在Ni(110)晶面内形成了具有水平滑移特征的HCP结构,其中位错滑移是其磨屑比Ni(100)和Ni(111)晶面多的主因。在同等刮擦条件下,Ni(110)晶面的塑性环脱落行为滞后。同时,密排堆垛层错行为和磨损表面的剪切应变都表现出显著的晶面选择性。与滑动刮擦相比,滚动刮擦时镍原子显著地粘附于磨粒的外表面,是切向力在刮擦过程中大幅度振荡的主要原因。     

微磨削与超声振动复合加工技术研究现状与展望

微细切削技术是传统加工工艺向微观尺度的延伸,在微加工领域具有重要的作用,尤其适用于三维零件及微结构的加工。与其他微细切削技术相比,微细磨削技术具有加工零件棱边精度高、适于硬脆性材料加工等优势,但其存在加工效率低、磨削热量大、微砂轮易磨损等缺陷。已有研究表明,于机械加工辅加超声振动的复合加工技术可有效降低切削力、切削温度,增大脆性材料脆-塑转变临界切削深度,改善加工表面质量等。因而超声振动辅助微磨削技术被认为是一种可有效解决微磨削加工现存缺陷的技术。主要从微磨削技术研究现状、尺寸效应机理研究、脆性材料塑性域去除机理研究、超声振动切削实验研究、超声振动切削断续切削机理研究及微磨削动态有效磨刃密度建模研究六个方面,对微磨削技术及超声振动辅助切削技术相关领域研究进行综述,并探讨超声振动辅助微细磨削技术加工机理研究及未来发展需注重解决的问题。     

Prevailing Mechanisms for Circular Sawing of Granites with Diamond Impregnated Segments

Coupled with micro-observations on the worn segment surfaces, which is the main approach followed in past research, a quantitative analysis of the sawing energy and forces was carried out for studying the prevailing mechanisms for circular sawing of granites with diamond impregnated segments. Based on the micro-observations, the wear behavior of the diamond grains can be broadly classified as four types which cannot quantitatively account for the prevailing mechanisms, even though they provide important insights into the sawing process. The quantitative analysis on sawing energy, forces, together with microscopic observations of sawing debris and surfaces produced, suggests that the prevailing mechanism for sawing should be governed by both sliding friction, by which most of the sawing energy is expended, and brittle fracture, by which the workpiece material is mainly removed. The specific energy is found to be proportional to the sliding length per unit volume of material removal.     

Machining damage of monocrystalline silicon by specific crystallographic plane cutting of wire electrical discharge machining

The machining damage on the certain crystal face of single crystal silicon, the manufacture of which are under diverse parameters of wire electrical discharge machining (WEDM), is tested by means of the micro-observation and X-ray diffraction rocking curve method. In the process of monocrystalline silicon machined by WEDM, when the pulse width is small, the basic methods of material removal are melting and gasification, which are also called normal removal methods. When the pulse width increases to a certain degree beyond the normal removal, thermal spalling removal also occurs, which is considered a compound removal method. The depth of machining damage is difficult to control. The structure of machining damage under two conditions is divided into normal removal and compound removal in this study. To make the depth of machining damage easy to control, compound removal should be avoided when processing the single crystal silicon by certain crystal face cutting of WEDM. Such an approach can provide the premise and guarantee for the subsequent processing of single crystal silicon with certain crystal face in the future.     

Finite element simulations of ultrasonically assisted turning

Ultrasonically assisted turning is a promising machining technology, where high frequency vibration (f≈20 kHz) with an amplitude a≈10 μm is superimposed on the movement of the cutting tool. Ultrasonic turning yields a noticeable decrease in cutting forces, heat and noise radiation, as well as a superior surface finish, comparing to the conventional machining technology. The present study utilizes both experimental techniques and numerical (finite element) simulations to analyze the microstructural processes at the cutting tool–chip interface. High-speed filming of the chip–tool interaction zone during cutting and microstructural and nanoindentation analyses of the machined surfaces are used to compare process zones and deformation processes for both conventional and ultrasonically assisted technologies. The suggested finite-element (FE) model, which utilizes MSC Marc/Mentat general FE code, provides a transient analysis for an elasto-plastic material, accounting for the frictionless contact interaction between a cutter and workpiece as well as material separation in front of the cutting edge. A detailed analysis of cutting for a single cycle of ultrasonic vibration is carried out for isothermal conditions. Differences between conventional and ultrasonic turning in stress distribution in the process zone and contact conditions at the tool/chip interface are investigated.     

Study of milling force variation in ultrasonic vibration-assisted end milling

Ultrasonic vibration cutting has been proved to be an effective cutting technology for its excellent cutting performance and has been widely applied in turning and drilling process. However, this kind of technology is rarely tried in milling process. In cutting process, cutting force is an important process parameter, which affects surface finish and tool wear. This paper investigates the milling force variation in ultrasonic vibration-assisted end milling process through a series of slot-milling experiments. The main research contents include two parts, one is the effect of the externally excited vibration on milling force in milling process, and the other is the influence of milling and vibrating parameters matching on milling force value. Experimental results show that ultrasonic vibration can change traditional milling conditions, realize separate-type milling, obtain similar pulse-like profiles of cutting forces, reduce average cutting force value; and the peak value of the feed direction cutting force can also be greatly decreased by adopting reasonable vibration amplitude, an optimal combination of machining parameters is of great benefit to achieving small cutting force. According to the experimental findings, ultrasonic vibration-assisted milling is a prospective technology to achieve precision milling of small part.     

A mechanism of diamond-abrasive finishing of monocrystalline silicon carbide

The investigation of the mechanism of diamond-abrasive finishing of monocrystalline silicon carbide on the basis of a generalized model of formation and removal of debris particles and material removal has demonstrated that the use of specific value of the energy of transfer as a criterion for the assessment of machining efficiency permits substantiating suitability of boron carbide and titanium dioxide powders for fine grinding and of chromium oxide, alumina, ceric oxide, and ASM 2/1 diamond micron powders for ultrafine grinding.     

单激励纵扭复合超声铣削系统研究

针对切削、焊接过程中超声复合振动能获得较高加工质量、效率及有助于延长刀具使用寿命,研究分析纵扭复合超声铣削系统运动特性及切削轨迹特征;基于斜梁振动原理,提出加工工艺简单、制造成本低的斜梁式超声变幅杆,并利用有限元软件ANSYS进行结构动力学分析, 证实通过单向激励可产生纵扭复合振动;应用研制的纵扭复合超声振动铣削系统对碳纤维复合材料进行切削试验,获得较好加工效果,从而验证理论分析与数值模拟结果的正确性。     

立方碳化硅CMP过程中机械作用分子动力学仿真

为了更好地理解立方碳化硅在化学机械抛光(CMP)过程中原子层面的材料去除机理,利用分子动力学(MD)方法建立了金刚石磨粒刻划碳化硅的原子模型,仿真研究了金刚石磨粒半径、刻划深度和刻划速度对碳化硅表面形貌、晶体结构、摩擦力和原子去除率的影响规律,并与无定型二氧化硅氧化膜的机械刻划作用的仿真结果进行了对比分析.结果发现:碳化硅在机械刻划过程中局部会出现非晶态变化;刻划深度增大会导致切削力和切削温度增大,原子去除率也随之增加;刻划速度的改变会影响温度和原子去除率,而对切削力几乎无影响;磨粒半径的增加会导致切削力和温度的增加,在压入深度相同的情况下对原子去除率影响不大;碳化硅表面生成的二氧化硅膜能大幅度降低切削力,但由于其结构的影响,机械刻划作用仅使氧化膜产生明显的致密化,而不产生磨屑.