Towards thinner and low bowing silicon solar cells: form the boron and aluminum co‐doped back surface field with thinner metallization film

Using thinner wafers can largely reduce the cost of silicon solar cells. One obstacle of using thinner wafers is that few methods can provide good dopant concentration for the back surface field (BSF) and good ohmic contact while generated only in low bowing. In this paper, we have demonstrated the screening–printing B and Al (B/Al) mixture metallization film technique, making use of the screen‐printing technique and the higher solubility of B in silicon to form a B/Al‐BSF. This technique can raise the carrier concentration in the BSF by more than one order of magnitude and reduce the back surface recombination at a low firing temperature (≤800 °C). We have also shown that through the new technique, the metallization paste thickness at the rear could be reduced largely, which however did not degrade the solar cell efficiency. All these efforts are aiming for pushing forward the application of thinner wafers. Copyright © 2011 John Wiley & Sons, Ltd.     

High efficiency screen‐printed EFG Si solar cells through rapid thermal processing‐induced bulk lifetime enhancement

This paper shows that one second (1 s) firing of Si solar cells with screen‐printed Al on the back and SiN _x anti‐reflection coating on the front can produce a high quality Al‐doped back‐surface‐field (Al‐BSF) and significantly enhance SiN _x ‐induced defect hydrogenation in the bulk Si. Open‐circuit voltage, internal quantum efficiency measurements, and cross‐sectional scanning electron microscopy pictures on float‐zone silicon cells revealed that 1 s firing in rapid thermal processing at 750°C produces just as good a BSF as 60 s firing, indicating that the quality of Al‐BSF region is not a strong function of RTP firing time at 750°C. Analysis of edge‐defined film‐fed grown (EFG) Si cells showed that short‐term firing is much more effective in improving the hydrogen passivation of bulk defects in EFG Si. Average minority‐carrier lifetime in EFG wafers improved from ∼3 to ∼33 μs by 60 s firing but reached as high as 95μs with 1 s firing, resulting in 15·6% efficient screen‐printed cells on EFG Si. Copyright © 2004 John Wiley & Sons, Ltd.     

Impact of excess phosphorus doping and Si crystalline defects on Ag crystallite nucleation and growth in silver screen‐printed Si solar cells

Good quality contacts between metal and silicon emitter are crucial for high crystalline solar cell efficiencies. We investigate the impact of defects originating from electrically inactive phosphorus on contact formation within silver thick film metallized silicon solar cells. For this purpose, emitters with varying sheet resistance, depth, and dead layer were metallized with silver pastes from different generations. Macroscopic contact resistivity measurements were compared with the microscopic contact configurations studied by scanning electron microscopy. The density of direct contacts between Ag crystallites grown into Si and the Ag finger bulk is essential for low contact resistivity. The presence of glass‐free regions needed for such direct contacts depends on the paste composition and on the surface texture, and does not vary with the Si emitter properties. Indeed, the decrease in contact resistivity correlates with increasing density of Ag crystallites embedded in the Si surface. Furthermore, the density of Si surface‐embedded Ag crystallites scales proportional to the electrically inactive P and is independent of the sheet resistance. Using the newest silver paste, the Ag crystallite density is independent of the emitter doping, but the Ag crystallite size increases as a function of the thickness of the dead layer. Transmission electron microscopy characterization of the excess P‐doped Si crystal lattice shows that significant strain and Si bond weakening may play a major role for both Ag crystallite nucleation and growth. Finally, we studied Si crystal defects by metallizing nanocracks, dislocations, and grain boundaries and found that Ag crystallite nucleation is defect‐property dependent. Copyright © 2013 John Wiley & Sons, Ltd.     

Opto‐electrical modelling and optimization study of a novel IBC c‐Si solar cell

Interdigitated back contact (IBC) crystalline silicon (c‐Si) solar cells are attracting a lot of attention because of their capability to reach world record conversion efficiency. Because of the relatively complex contact pattern, their design and optimization typically require advanced numerical simulation tools. In this work, a TCAD‐based simulation platform has been developed to account accurately and in detail the optical and passivation mechanisms of front texturization. Its validation has been carried out with respect to a novel homo‐junction IBC c‐Si solar cell based on ion implantation and epitaxial growth, comparing measured and simulated reflectance, transmittance, internal quantum efficiency, external quantum efficiency spectra, and current density–voltage characteristics. As a result of the calibration process, the opto‐electrical losses of the investigated device have been identified quantitatively and qualitatively. Then, an optimization study about the optimal front surface field (FSF) doping, front‐side texturing morphology, and rear side geometry has been performed. The proposed simulation platform can be potentially deployed to model other solar cell architectures than homo‐junction IBC devices (e.g., passivated emitter rear cell, passivated emitter rear locally diffused cell, hetero‐IBC cell). Simulation results show that a not‐smoothed pyramid‐textured front interface and an optimal FSF doping are mandatory to minimize both the optical and the recombination losses in the considered IBC cell and, consequently, to maximize the conversion efficiency. Similarly, it has been showed that recombination losses are affected more by the doping profile rather than the surface smoothing. Moreover, the performed investigation reveals that the optimal FSF doping is almost independent from the front texturing morphology and FSF passivation quality. According to this result, it has been demonstrated that an IBC cell featuring an optimal FSF doping does not exhibit a significant efficiency improvement when the FSF passivation quality strongly improves, proving that IBC cell designs based on low‐doped FSF require a very outstanding passivation quality to be competitive. Deploying an optimization algorithm, the adoption of an optimized rear side geometry can potentially lead to an efficiency improvement of about 1%_abs as compared with the reference IBC solar cell. Further, by improving both emitter and c‐Si bulk quality, a 22.84% efficient solar cell for 280‐μm thick c‐Si bulk was simulated. Copyright © 2017 John Wiley & Sons, Ltd.     

All‐screen‐printed back‐contact back‐junction silicon solar cells with aluminum‐alloyed emitter and demonstration of interconnection of point‐shaped metalized contacts

In the following, high‐efficiency back‐contact back‐junction silicon solar cells with aluminum‐alloyed emitter are described. First, the theoretical background for the cell concept is explained. To that purpose, the bulk lifetime and the front surface field characteristics are considered. Three different process sequences for the phosphorus‐diffused profiles on the front and back surfaces are depicted: One exhibits a shallow field, and two sequences have deeper, driven‐in profiles. For realizing high efficiencies, such cell structures must meet several prerequisites, such as firing‐stable front and rear passivations, and functional small screen‐printed Al structures. Furthermore, it must be possible to create contacts on the Si surfaces using the driven‐in P‐profiles. With such a structure, cell efficiencies of 20.0% are reached. An analysis of the series resistance and area‐weighted recombination is performed. The results are compared with the measured cell parameters. Two‐dimensional simulations show the efficiency potential when decreasing the width of the backside field and when a cell structure, which would inhibit a passivated aluminum‐alloyed p⁺‐emitter, is created. Also, an advanced concept is demonstrated where a point array of both polarities on the cell backside is interconnected externally on module level. To that purpose, the cell is soldered to a printed wiring circuit board by using a reflow soldering process. Copyright © 2013 John Wiley & Sons, Ltd.     

Screen‐printed Emitter‐Wrap‐Through solar cell with single step side selective emitter with 18.8% efficiency

A fabrication process for Emitter‐Wrap‐Through solar cells on monocrystalline material with high quality gap passivation by wet thermal silicon dioxide is investigated. Masking and structuring steps are performed by screen‐printing technology. Via‐holes are created by an industrially applicable high‐speed laser drilling process. The cell structure features a selective emitter structure fabricated in a single high temperature step: a highly doped emitter at the via‐holes and the rear side, allowing for a low via‐hole resistivity as well as a low resistivity contact to screen‐printed pastes, and a moderately doped front side emitter exhibiting high quantum efficiency in the low wavelength range. Therefore a novel approach is applied depositing either doped or undoped PECVD silicon dioxide layers on the front side. It is shown that doping profiles advantageous for the EWT‐cell structure can be achieved. The screen‐printed aluminum paste is found to penetrate the underlying thermal dioxide layer at appropriate contact firing conditions leading to a zone of high recombination in the overlap region of aluminum and silicon dioxide. It is shown that conventional PECVD‐anti‐reflection silicon nitride acts as effective protection layer reducing the recombination in this region. Designated area conversion efficiencies up to 18.8% on FZ material are obtained applying the single step side selective emitter fabrication technique. Copyright © 2010 John Wiley & Sons, Ltd.     

An optimized rapid aluminum back surface field technique forsilicon solar cells

Screen-printing and rapid thermal annealing have been combined to achieve an aluminum-alloyed back surface field (Al-BSF) that lowers the effective back surface recombination velocity (S_eff) to approximately 200 cm/s for solar cells formed on 2.3 Ω-cm Si. Analysis and characterization of the BSF structures show that this formation process satisfies the two main requirements for achieving low S_eff: (1) deep p⁺ regions and (2) uniform junctions. Screen-printing is ideally suited for fast deposition of thick Al films which, upon alloying, result in deep BSF regions. Use of a rapid alloying treatment is shown to significantly improve the BSF junction uniformity and reduce S_eff. The Al-BSFs formed by screen-printing and rapid alloying have been integrated into both laboratory and industrial-type fabrication sequences to achieve solar cell efficiencies in excess of 19.0 and 17.0%, respectively, on planar 2.3 Ω-cm float zone Si. For both process sequences, these cell efficiencies are 1-2% (absolute) higher than analogous cells made with unoptimized Al-BSFs or highly recombinative rear surfaces     

20.1%‐efficient crystalline silicon solar cell with amorphous silicon rear‐surface passivation

We have developed a crystalline silicon solar cell with amorphous silicon (a‐Si:H) rear‐surface passivation based on a simple process. The a‐Si:H layer is deposited at 225°C by plasma‐enhanced chemical vapor deposition. An aluminum grid is evaporated onto the a‐Si:H‐passivated rear. The base contacts are formed by COSIMA (contact formation to a‐Si:H passivated wafers by means of annealing) when subsequently depositing the front silicon nitride layer at 325°C. The a‐Si:H underneath the aluminum fingers dissolves completely within the aluminum and an ohmic contact to the base is formed. This contacting scheme results in a very low contact resistance of 3.5 ±0.2 mΩ cm² on low‐resistivity (0.5 Ω cm) p‐type silicon, which is below that obtained for conventional Al/Si contacts. We achieve an independently confirmed energy conversion efficiency of 20.1% under one‐sun standard testing conditions for a 4 cm² large cell. Measurements of the internal quantum efficiency show an improved rear surface passivation compared with reference cells with a silicon nitride rear passivation. Copyright © 2005 John Wiley & Sons, Ltd.     

Influence of wafer thickness on the performance of multicrystalline Si solar cells: an experimental study

The influence of the thickness of silicon solar cells has been investigated using neighbouring multicrystalline silicon wafers with thickness ranging from 150 to 325 μm. For silicon solar cell structures with a high minority‐carrier diffusion length one expects that J_sc would decrease as the wafer becomes thinner due to a shorter optical path length. It was found experimentally that J_sc is nearly independent of the thickness of the solar cell, even when the minority‐carrier diffusion length is about 300 μm. This indicates that the Al rear metallisation acts as a good back surface reflector. A decrease in J_sc is observed only if the wafer thickness becomes less than about 200 μm. The observed trend in V_oc as a function of the wafer thickness has been explained with PC1D modelling by a minority‐carrier diffusion length in the Al‐oped BSF which is small in relation to the thickness of the BSF. This effectively increases the recombination velocity at the rear of the cell. We have shown that the efficiency of solar cells made with standard industrial processing is hardly reduced by reducing the wafer thickness. Solar cell efficiencies might be increased by better rear surface passivation. Copyright © 2002 John Wiley & Sons, Ltd.     

Gapless point back surface field for the counter doping of large‐area interdigitated back contact solar cells using a blanket shadow mask implantation process

Gapless interdigitated back contact (IBC) solar cells were fabricated with phosphorous back surface field on a boron emitter, using an ion implantation process. Boron emitter (boron ion implantation) is counter doped by the phosphorus back surface field (BSF) (phosphorus ion implantation) without gap. The gapless process step between the emitter and BSF was compared to existing IBC solar cell with gaps between emitters and BSFs obtained using diffusion processes. We optimized the doping process in the phosphorous BSF and boron emitter region, and the implied V_oc and contact resistance relationship of the phosphorous and boron implantation dose in the counter doped region was analyzed. We confirmed the shunt resistance of the gapless IBC solar cells and the possibility of shunt behavior in gapless IBC solar cells. The highly doped counter doped BSF led to a controlled junction breakdown at high reverse bias voltages of around 7.5 V. After the doping region was optimized with the counter doped BSF and emitter, a large‐area (5 inch pseudo square) gapless IBC solar cell with a power conversion efficiency of 22.9% was made.     

Economic feasibility of bifacial silicon solar cells

Bifacial solar cells and modules are a promising approach to increase the energy output of photovoltaic systems, and therefore decrease levelized cost of electricity (LCOE). This work discusses the bifacial silicon solar cell concepts PERT (passivated emitter, rear totally diffused) and BOSCO (both sides collecting and contacted) in terms of expected module cost and LCOE based on in‐depth numerical device simulation and advanced cost modelling. As references, Al‐BSF (aluminium back‐surface field) and PERC (passivated emitter and rear) cells with local rear‐side contacts are considered. In order to exploit their bifacial potential, PERT structures (representing cells with single‐sided emitter) are shown to require bulk diffusion lengths of more than three times the cell thickness. For the BOSCO concept (representing cells with double‐sided emitter), diffusion lengths of half the cell thickness are sufficient to leverage its bifacial potential. In terms of nominal LCOE, BOSCO cells are shown to be cost‐competitive under monofacial operation compared with an 18% efficient (≙ p_MPP = 18 mW/cm²) multicrystalline silicon (mc‐Si) Al‐BSF cell and a 19% mc‐Si PERC cell for maximum output power densities of p_MPP ≥ 17.3 mW/cm² and p_MPP ≥ 18.1 mW/cm², respectively. These values assume the use of $10/kg silicon feedstock for the BOSCO and $20/kg for the Al‐BSF and PERC cells. For the PERT cell, corresponding values are p_MPP ≥ 21.7 mW/cm² and p_MPP ≥ 22.7 mW/cm², respectively, assuming the current price offset (≈50%, at the time of October 2014) of n‐type Czochralski‐grown silicon (Cz‐Si) compared with mc‐Si wafers. The material price offset of n‐type to p‐type Cz‐Si wafers (≈15%, October 2014) currently accounts for approximately 1 mW/cm², which correlates to a conversion efficiency difference of 1%_abs for monofacial illumination with 1 sun. From p‐type mc‐Si to p‐type Cz‐Si (≈30% wafer price offset, October 2014), this offset is approximately 2.5 mW/cm² for a PERT cell. When utilizing bifacial operation, these required maximum output power densities can be transformed into required minimum rear‐side illumination intensities for arbitrary front‐side efficiencies η_front by means of the performed numerical simulations. For a BOSCO cell with η_front = 18%, minimum rear‐side illumination intensities of ≤ 0.02 suns are required to match a 19% PERC cell in terms of nominal LCOE. For an n‐type Cz‐Si PERT cell with η_front = 21%, corresponding values are ≤ 0.11 suns with 0.05 suns being the n‐type to p‐type material price offset. This work strongly motivates the use of bifacial concepts to generate lowest LCOE. Copyright © 2016 John Wiley & Sons, Ltd.     

Mitigating Plasmonic Absorption Losses at Rear Electrodes in High‐Efficiency Silicon Solar Cells Using Dopant‐Free Contact Stacks

Although charge‐carrier selectivity in conventional crystalline silicon (c‐Si) solar cells is usually realized by doping Si, the presence of dopants imposes inherent performance limitations due to parasitic absorption and carrier recombination. The development of alternative carrier‐selective contacts, using non‐Si electron and hole transport layers, has the potential to overcome such drawbacks and simultaneously reduce the cost and/or simplify the fabrication process of c‐Si solar cells. Nevertheless, devices relying on such non‐Si contacts with power conversion efficiencies (PCEs) that rival their classical counterparts are yet to be demonstrated. In this study, one key element is brought forward toward this demonstration by incorporating low‐pressure chemical vapor deposited ZnO as the electron transport layer in c‐Si solar cells. Placed at the rear of the device, it is found that rather thick (75 nm) ZnO film capped with LiF_x/Al simultaneously enables efficient electron selectivity and suppression of parasitic infrared absorption. Next, these electron‐selective contacts are integrated in c‐Si solar cells with MoO_x‐based hole‐collecting contacts at the device front to realize full‐area dopant‐free‐contact solar cells. In the proof‐of‐concept device, a PCE as high as 21.4% is demonstrated, which is a record for this novel device class and is at the level of conventional industrial solar cells.     

Characteristics of bifacial solar cells under bifacial illumination with various intensity levels

The characteristics of bifacial solar cells with different rear structures were investigated under front, rear and bifacial illumination with an intensity of 0.4–4.2 suns. Five kinds of solar cells, rear flat local‐BSF cells, rear textured local‐BSF cells (textured RLB cells), rear total‐BSF cells, rear floating‐emitter cells, and triode cells with double‐sided junctions, were tested. The I–V characteristics of the cells under bifacial illumination were measured with a newly designed measurement system that simultaneously illuminated both surfaces of the cells. In the short‐circuit current (J_SC) and the saturation current evaluations, the bifacial illumination effect, which means that the power output of the cell is intrinsically improved by adding rear illumination, was not observed. Although the RLB cells showed a nonlinear increase in J_SC and enhanced V_OC, these increases did not make a practical contribution to extra output because of the low levels of these characteristics. When we evaluated the maximum output power, the bifacial illumination effect was only observed in the triode cell. A triode cell can decrease resistive loss by introducing light from both surfaces, compared with a conventional cell with one junction. Copyright © 2001 John Wiley & Sons, Ltd.     

Optimizing annealing steps for crystalline silicon solar cells with screen printed front side metallization and an oxide‐passivated rear surface with local contacts

Silicon solar cells that feature screen printed front contacts and a passivated rear surface with local contacts allow higher efficiencies compared to present industrial solar cells that exhibit a full area rear side metallization. If thermal oxidation is used for the rear surface passivation, the final annealing step in the processing sequence is crucial. On the one hand, this post‐metallization annealing (PMA) step is required for decreasing the surface recombination velocity (SRV) at the aluminum‐coated oxide‐passivated rear surface. On the other hand, PMA can negatively affect the screen printed front side metallization leading to a lower fill factor. This work separately analyzes the impact of PMA on both, the screen printed front metallization and the oxide‐passivated rear surface. Measuring dark and illuminated IV‐curves of standard industrial aluminum back surface field (Al‐BSF) silicon solar cells reveals the impact of PMA on the front metallization, while measuring the effective minority carrier lifetime of symmetric lifetime samples provides information about the rear side SRV. One‐dimensional simulations are used for predicting the cell performance according to the contributions from both, the front metallization and the rear oxide‐passivation for different PMA temperatures and durations. The simulation also includes recombination at the local rear contacts. An optimized PMA process is presented according to the simulations and is experimentally verified. The optimized process is applied to silicon solar cells with a screen printed front side metallization and an oxide‐passivated rear surface. Efficiencies up to 18.1% are achieved on 148.8 cm² Czochralski (Cz) silicon wafers. Copyright © 2009 John Wiley & Sons, Ltd.     

Electrochemical nature of contact firing reactions for screen‐printed silicon solar cells: origin of “gray finger” phenomenon

Fire‐through Ag thick‐film metallization of crystalline Si (c‐Si) solar cells often yields macroscopically non‐uniform contact quality over the cell area, degrading the cell performance and causing cell‐to‐cell variations of the conversion efficiency in a cell production line. This study analyzes the root cause of the “gray finger” phenomenon, in which part of the fire‐through Ag contact gridlines of a c‐Si solar cell appears in gray or dark contrast in the electroluminescence images owing to high contact resistance. Few Ag crystallites were formed on the corrugated emitter surface at the contact interfaces underneath the gray fingers. The present results revealed that the gray finger phenomenon was caused by a short‐circuit spot that formed between the Ag gridlines and underlying Si emitter during contact firing. The electrochemical reactions involved in fire‐through Ag contact formation established a potential difference between the sintered Ag gridlines and Si emitter separated by molten glass. The molten glass acted as an electrolyte containing mobile Ag⁺ and O²⁻ ions during contact firing. Therefore, the short‐circuiting between the sintered Ag gridlines and Si emitter produced a galvanic cell during contact firing, which inhibited Ag crystallite formation at the contact interface along the gridlines in a short circuit and produced the gray fingers. The firing reactions in Ag thick‐film contact formation could be interpreted in terms of the mixed potential theory of corrosion. The degradation of cell performance because of the gray finger phenomenon was also evaluated for 6‐in. screen‐printed c‐Si solar cells. Copyright © 2016 John Wiley & Sons, Ltd.     

High efficiency screen printed bifacial solar cells on monocrystalline CZ silicon

We present industrialized bifacial solar cells on large area (149 cm²) 2 cm CZ monocrystalline silicon wafers processed with industrially relevant techniques such as liquid source BBr₃ and POCl₃ open‐tube furnace diffusions, plasma enhanced chemical vapor deposition (PECVD) SiN_x deposition, and screen printed contacts. The fundamental analysis of the paste using at boron‐diffused surface and the bifacial solar cell firing cycle has been investigated. The resulting solar cells have front and rear efficiencies of 16.6 and 12.8%, respectively. The ratio of the rear J_SC to front J_SC is 76.8%. It increases the bifacial power by 15.4% over a conventional solar cell at 20% of 1‐sun rear illumination, which equals to the power of a conventional solar cell with 19.2% efficiency. We also present a bifacial glass–glass photovoltaic (PV) module with 30 bifacial cells with the electrical characteristics. Copyright © 2010 John Wiley & Sons, Ltd.     

Broadband scattering of the solar spectrum by spherical metal nanoparticles

Metal nanoparticles offer the possibility of improved light trapping in solar cells, but careful design is required to maximise scattering and minimise parasitic absorption across the wavelength range of interest. We present an analysis of the broadband scattering and absorption characteristics of spherical metal nanoparticles, optimized for either crystalline silicon (c‐Si) or amorphous silicon (a‐Si:H) solar cells. A random two‐dimensional array of optimally sized Ag spheres can scatter over 97% of the AM1.5 spectrum from 400 to 1100 nm. Larger particles are required for c‐Si devices than a‐Si:H due to the increased spectral range, with optimum particle sizes ranging from 60 nm for a‐Si:H to 116 nm for c‐Si. Positioning the particles at the rear of the solar cell decreases absorption losses because these principally occur at short wavelengths. Increasing the refractive index of the surrounding medium beyond the optimum value, which is 1.0 for a‐Si:H and 1.6 for c‐Si, shifts absorption to longer wavelengths and decreases scattering at short wavelengths. Ag nanoparticles scatter more of the solar spectrum than Au, Cu or Al nanoparticles. Of these other metals, Al can only be considered for a‐Si:H applications due to high absorption in the near‐infrared, whereas Au and Cu can only be considered for the rear of c‐Si devices due to high absorption in the ultraviolet (UV) and visible. In general, we demonstrate the importance of considering the broadband optical properties of metal nanoparticles for photovoltaic applications. Copyright © 2012 John Wiley & Sons, Ltd.     

Bulk resistivity optimization for low‐bulk‐lifetime silicon solar cells

Guidelines are presented which are designed to achieve planar solar cell efficiencies as high as 17.5% using existing fabrication technologies and silicon substrates with lifetimes as low as 20 μs. Device simulations are performed to elucidate the need and impact of base doping optimization for different back‐surface passivation schemes, cell thicknesses, emitter profiles, and degrees of dopant–defect interaction. Results indicate that optimal resistivity is a function of back‐surface passivation, with the aluminum back‐surface field (BSF) requiring the highest resistivity, the oxide/nitride stack passivation excelling at an intermediate resistivity, and the ohmic contact needing the lowest resistivity. A comparison of simulated 300 and 100 μm cells shows that thinner cells magnify the differences in optimal resistivity for the three back‐surface passivation schemes. A lifetime model is used to account for dopant–defect interaction that can lower bulk lifetime at higher doping levels. It is demonstrated that cell efficiency decreases and optimal resistivity increases at higher levels of dopant–defect interaction. Simulated devices with an optimized base doping showed an efficiency improvement of as much as 2% (absolute) compared with identical devices with a typical base doping level (1.6 or 1.8 Ω cm) and bulk lifetime of 20 μs. Copyright © 2001 John Wiley & Sons, Ltd.     

Development of high‐efficiency large‐area screen‐printed solar cells on direct kerfless epitaxially grown monocrystalline Si wafer and structure

This paper demonstrates the potential of epitaxially grown Si wafers with doped layers for high‐efficiency solar cells. Boron‐doped 239 cm² 180–200 µm thick 2 Ω‐cm wafers were grown with and without 15 µm thick p⁺ layer, with a doping in the range of 10¹⁷~10¹⁸ cm⁻³. A layer transfer process involving porous Si layer to lift off epi‐Si wafers from the reusable substrate was used. The pp⁺ wafers were converted into n⁺pp⁺ passivated emitter rear totally diffused (PERT) cells by forming an oxide‐passivated POCl₃‐diffused n⁺ emitter at the front, and oxide/nitride‐passivated epitaxially grown p⁺ BSF at the entire back, with local screen‐printed contacts. To demonstrate and quantify the benefit of the epi‐grown p⁺ layer, standard passivated emitter and rear cells (PERCs) with local BSF and contacts were also fabricated on p‐type epi‐Si wafers as well on commercial‐grade Cz wafers. Sentaurus 2D device model was used to assess the impact of the epi‐grown p⁺ layer, which showed an efficiency gain of ~0.5% for this PERT structure over the traditional PERC. This was validated by the cell results, which showed an efficiency of ~20.1% for the PERC, and ~20.3% for the PERT cell using epi‐Si wafers. Experimental data showed higher FF in PERT cells, largely because of the decrease in lateral resistance on the rear side. Efficiency gain, a result of higher FF, was greater than the recombination loss in the p⁺ layer because of the lightly doped thick p⁺ epi‐grown region used in this study. Copyright © 2016 John Wiley & Sons, Ltd.     

Bifacial concentrator Ag‐free crystalline n‐type Si solar cell

We report results obtained using an innovative approach for the fabrication of bifacial low‐concentrator thin Ag‐free n‐type Cz‐Si (Czochralski silicon) solar cells based on an indium tin oxide/(p⁺nn⁺)Cz‐Si/indium fluorine oxide structure. The (p⁺nn⁺)Cz‐Si structure was produced by boron and phosphorus diffusion from B‐ and P‐containing glasses deposited on the opposite sides of n‐type Cz‐Si wafers, followed by an etch‐back step. Transparent conducting oxide (TCO) films, acting as antireflection electrodes, were deposited by ultrasonic spray pyrolysis on both sides. A copper wire contact pattern was attached by low‐temperature (160°C) lamination simultaneously to the front and rear transparent conducting oxide layers as well as to the interconnecting ribbons located outside the structure. The shadowing from the contacts was ~4%. The resulting solar cells, 25 × 25 mm² in dimensions, showed front/rear efficiencies of 17.6–17.9%/16.7–17.0%, respectively, at one to three suns (bifaciality of ~95%). Even at one‐sun front illumination and 20–50% one‐sun rear illumination, such a cell will generate energy approaching that produced by a monofacial solar cell of 21–26% efficiency. Copyright © 2014 John Wiley & Sons, Ltd.