| 选区顺序对激光直接制造TC4残余应力及变形的影响 |
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| 引用本文： | 严惠,王霄,梁绘昕,田宗军,谢德巧,徐国建.选区顺序对激光直接制造TC4残余应力及变形的影响[J].红外与激光工程,2019,48(2):242002-0242002(8). |
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| 作者姓名： | 严惠 王霄 梁绘昕 田宗军 谢德巧 徐国建 |
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| 作者单位： | 1.南京航空航天大学 机电学院,江苏 南京 210016; |
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| 基金项目： | 江苏省科技支撑计划重点项目（BE2014009-1）;江苏省重点研发计划（BE2016010-3）;江苏省重点研发项目（BE2015161）;国家自然科学基金（51475238）;国家重点研发计划（2016YB1100500） |
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| 摘 要： | 为降低激光直接制造大型TC4构件的基底变形及残余应力，研究了不同选区顺序对分区扫描成形时基底变形及残余应力的影响。分别采用新定义的由外而内、由内而外选区顺序及常规的随机选区顺序进行沉积实验，并运用面结构光及X射线衍射检测方法对基底变形及沉积层残余应力进行测量。结果表明:不同选区顺序对成形件基底变形及残余应力影响显著，采用由外而内选区顺序可大幅减小基底变形，与随机选区顺序相比，基底最大变形量降低60%，但是在沉积层引入了较大的残余应力，最大残余应力达到了392 MPa；随机选区顺序下沉积层残余应力量级较小，最大残余应力仅约93 MPa，残余应力分布更为均匀。因此，分别采用由外而内及随机选区顺序进行前后期成形有利于减小和平衡大尺寸TC4成形件基底变形及残余应力。
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| 关 键 词： | 激光直接制造 分区扫描策略 选区顺序 变形 残余应力 |
| 收稿时间： | 2018-09-11 |
Influence of scanning order on residual stress and deformation in laser direct manufacturing of TC4 |
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| Affiliation: | 1.College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.Nanjing Zhongke Raycham Laser Technology Co.,ltd,Nanjing 210038,China |
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| Abstract: | In order to reduce the substrate deformation and residual stress during laser direct manufacturing of TC4 components, the influence of different scanning orders on the deformation and residual stress of the parts formed by subarea scanning strategy were studied. The newly-defined outside-in and inside-out scanning orders, and a randomized scanning order were applied and compared. The deformation was measured by the surface structure light measurement system and the residual stress was measured by the X-ray diffraction method. The results show that different scanning orders have significant effects on the deformation and residual stress. The maximum substrate deformation is reduced by 60% by the outside-in scanning order compared with that by the randomized scanning order, while larger residual stress is introduced, which is even up to 392 MPa. Oppositely, the randomized scanning order makes a more uniform residual stress distribution and the maximum residual stress is only 93 MPa. Therefore, it is beneficial to balance the substrate deformation and residual stress of large TC4 forming parts by applying the outside-in and randomized scanning orders in the front and back forming period respectively. |
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