| MEMS F-P 干涉型压力传感器 |
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| 引用本文： | 江小峰,林春,谢海鹤,黄元庆,颜黄苹.MEMS F-P 干涉型压力传感器[J].红外与激光工程,2014,43(7):2257-2262. |
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| 作者姓名： | 江小峰 林春 谢海鹤 黄元庆 颜黄苹 |
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| 作者单位： | 1.厦门大学物理机电学院,福建厦门 361005 |
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| 基金项目： | 福建省自然科学基金(2013J01251) |
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| 摘 要： | 为了满足工业、航天、国防等领域对微型化压力传感器的需求，提出了基于微机电系统（MEMS，Micro electromechanical System）技术制作的非本征型光纤法布里-珀罗（F-P）压力传感器，该传感器传感头由全玻璃材料构成。主要研究了MEMS 技术制作全玻璃结构式压力传感器工艺，结合溅射、光刻、腐蚀等工艺在7 740 wafer 基底上制作出F-P 腔体，利用低压化学气相沉积（LPCVD）的方法在基底上沉积一层40 nm 的非晶硅作为中间层。通过阳极键合技术在温度400℃下完成玻璃与玻璃的键合，并搭建了该传感器的压力测量平台。实验结果表明:在压力线性范围0~400 kPa 内传感器具有很高的重复性，达到0.3%。灵敏度达到1.764 nm/kPa；在传感器使用范围0~80℃内，热敏感系数为 0.15 nm/℃。该传感器的研究对设计制作改善了该类传感器的热膨胀失配问题，对低温漂型压力传感器的研究有一定参考价值。
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| 关 键 词： | 光纤传感器 MEMS 全玻璃材料 F-P 腔制作 |
| 收稿时间： | 2013-11-20 |
MEMS F-P interferometry pressure sensor |
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| Affiliation: | 1.School of Physics and Mechanical & Electrical Engineering,Xiamen University,Xiamen 361005,China |
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| Abstract: | In order to meet the requirements of industry, aerospace and defense for miniature pressure sensors, an optical F-P interferometry pressure sensor which was made from all-glass material was presented, the sensor head of which was made from all-glass material. The processing steps of MEMS craft for fabrication of the all-glass optical pressure sensor were studied mainly, F-P cavity was made on 7 740 wafer based on sputtering, photolithography and etching technology, a 40 nm thick amorphous silicon layer deposited by low-pressure chemical vapor deposition (LPCVD) on this wafer was used as an intermediate layer. Then glass-to-glass anodic bonding was finished under the temperature of 380. Finally, the pressure measurement system was established. The experiment result shows that a high repeatability in the range of 0-400 kPa pressure and a reasonable sensitivity of 1.764 nm/kPa have been obtained in this pressure sensor. The temperature-sensitivity coefficient of the sensor was about 0.15 nm/℃ in the range of 0-80℃. The study of the pressure sensor would be of utility value for design and fabrication of low temperature drift typed pressure sensor. |
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