Based on the packaging features of InSb IR detector,orthogonal experiment is designed for studying the parameters such as substrate bending,vacuuming time of adhesive,preparing time of adhesive and solidify condition,which can influence the electrical properties and reliability of InSb chip during die bonding processing.Range and variance is calculated to evaluate the influence level of the parameters on InSb chip.The results show that the solidify condition has the greatest influence on the electrical performance of the InSb chip after bonding,followed by the preparing time of adhesive,while the vacuuming time of adhesive and the flatness of the substrate have relatively little influence.According to the optimal combination and poor combination of parameters,the stress in InSb chip caused by different combination is investigated with XRD,and the results were consistent with the orthogonal experiment.