| 金属互连线电迁移的影响因素 |
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| 引用本文： | 崔海坡,刘晓杰,邓 登.金属互连线电迁移的影响因素[J].焊接学报,2018,39(5):29-32. |
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| 作者姓名： | 崔海坡 刘晓杰 邓 登 |
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| 作者单位： | 上海理工大学教育部微创医疗器械工程中心 |
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| 摘 要： | 应用有限元分析软件ABAQUS，对金属互连线的电迁移过程进行了电热耦合仿真分析，比较了不同互连线材料、不同温度、不同层间介质等因素对互连线电迁移失效的影响. 结果表明，与铝硅合金互连线相比，在同样电流密度条件下，无论是电势梯度最大值还是热通量最大值，铜互连线的均高于铝互连线的，从而将加速互连线的电迁移；在一定的温度范围内，电流密度是影响互连线电迁移寿命的主要因素，而温度的变化对其影响较小；与SiO2相比，SiN作为层间介质能够防止互连线中的热聚集，有利于互连线热量的散发，从而对于缓解电迁移具有积极的作用.
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| 关 键 词： | 电迁移 影响因素 电热耦合 互连线 |
| 收稿时间： | 2016/12/8 0:00:00 |
Influence factors for electromigration of metal interconnects |
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| CUI Haipo,LIU Xiaojie,DENG Deng.Influence factors for electromigration of metal interconnects[J].Transactions of The China Welding Institution,2018,39(5):29-32. |
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| Authors: | CUI Haipo LIU Xiaojie DENG Deng |
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| Abstract: | The electric-thermal coupling simulation analysis was performed for the electromigration process of metal interconnects based on the ABAQUS software. The influences of the different factors, including interconnects material, temperature and dielectric layer, on the electromigration failure of interconnects were compared. The results indicated that, comparison with the Al-Si alloy interconnects, the maximum value of both potential gradient and heat flux of Cu interconnects are higher for the same current density, which will accelerate the electromigration of interconnects. Comparison with temperature, current density is the major factor for influencing the electromigration lifetime of interconnects in a certain temperature range. As the insulating layer, SiN favors the heat dissipation of interconnects comparison with SiO2, which can relieve the electromigration failure of interconnects. |
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| Keywords: | electromigration influence factor electric-thermal coupling interconnect |
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