| 金属互连结构的电迁移仿真分析 |
| |
| 引用本文： | 邓登,崔海坡.金属互连结构的电迁移仿真分析[J].焊接学报,2015,36(1):75-78. |
| |
| 作者姓名： | 邓登 崔海坡 |
| |
| 作者单位： | 上海理工大学教育部微创医疗器械工程中心, 上海 200093 |
| |
| 基金项目： | 国家自然科学基金资助项目(51305268);航空科学基金资助项目(20110247001) |
| |
| 摘 要： | 针对集成电路中金属互连线的电迁移现象,应用有限元分析软件ABAQUS,对铝硅合金互连线的电迁移过程进行了电热耦合研究,分析了不同电流密度与电势梯度、热通量、互连线内部总能量之间的相互关系,比较了不同结构尺寸对铝互连线电迁移失效的影响规律.结果表明,在互连线的狭窄部位,电势梯度和热通量达到最大值并具有集中性;电势梯度和热通量与通电时间及电流密度均成正比例关系;随着通电时间的延长,互连线内部总能量的变化趋势为先急剧下降再上升并达到某一平衡值;随着铝互连线宽度的增加,互连线内部的热通量逐渐减小.对于文中分析的结构模型,当互连线宽度低于2μm后,互连线失效的概率将大幅度增加.
|
| 关 键 词： | 电迁移 互连线 电热耦合 电流密度 |
| 收稿时间： | 2013/7/8 0:00:00 |
Electromigration simulation analysis of metal interconnects |
| |
| DENG Deng and CUI Haipo.Electromigration simulation analysis of metal interconnects[J].Transactions of The China Welding Institution,2015,36(1):75-78. |
| |
| Authors: | DENG Deng and CUI Haipo |
| |
| Affiliation: | Shanghai Institute for Minimal Invasive Therapy, University of Shanghai for Science and Technology, Shanghai 200093, China |
| |
| Abstract: | In accordance with the electromigration of alloy interconnect in integrated circuits, the electric-thermal coupling analysis was performed for the electromigration process of Al-Si alloy interconnect with finite element analysis software ABAQUS. The relationship of the current density with the potential gradient, heat flux, and the total energy of interconnect was analyzed. The influence rule of the different dimensions on the electromigration failure of Al-Si interconnect was researched. The results indicated that both the maximums of potential gradient and heat flux concentrate on the narrow position of the interconnect. With the increasing current density and testing time, the potential gradient and heat flux increases. The changing trend of the total energy of interconnect sharp by drops firstly, and then rises to an equilibrium value with the time increases. The heat flux decreases with the width of interconnect increasing. If the width of interconnect is lower than 2μm, the failure possibility will increase dramatically for the SWEAT model in this paper. |
| |
| Keywords: | electromigration interconnect electric-thermal coupling current density |
| 本文献已被 CNKI 等数据库收录！ |
| 点击此处可从《焊接学报》浏览原始摘要信息 |
|
点击此处可从《焊接学报》下载全文 |
|
