| 电铸nano-Al2O3 / Cu 复合材料的组织与性能 |
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| 引用本文： | 朱建华,刘磊,赵海军,沈彬,胡文彬.电铸nano-Al2O3 / Cu 复合材料的组织与性能[J].复合材料学报,2006,23(4):65-71. |
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| 作者姓名： | 朱建华 刘磊 赵海军 沈彬 胡文彬 |
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| 作者单位： | 电铸nano-Al2O3 / Cu 复合材料的组织与性能 |
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| 基金项目： | 国家自然科学基金（50401004）;国家高科技研究发展计划（2002AA334010）;上海市科委重点新材料重点项目（035211037） |
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| 摘 要： | 采用复合电铸工艺, 在硫酸铜镀液中加入纳米氧化铝颗粒制备了纳米颗粒弥散增强铜基复合材料, 利用扫描电镜、电子透镜对复合材料的表面、拉伸断面和摩擦磨损表面的形貌以及微观组织进行了观察, 并对显微硬度、拉伸性能、磨损性能及电阻率进行了研究。结果显示, 氧化铝颗粒及其团聚体以纳米级尺寸弥散分布在铜基体中, 且与铜基体结合良好。复合材料的硬度最大增幅达42 %。氧化铝颗粒含量在1. 26 %时, 复合材料的拉伸强度和延伸率分别高达385 MPa 、26 %。相对电铸纯铜, 复合材料的耐磨性能明显提高, 而复合材料的电阻率最大增幅小于6 %。
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| 关 键 词： | 复合电铸 纳米氧化铝颗粒 铜基复合材料 微观组织 性能 |
| 文章编号： | 1000-3851（2006）04-0065-07 |
| 收稿时间： | 09 19 2005 12:00AM |
| 修稿时间： | 2005-09-192006-01-09 |
Microstructure and property of electroformed nano-Al2O3 / Cu composite |
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| ZHU Jianhua,LIU Lei,ZHAO Haijun,SHEN Bin,HU Wenbin.Microstructure and property of electroformed nano-Al2O3 / Cu composite[J].Acta Materiae Compositae Sinica,2006,23(4):65-71. |
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| Authors: | ZHU Jianhua LIU Lei ZHAO Haijun SHEN Bin HU Wenbin |
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| Affiliation: | State Key Laboratory of Metal Mat rix Composites| Shanghai Jiao Tong University| Shanghai 200030| China |
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| Abstract: | The composite elect roforming technology was employed to fabricate nano-sized alumina particles (nano-Al2O3 ) reinforced copper composite in copper sulfate sulfuric acid plating solution. The surface , f racture and wearsurface morphologies were observed by scanning elect ron microscopy (SEM) , and the microst ructure was observedby t ransmission elect ron microscopy ( TEM) . Microhardness , tensile property , wear resistance and elect rical resistivity ( Er ) were examined. The result s show that Al2O3 particles and their agglomerations with nano size disperse inthe copper mat rix and have good bonding with copper mat rix. The microhardness of composite can be 42 % higherthan that of elect roformed pure copper. The tensile st rength and the extensibility reach 385 MPa and 26 % , respectively , as the nano-Al2O3 mass f raction is 1. 26 %. Wear resistance of composite is enhanced obviously. Comparedwith elect roformed pure copper , the increase amplitude in elect rical resistivity of the composite is below 6 %. |
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| Keywords: | composite electroforming nano-Al2O3 copper matrix composite microstructure property |
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