电力电子集成模块用平板热管的传热研究

 为了解决高封装密度的电力电子集成模块所面临的热集中问题,本文提出了一种在蒸发端和冷凝端设置有工质回流柱的垂直传热平板热管用以替代传统电力电子集成模块的纯铜基板,并对该模块的传热性能进行了研究.研究结果表明,在186W/cm²的热载荷下,热管基板蒸发端的高对流换热系数削弱了模块的热集中现象,其结壳热阻是商用铜基板模块热阻的一半,并且热管基板在正反放置的情况下具有相同的散热性能.集成模块在225W的脉宽热载荷冲击下,管芯的瞬态最高温度比商用模块低46℃.     

一种均温板加速条件下性能试验研究

针对机载电子设备散热应用条件,研究热管均温板在机载加速环境下的传热性能。为提高热管散热稳定性,将热源布置在热管中部,热管两端作为散热端。试验中试验单元安装在离心加速机上,模拟机载加速环境,测试了不同加速度条件下热管传热性能,得到热管均温板当量导热系数变化曲线,分析了加速度对热管当量导热系数的影响。试验结果表明:在0 ~13g加速条件下,热管均温板均能正常工作。结合试验结果给出热管均温板用于机载电子设备散热的设计建议。     

基于热管散热的人功率LED热特性测量与分析

提出了一种新型结构的同路热管,建立了回路热管性能测试试验装置.在相同的测试条件下,研究了热负荷、倾角等对回路热管的起动特性和均温特性、热阻等传热性能的影响.试验结果表明,热管散热器的热阻在0.21 K/W～2.6 K/W之间,且整个散热器具有均匀的温度分布.与当前的LED散热器相比,这种结构的热管散热器具有散热效率高、结构紧凑、加工方便、热阻小、重量轻、成本低等特点,可以满足大功率LED散热的要求.     

并行多通道大功率LED回路热管散热器

为解决大功率LED散热问题,构造了一种一体化并 行多通道大功率LED回路热管散热器。利用水作为工质,在不同加热功率、不同倾斜角以及 不同充液比条件下对该新结构热管散热器的热性 能进行了研究。结果表明,这种新结构热管散热器不仅能使散热器上下底板处于均温状态, 而且当芯片加 热功率达到200W时,芯片加热面中心最高温度不超过71.8℃;倾斜角度对热管换热性能影响不大;在一 定加热功率范围内,新结构热管散热器的热阻随加热功率的增大而减小,当芯片加热功率达 到240W时, 热阻最小,最小可达0.19K/W。构造的一体化并行多通道大功率LED 回路热管散热器具有很好的传热性能,并提高了承载高热流密度的能力。     

微波功率放大器的热管散热设计

随着微波功率放大器热功耗的增加和小型化,如何改善散热问题变得越来越重要,理想的热设计能够保证放大器长期工作。放大器在真空环境下以热传导和辐射散热为主,嵌入在盒体底部的热管具有很高的热传导率。放大器产生的热量以传导的方式传到盒体和热管,热管迅速把热量传导到散热器上,散热器的翅片通过辐射把热量散发出去。论述了在真空环境下微波功率放大器热管散热的设计方法,用ICEPAK CFD热分析软件进行热仿真。微波放大器通过热真空试验,可以工作正常,实验表明热管散热是真空环境下大功率放大器热设计的有效方法。     

LED简灯热管散热器的试验研究及性能评价

为获得基于自然对流的异型热管散热器用于LED筒灯的工作性能,研制了热管散热器试验件,并进行了试验研究。结果表明：热管散热器启动性能良好,启动时间约为33min;散热器具有较好的均温性能,40W时蒸发面最大温差为4．7℃;在试验条件下,热源表面最高温度不超过70℃;加热功率对接触热阻、扩散热阻和热管热阻基本无影响,而翅片换热热阻随加热功率的增加而减小。基于试验所得结果,并通过热阻网络分析,论证了异型热管散热器可满足LED筒灯散热的需求。     

大功率LED排式热管散热器的开发及性能研究

开发了一种应用于大功率LED散热的排式热管散热器。在大空间自然对流冷却环境中,分别在0°、30°、60°、90°放置条件下对其启动性能、均温特性、散热性能进行了试验研究。试验结果表明:散热器启动性能良好,启动时间约为67min;在输入功率为30～70W的范围内,热源表面中心点温度不超过75℃;各倾角下散热器均具有较低的总热阻及扩散热阻,0°放置时总热阻最小。基于试验所得结果,通过计算LED结温论证了排式热管散热器在各倾角条件下均可满足热输出70W以下大功率LED散热的需求。     

大功率晶体管热管散热器的设计

本文详细闸述了我们首次研制的大功率热管散热器的设计,测试等问题。本文介绍的热管散热器设计的基本理论根据是P. D邓恩教授和D. A雷伊教授的热管理论。根椐他们的介绍进行了热管散热器工作时的热阻分析。对热管从加热端表面到冷凝端表面的七个热阻进行了计算,并据此确定了热管散热器的基本尺寸、捕热端结构及散热肋片的大小。本文具体应用了热管的声速极限、毛细极限、携带极限等公式对所     

延伸波长InGaAs探测器封装用二级热电制冷器性能研究

真空封装技术是延伸波长InGaAs探测器的主要封装方法之一,热电制冷器可为延伸波长InGaAs探测器焦平面提供低温环境。测试了基于真空封装技术无热负载条件下二级热电制冷器的性能,研究了二级热电制冷器在不同输入电流(功率)时冷、热端温差与热负载的关系,测试了二级热电制冷器在低温工况下的制冷性能以及二级热电制冷器处于不工作状态时的表观热导率。结果表明,热沉温度为274 K时,冷端可以达到221.4 K并实现77.5 K的冷、热端温差;当输入电流一定时,随着热负载的增加,冷、热端温差呈线性趋势减小,且斜率随着输入电流增大而增大;二级热电制冷器冷、热端温差在较高温度时更大,即制冷性能更好;当温度分别为233.1 K 和249.8 K时,表观热导率分别为11.30 W/(m·K)和8.29 W/(m·K)。     

用于大功率LED冷却的热管散热器的实验研究

提出了一种将大功率发光二极管(LED)散热和热管传热相结合的用于大功率LED冷却的热管散热器新概念,并对设计出的热管散热器的传热性能和整体的均温性进行了试验研究.试验结果表明,热管散热器的热阻在0.21～2.6 K/W,且整个散热器具有均匀的温度分布.与当前的LED散热器相比,这种结构的热管散热器具有散热效率高、结构紧凑、热阻小、重量轻、成本低等特点,可以满足未来大功率LED散热的要求.     

应用于大功率LED器件的回路热管散热研究

为解决大功率LED的散热问题,提出一种应用于大功率LED散热的微型回路热管,研究了充液率和倾斜角度对热管冷却大功率LED的启动性能、结温和热阻等特性的影响.研究结果表明:热管的最佳充液率为60％,系统的总热阻为7.5 K/W,此时对应的热管的热阻为1.6 K/W;热管的启动时间约为6.5 min,LED的结点温度被控制在42℃以下,很好地满足了大功率LED的结温稳定性要求.     

地源热泵地埋管换热量影响因素

针对土壤热物性参数与热泵运行模式对地埋管换热量的影响进行分析,通过非稳态数值计算方法求解U型垂直埋管周围非稳态温度场的方法,提出按全年运行模拟的平均值作为地埋管每延米换热量的计算方法。并根据模拟结果,确定影响地埋管单位换热量的主要因素。为类似地源热泵系统的优化设计提供一定的参考。     

LED筒灯复合结构热管散热器的数值模拟

为解决LED筒灯使用单纯自然对流散热扩散热阻过大、温度分布不均的问题,提出一种基于平板热管和热虹吸管的复合结构热管散热器,并用数值模拟的方法研究了热功率、翅片高度、翅片数目、辐射换热对该散热器性能的影响。模拟结果表明应用于LED筒灯的复合结构热管散热器的热阻随着热功率的增加而减小,翅片高度和翅片数目存在一个最优值,使得散热器温度和热阻最小,自然对流情况下不可忽视辐射换热的作用。     

Study of Complete Thermoelectric Generator Behavior Including Water-to-Ambient Heat Dissipation on the Cold Side

Reduction of the thermal resistances of the heat exchangers of a thermoelectric generation (TEG) system leads to a significant increase in TEG efficiency. For the cold side of a thermoelectric module (TEM), a wide range of heat exchangers have been studied, from simple finned dissipators to more complex water (water–glycol) heat exchangers. As the Nusselt number is much higher in water heat exchangers than in conventional air finned dissipators, the convective thermal resistances are better. However, to conclude which heat exchanger leads to higher efficiencies, it is necessary to include the whole system involved in the heat dissipation, i.e., the TEM-to-water heat exchanger, the water-to-ambient heat exchanger, as well as the required pumps and fans. This paper presents a dynamic computational model able to simulate the complete behavior of a TEG, including both heat exchangers. The model uses the heat transfer and hydraulic equations to compute the TEM-to-water and water-to-ambient thermal resistances, along with the resistance of the hot-side heat exchanger at different operating conditions. Likewise, the model includes all the thermoelectric effects with temperature-dependent properties. The model calculates the net power generation for different configurations, providing a methodology to design and optimize the heat exchange in order to maximize the net power generation for a wide variety of TEGs.     

两种微型热管传热性能对比研究

以波形脉动热管和微槽平板热管为研究对象,基于Mixture模型构建了其三维非稳态数学模型,并对模型可靠性进行了验证。采用该数学模型对比了两种微型热管在相同散热空间和散热热流密度情况下的热阻、平均壁面温度和蒸发段壁面温度均匀性。结果表明:相对于微槽平板热管,波形脉动热管热阻更低,传热性能更好;波形脉动热管蒸发段稳态平均壁面温度更低,且随着热流密度的增加该优势更加明显;波形脉动热管在空间尺度上蒸发段壁面温度均匀性更好,且这种优势在高热流密度情况下更突出,但这种均匀性在时间尺度上变化相对剧烈。     

Thermal analysis of high power LED package with heat pipe heat sink

The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 °C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system.     

Disk-shaped miniature heat pipe (DMHP) with radiating micro grooves for a TO can laser diode package

A mounting base integrated with disk-shaped miniature heat pipe (DMHP) is designed for laser diode TO can package in the present study. The heat spreading performance of the disk-shaped miniature heat pipe is also presented. The present mounting base is made of aluminum (6061 T6) other than the conventional TO can package with oxygen free copper. The mounting base shows different thermal resistance with different working fluid charge volume. By optimizing the working fluid charge volume, the thermal resistance of the present mounting base will become lower than the conventional base with an oxygen free copper disk for TO can package. Moreover, this novel design can be manufactured on a massive scale and the fabrication cost can thus be effectively reduced.     

Limits of Heat Removal in Microelectronic Systems

Thermal management issues play an increasingly prominent role in microelectronic system design. The constraints on heat removal are a major factor limiting the performance of a microelectronic system. This work presents the thermodynamic limit of performance for a thermal solution utilizing air cooling to reject thermal energy as the inverse of its mass flow-heat capacity product. The minimum resistance to heat flow offered by a thermal solution is further refined by including the effects of thermal interface materials, substrate materials, and the impact of nonuniform device layer heating. Active cooling solutions may offer additional needed cooling for microelectronics systems, but the system thermal resistances limit its applicability. This work describes the minimum efficiency that an active cooling solution must provide to offer a thermal advantage over passive cooling. This minimum efficiency is dictated by the thermal resistances involved in drawing heat into the active cooler and expelling heat to the ambient environment. Knowledge of the fundamental limitations of thermal solutions gives system designers realistic expectations to set roadmaps, define architecture specifications, and evaluate the validity of thermal system performance claims     

热管散热器数值仿真模型

热管作为导热性能特别高的良好传热元件近年来得到不断重视而越来越多运用于散热器结构中。但关于热管数值分析的方法研究不多,未能有效指导热管散热器结构设计。文章分析了热管导热的基本原理和内部结构,提出了一种适合热管传热数值分析的简化热传导仿真模型,将热管的复杂热特性用简化模型的当量热传导系数来表达,利用所提出的简化热传导仿真模型对一实际散热器进行分析、实验验证了该仿真结果,并讨论了热管导热效能必要条件。