延性金属层裂强度对温度、晶粒尺寸和加载应变率的依赖特性及其物理建模

层裂强度表征了材料内部最大动态抗拉能力,并与材料本身的力学性质以及损伤早期演化相关.建立层裂强度计算的解析表达式,深入认识层裂强度所包含的微细观物理涵义,有利于更好地优化延性金属材料的层裂强度.目前大量的实验表明:延性金属材料的层裂强度对加载拉伸应变率、温度效应以及材料初始微细观结构具有很强的依赖关系.本文基于对孔洞成核与增长的损伤早期演化特性的分析,以及对温度效应和晶粒尺寸与材料本身力学性质之间关系的分析,给出了简单、实用的层裂强度的解析物理模型,物理模型的计算结果与典型延性金属高纯铝、铜和钽的层裂强度实验结果基本符合,从而验证了我们给出的层裂强度模型具有较好的适用性和预测性.     

基于单孔洞近似的高纯铝部分层裂实验的数值模拟研究

基于单孔洞近似,对不同撞击速度下高纯铝的部分层裂实验进行了数值模拟研究,讨论了微孔洞长大对波传播的影响及其在自由面速度波剖面上的表现. 通过分析微孔洞周围的应力场变化,认识到实测自由面速度波剖面出现"回跳"特征并不能说明材料发生完全层裂,其直接原因是样品内部微孔洞长大所引起的局部卸载效应. 将计算得到的自由面速度波剖面和微孔洞相对体积与实验结果进行了对比分析,发现两者均符合很好,表明采用单孔洞增长来近似描述部分层裂样品中随机损伤发展及其对波传播的影响是可行的. 关键词： 层裂 孔洞增长 自由面速度波剖面 微孔洞相对体积     

强激光加载铝材料动态损伤特性及其微介观结构观测

在神光-Ⅱ装置上利用强激光加载铝材料进行高应变率(高于106s-1)层裂实验,研究不同初始温度下高纯铝材料的动态损伤特性。采用任意反射面速度干涉仪测量样品自由面速度剖面,由自由面速度剖面计算纯铝样品层裂强度与屈服应力。结果表明:随着温度升高,材料层裂强度减小,屈服应力增大。对激光加载前后样品进行金相分析,观察不同初始温度下纯铝材料的微介观结构变化及其损伤特性。结果表明:随着温度升高,样品晶粒尺度缓慢增大,但在873K(近熔点)时晶粒尺度急剧增加;层裂面附近小孔洞数目较多,孔洞尺寸也较大,而远离层裂面处,孔洞数目相对较少,且尺寸也较小;材料的断裂方式随温度升高由沿晶断裂为主逐渐变为穿晶断裂为主。     

高纯铝层裂的自由面速度剖面特征分析

 采用任意反射面激光干涉测速（VISAR）系统,对高纯铝（纯度为99.999%）材料开展了层裂实验研究,获得了未完全层裂和完全层裂样品的自由面速度剖面。基于实验测量中观察到的层裂回跳（Pullback）信号的脉冲宽度、速度幅值差异以及回跳信号上升过程中的两次速度斜率变化特征,详细讨论了高纯铝材料从出现损伤到完全断裂的过程中波剖面演化的行为特征。结合“软回收”样品的细观分析,指出这些自由面速度变化特征可能与材料中应力波的能量释放速率以及材料中晶粒的断裂行为密切相关。研究结果可以为延性金属损伤断裂的演化过程提供有意义的认识。     

平面冲击下铜的拉伸应变率相关特性研究

本文对冲击加载下高纯无氧铜的拉伸应变率相关特性进行了实验研究.实验中利用磁测速系统测试撞击前飞片速度,利用光纤位移仪——多普勒探针系统测试样品自由面粒子速度剖面.对自由面速度剖面的特征参量进行计算分析,结果表明:铜样品的层裂强度随着拉伸应变率的增加而增加,对比发现层裂强度不仅受加载条件的影响,同时受到材料本身微细观结构影响;同时随着拉伸应变率的增加,自由面速度的回跳斜率呈现出先缓慢增加后迅速增加的临界特性;最后,通过层裂样品中波系相互作用,给出了自由面速度回跳过程中的振荡特征随着拉伸应变率增加而逐渐消失的物理过程.     

加载应力幅值对高纯铜动态损伤演化特性研究

研究了加载应力幅值对延性金属高纯无氧铜动态损伤演化特性的影响. 层裂实验在一级轻气炮上开展, 利用不同的飞片击靶速度实现不同加载应力幅值(2.5 GPa, 2.75 GPa和3.75 GPa), 采用DISAR位移干涉诊断技术测量样品自由面的速度剖面, 利用基于白光轴向色差的表面轮廓测试技术测试软回收的样品截面. 结果显示: 随着加载应力幅值的升高, 层裂强度几乎没有变化, 但自由面速度剖面上Pull back信号后的回跳速率和幅值显著增大, 损伤演化速率显著升高.进一步分析表明: 延性金属动态损伤演化过程中微孔洞成核对加载应力幅值单一因素不敏感, 但加载应力幅值是微孔洞长大和聚集的主导因素之一.     

延性金属材料损伤断裂微观机制

材料的层裂是武器设计中需要考虑的重要问题之一。对延性材料而言,层裂过程包括微孔洞的成核、增长和贯通3个阶段,因此认识孔洞在冲击加载下的演化过程,对研究延性断裂具有重要意义。我们以典型延性金属材料——单晶铜作为研究对象,利用分子动力学方法对孔洞演化相关问题进行了研究。     

非一维应变冲击加载下高纯铜初始层裂行为

提出了一种锥形靶层裂实验新方法,开展非一维应变冲击条件下高纯铜初始层裂行为实验研究,讨论了锥形靶内部损伤分布特征及其与自由面速度典型特征之间的内禀关系.结果显示:1)初始层裂的锥形靶内部出现了连续损伤区,损伤区扩展方向与锥面平行,从锥底到锥顶呈现了不同的损伤状态,从微孔洞独立长大到局部聚集,最后形成宏观裂纹,这种损伤状态分布特征归因于锥形靶内部拉伸应力幅值和持续时间的空间演化;2)通过锥形靶横截面损伤度定量统计分析,揭示损伤演化早期的微孔洞成核与早期长大过程是随机的,而损伤演化后期的微孔洞聚集过程具有显著的局域化特征;3)不同位置处实测的自由面法向粒子速度剖面呈现出典型的层裂Pull-back信号,但是通过与内部损伤分布特征对比,揭示基于Pull-back速度获得高纯铜层裂强度本质是微孔洞成核阈值应力,Pull-back回跳速度斜率反映了损伤演化速率,Pull-back回跳幅值与损伤度引起的应力松弛密切相关.     

惯性及弹塑性效应对延性金属材料层裂损伤的影响

本文以空心球壳模型为基础,在飞片加载条件下,讨论了惯性、弹塑性效应以及初始孔洞大小对材料层裂损伤的影响.分析结果表明,在研究材料层裂损伤问题时,惯性、弹塑性效应以及初始孔洞大小的影响是不能忽略的,特别是初始孔洞大小的影响.同时,鉴于初始孔洞大小的重要影响,本文尝试给出了一个分析初始孔洞尺寸的方法. 关键词： 层裂损伤 惯性 弹塑性效应 初始孔洞     

材料层裂研究的主要进展

层裂是一种重要的动态损伤破坏现象,由物质界面的反射稀疏波相互作用引起,其细观尺度上的物理机制是微损伤(即微孔洞和微裂纹)的成核、生长和汇合。围绕美国物理学会George E. Duvall冲击压缩科学奖的3位获奖者Grady、Curran和Johnson的相关工作,概述层裂现象的一些主要研究进展,简要介绍层裂现象的研究历史,以期更深刻地理解那些著名的层裂物理模型和实验技术。此外,报道了最近取得的最新研究成果,阐述了冻结不同损伤水平状态的双层靶层裂实验技术与Hopkinson压杆共通的工作原理。针对微损伤成核和生长断裂破碎模型NAG/FRAG在数学上的不一致性和在物理上的不完备性,指出对于延性材料的层裂过程,只要微孔洞成核的累积数目密度满足尺寸的指数分布、微孔洞半径的生长速度与半径呈线性关系,就能够得到解析形式的损伤度演化方程,该修正模型MNAG在数学上是一致的,在物理上是完备的;对于白以龙等建立的欧拉形式的微损伤数目守恒方程,指出计算损伤度不必显式求解该方程,损伤度的表达式一般通过拉格朗日形式的微损伤数目守恒方程获得;针对损伤度函数模型或封加坡模型,以更加简洁的方法进行了推导。     

Influence of boundary structure and near neighbor crystallographic orientation on the dynamic damage evolution during shock loading

The role of crystallographic orientation on damage evolution in ductile metals during shock loading has been investigated. By utilizing large-grained copper specimens, it has been shown that the development of intragranular damage, in the form of void growth and coalescence, is influenced by the grain orientation with respect to the applied load. Additionally, strain incompatibility and the inability to promote transmission or activation of secondary dislocation slip across a grain boundary, are proposed as the likely cause for intergranular failure. Finally, the free surface velocity profiles of each grain, specifically the decay of the oscillations after the pull-back, correlated well with the amount of damage measured within the respective grain.     

强冲击载荷下含杂质的纯铝中微孔洞长大的动力学行为

采用LS-DYNA瞬态动力学有限元程序,对平板撞击加载下含初始杂质的纯铝样品中微孔洞的成核与长大进行了数值模拟。结果表明:微孔洞首先在杂质与基体的边界处成核,随后在局部严重塑性变形驱动下快速线性增长;微孔洞半径的增长速率与冲击加载强度两者之间近似成线性关系;材料屈服强度和初始杂质的大小对微孔洞相对的增长速率有明显的影响;当微孔洞长大阈值取屈服强度的3.5倍时,数值仿真结果与理论分析结果基本一致,这有助于进一步认识孔洞长大的动力学行为。     

Modelling of spall damage in ductile materials and its application to the simulation of plate impact on copper

A statistical model of dynamic spall damage due to void nucleation and growth is proposed for ductile materials under intense loading, which takes into account inertia, elastic-plastic effect, and initial void size. To some extent, void interaction could be accounted for in this approach. Based on this model, the simulation of spall experiments for copper is performed with the Lagrangian finite element method. The simulation results are in good agreement with experimental data for the free surface velocity profile, stress record behind copper target, final porosity, and void concentrations across the target. The influence of elastic-plastic effect upon the damage evolution is explored. The correlation between the damage evolution and the history of the stress near the spall plane is also analyzed.     

Modelling of spall damage in ductile materials and its application to the simulation of the plate impact on copper

A statistical model of dynamic spall damage due to void nucleation and growth is proposed for ductile materials under intense loading, which takes into account inertia, the elastic-plastic effect, and initial void size. To some extent, void interaction could be accounted for in this approach. Based on this model, the simulation of spall experiments for copper is performed by using the Lagrangian finite element method. The simulation results are in good agreement with experimental data for the free surface velocity profile, stress record behind copper target, final porosity, and void concentrations across the target. The influence of elastic-plastic effect upon the damage evolution is explored. The correlation between the damage evolution and the history of the stress near the spall plane is also analyzed.     

Effects of void shape and orientation on the elastoplastic properties of spheroidally voided single-crystal and nanotwinned copper

ABSTRACT

Void nucleation, growth and coalescence have been identified as the leading cause of ductile damage in metallic materials. To understand the underlying deformation and damage mechanisms, extensive theoretical, experimental and simulation efforts have been attempted on spherically voided metals. In this work, molecular dynamics simulations are performed to analyze the uniaxial straining deformation behaviours of both single-crystal and nanotwinned copper materials embedded with a preexisting spheroidal void. The coupling effects among twin boundary, spheroidal void aspect ratio and orientation on unidirectional elastoplastic behaviours are systematically examined. The dislocation-induced plastic deformation mechanism is also examined and compared with the one due to a perfectly spherical cavity. Simulation results show that elastic modulus increases with both spheroidal void aspect ratio and orientation. So do the yield stress, the first peak stress and the plasticity index. Another peak stress exists for most cases, except for a prolate void embedded in nanotwinned specimens. The slope between peak stresses decreases with both the spheroidal aspect ratio and orientation. The incorporation of a twin boundary results in lower elastic modulus, higher yield strength and smaller plasticity index. For an oblate void, the twin boundary gives rise to more severe strain softening behaviour. The dislocation extraction algorithm illustrates that the continuous nucleation, propagation and reaction of dislocations emanated from both the void front and twin boundary are responsible for the ductile damage of spheroidally voided crystals. The lower dislocation densities found in nanotwinned specimens indicate the desired suppression effects of twin boundary on dislocation activities.     

Harnessing atomistic simulations to quantify activation parameters for dislocation nucleation from a grain boundary in Nickel

We perform atomistic simulations and nudged elastic band calculations to quantify activation energy barriers for dislocation nucleation from ∑3 grain boundary containing a pre-existing void in Ni. By changing the void size, we offer a phenomenological relationship between the activation free energy at zero stress and boundary porosity. Simulations at different temperatures are also conducted to gain some insights into the inherent intricacies of activation energy landscape. It is envisioned that the approach can be pushed forward to guide the flow rules of physics based crystal plasticity models at higher length scales that account for grain boundary effects.     

A study of void size growth in nonequilibrium stochastic systems of point defects

We study properties of voids growth dynamics in a stochastic system of point defects insolids under nonequilibrium conditions (sustained irradiation). It is shown thatfluctuations of defect production rate (external noise) increase the critical void radiuscomparing to a deterministic system. An automodel regime of void size growth in astochastic system is studied in detail. Considering a homogeneous system, it is found thatexternal noise does not change the universality of the void size distribution function;the mean void size evolves according to classical nucleation theory. The noise increasesthe mean void size and spreads the void size distribution. Studying dynamics of spatiallyextended systems it was shown that vacancies remaining in a matrix phase are able toorganize into vacancy enriched domains due to an instability caused by an elastic latticedeformation. It is shown that dynamics of voids growth is defined by void sinks strengthwith void size growth exponent varying from 1/3 up to 1/2.     

Orientation dependence of void growth at triple junction of grain boundaries in nanoscale tricrystal nickel film subjected to uniaxial tensile loading

Molecular dynamics simulation was performed in order to investigate the dependence of void growth on crystallographic orientation at the triple junction of grain boundaries in nanoscale tricrystal nickel film subjected to uniaxial tensile loading. The nucleation, the emission and the transmission of Shockley partial dislocations play a predominant role in the growth of void at the triple junction of grain boundaries. The orientation factors of various slip systems are calculated according to Schmid law. The slip systems activated in a grain of tricrystal nickel film basically conform to Schmid law which is completely suitable for a single crystal. The activated slip systems play an important role in plastic deformation of nanoscale tricrystal nickel film subjected to uniaxial tensile loading. The slip directions exhibit great difference among the activated slip systems such that the void is caused to be subjected to various stress conditions, which further leads to the difference in void growth among the tricrystal nickel films with different orientation distributions. It can be concluded that the grain orientation distribution has a significant influence on void growth at the triple junction of grain boundaries.